LCMXO2280E-4FTN256I

The LCMXO2280E-4FTN256I is a MachXO family Field Programmable Gate Array (FPGA) optimized for glue logic, bus bridging and general control tasks. It combines non-volatile configuration, on-chip RAM and a high I/O-to-logic density architecture to deliver a compact, single-chip programmable solution for industrial applications.

Designed for instant-on operation and flexible in-field updates, this device is aimed at system designers who need reliable, reprogrammable logic with a high pin count and industrial temperature support.

Key Features

• Logic Capacity — 2,280 logic elements (LUT-based architecture) for implementing glue logic, state machines and interface bridging.
• On-Chip Memory — Total on-chip RAM of 28,262 bits to support distributed and embedded memory needs within the design.
• I/O — 211 user I/O pins to support high pin-count interfaces and multiple concurrent signal domains.
• Non‑volatile, Reconfigurable Architecture — MachXO family features such as instant-on, single-chip non-volatile configuration and in-field reconfiguration through background programming.
• Power and Supply — Core voltage supply specified at 1.14 V to 1.26 V for device operation.
• Package and Mounting — 256-ball LBGA package (supplier device package: 256-FTBGA, 17×17 mm) with surface-mount mounting for compact board integration.
• Temperature and Grade — Industrial grade device with operating temperature range from −40 °C to 100 °C.
• Compliance — RoHS compliant packaging.

Typical Applications

• Glue Logic and System Glue — Implement address decoding, bus steering and custom control functions to reduce discrete logic and simplify PCB designs.
• Bus Bridging and Interface Adaptation — Act as a bridge between disparate buses and signal standards using available I/O density and on-chip logic.
• Power‑up and System Control — Manage power sequencing, reset distribution and supervisory control with non-volatile, instant-on behavior.
• General Control Logic — Replace fixed-function CPLDs with a reprogrammable device for state machines, timing control and system management tasks.

Unique Advantages

• Single‑chip, non‑volatile configuration: Eliminates external configuration memory and enables instant-on operation for faster system boot.
• In‑field reconfiguration: Supports background programming and reconfiguration capabilities to update logic without removing the device from the system.
• High I/O-to-logic density: 211 I/Os combined with 2,280 logic elements allow flexible interfacing while keeping board real estate minimal.
• Industrial temperature support: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
• Compact BGA package: 256-ball FTBGA (17×17 mm) provides a high-pin-count solution in a compact, surface-mount form factor.
• RoHS compliant: Meets lead-free requirements for environmentally conscious designs.

Why Choose LCMXO2280E-4FTN256I?

This MachXO device delivers a balanced combination of non-volatile configuration, on-chip memory and a high I/O count in a compact BGA package, making it well suited for industrial control, interface bridging and board-level glue logic where fast startup and field reprogrammability are important. Its industrial temperature rating and RoHS compliance support deployment in robust systems.

Designers seeking a single-chip programmable solution that reduces external components and supports in-field updates will find the LCMXO2280E-4FTN256I a practical choice for cost- and space-sensitive applications.

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