LCMXO2280E-4FTN324I

The LCMXO2280E-4FTN324I is a non-volatile MachXO family FPGA designed for glue logic, bus bridging, interface control and general-purpose system control. It combines a LUT-based logic fabric with on-chip memory and a high I/O count to address board-level glue, control, and bridging functions in industrial designs.

This device provides 2,280 logic elements, 271 I/Os and 28,262 bits of on-chip RAM, packaged in a 324-ball LBGA (324-FTBGA, 19×19 mm) surface-mount package. The part supports industrial temperature operation (−40°C to 100°C) and low-voltage core operation (1.14 V to 1.26 V).

Key Features

• Non-volatile, instant-on operation  Single-chip non-volatile architecture allows the device to power up rapidly without external configuration memory and supports background programming of non-volatile memory.
• Reconfiguration and field updates  Supports in-field logic updates and rapid reconfiguration through JTAG and TransFR™ reconfiguration for on-the-fly changes while the system operates.
• Logic capacity  2,280 logic elements (LUT4-style fabric) for implementing glue logic, state machines and protocol bridging.
• On-chip memory  Total on-chip RAM: 28,262 bits (approximately 27.6 Kbits) combining embedded block RAM and distributed RAM resources for FIFOs, buffers and small data stores.
• High I/O density  Up to 271 I/Os in the 324-ball LBGA package to support wide external interfacing and signal routing.
• Flexible I/O standards  Programmable I/O buffers support a wide range of interfaces (examples listed in family datasheet include LVCMOS levels, LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS).
• Clocking and timing  Family-level support includes up to two analog PLLs (sysCLOCK™) for clock multiplication, division and phase shifting.
• Low-power modes  Sleep mode provides significant static current reduction for power-sensitive applications.
• Industrial temperature and RoHS compliance  Rated for −40°C to 100°C operation and RoHS-compliant packaging for industrial deployments.
• Package and mounting  324-LBGA (324-FTBGA, 19×19 mm) surface-mount package suited for compact board designs with high pin counts.

Typical Applications

• Glue Logic and Board-Level Integration  Replace discrete glue logic with programmable fabric to consolidate control functions and reduce BOM complexity.
• Bus Bridging and Protocol Conversion  Implement bus interfacing and bridging where multiple standards or signal translations are required between subsystems.
• Power-Up and System Control  Handle power sequencing, reset control and system monitoring using non-volatile instant-on logic and reconfigurable state machines.
• Interface Concentration  Aggregate and route multiple peripheral signals with the device’s high I/O count and flexible buffer standards.

Unique Advantages

• Instant-on non-volatile architecture: Reduces system start-up time and eliminates the need for external configuration memory.
• High I/O capacity: 271 I/Os in a 324-LBGA package enable dense external connectivity and flexible pin assignments.
• Compact, high-density logic: 2,280 logic elements provide substantial on-chip logic for glue and control applications without large form-factor devices.
• On-chip RAM for buffering and control: 28,262 bits of embedded and distributed RAM support FIFOs, small data stores and control state.
• Industrial temperature capability: Rated for −40°C to 100°C operation to meet a wide range of environmental requirements.
• Design and in-field flexibility: Support for background programming and TransFR reconfiguration allows updates and iteration after deployment.

Why Choose LCMXO2280E-4FTN324I?

The LCMXO2280E-4FTN324I is positioned for designers who need a compact, non-volatile FPGA that combines instant-on behavior, a high I/O count and substantial on-chip logic and memory for glue logic, interface bridging and system control. Its industrial temperature rating, programmable I/O flexibility and support for in-field reconfiguration make it suitable for long-lived embedded systems and industrial applications.

Backed by MachXO family capabilities and available design tool support noted in the family datasheet, this device is a practical choice for teams looking to consolidate discrete logic, simplify board-level interfacing and enable future updates without redesigning hardware.

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