LCMXO2280E-4FT256C

The LCMXO2280E-4FT256C is a MachXO family FPGA optimized for glue logic, bus interfacing and system control applications. It combines non-volatile configuration, reconfigurable SRAM logic and a compact 256-ball BGA package to deliver instant-on, single-chip programmable logic with 2,280 logic elements and up to 211 I/Os.

Designed for commercial-grade embedded systems, the device targets applications that require on-chip memory, flexible I/O standards, and field reconfiguration while operating in standard commercial temperature and voltage ranges.

Key Features

• Core Logic  2,280 logic elements for implementing glue logic, control paths and bus bridging functions.
• On-chip Memory  Approximately 28,262 bits of on-chip RAM provided as embedded and distributed memory for FIFOs, buffers and small data stores.
• I/O Density  211 user I/Os to support dense peripheral connectivity and multi‑bus interfaces in a single device.
• Non-volatile, Instant-on Architecture  Single-chip, non-volatile configuration enables instant-on operation without external configuration memory and supports in-field reconfiguration.
• Flexible I/O Buffer  sysIO programmable buffers support a wide range of interface standards (including multiple LVCMOS levels, LVTTL, PCI, LVDS and others) for adaptable board-level interfacing.
• Reconfiguration and Programming  Supports background programming and JTAG-based programming; TransFR™ reconfiguration enables in-field logic updates while the system continues to operate.
• Power and Low-Power Modes  Sleep mode enables significant static current reduction; core supply specified from 1.14 V to 1.26 V to match system power rails.
• Clocking  Up to two analog PLLs available for clock multiply, divide and phase shifting when required by the design.
• Package and Mounting  256-ball LBGA (supplier package: 256-FTBGA, 17×17 mm) in a surface-mount package for compact board integration.
• Commercial Grade and Environmental  Commercial operating temperature range of 0 °C to 85 °C and RoHS-compliant packaging.

Typical Applications

• Glue Logic and Board-Level Control  Replace discrete glue logic with a single reprogrammable device to reduce BOM and consolidate control functions.
• Bus Bridging and Interfacing  Implement protocol adaptation and bus bridging with high I/O counts and flexible I/O standards.
• Power-Up and System Sequencing  Use instant-on configuration and on-chip control logic for reliable system power-up sequencing and supervisory functions.
• Field-Updatable Control Logic  In-field TransFR reconfiguration enables logic updates and feature additions without removing the device from the system.

Unique Advantages

• Single-Chip Non-Volatile Solution:  Instant-on operation with no external configuration memory simplifies board design and improves security by eliminating external bitstreams.
• High I/O-to-Logic Density:  211 I/Os paired with 2,280 logic elements allow complex interface logic and control functions to coexist on one device.
• Flexible Interface Support:  Programmable sysIO buffers support multiple signaling standards, enabling reuse across projects with different interface requirements.
• Field Reconfiguration:  Background programming and TransFR reconfiguration let you update designs in the field with minimal system disruption.
• Compact, Surface-Mount Package:  256-ball LBGA (256-FTBGA, 17×17 mm) delivers a high pin count in a compact footprint for space-constrained boards.
• Commercial Operating Range:  Specified for 0 °C to 85 °C and RoHS-compliant packaging for mainstream embedded applications.

Why Choose LCMXO2280E-4FT256C?

The LCMXO2280E-4FT256C positions itself as a versatile, non-volatile programmable logic device for commercial embedded systems that need instant-on behavior, in-field reconfigurability, and a high I/O count. With 2,280 logic elements, approximately 28,262 bits of on-chip RAM, and flexible I/O support, it is well suited for consolidating board-level control, bus interfacing and sequencing functions into a single component.

Supported by MachXO family capabilities such as sleep mode, background programming, and PLL-based clocking, this device is appropriate for designers seeking to reduce BOM complexity while retaining the ability to update logic in the field. The commercial-grade temperature range and compact 256-ball BGA package make it appropriate for a wide range of mainstream embedded products.

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