LCMXO2280E-4BN256I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,442 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA, CSPBGA | Number of I/O | 211 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280E-4BN256I – MachXO Field Programmable Gate Array (FPGA)
The LCMXO2280E-4BN256I is a MachXO family FPGA offering 2,280 logic elements in a non-volatile, instant-on architecture designed for control, glue-logic and interface applications. It combines on-chip RAM, flexible I/O and reconfiguration capabilities in a single 256-ball BGA package for compact, industrial-grade designs.
This device targets system control and interfacing roles where fast power-up, dedicated I/O capacity and in-field reconfiguration are important. Key value propositions include single-chip non-volatile configuration, a high I/O count and industry temperature range for reliable operation in industrial environments.
Key Features
- Logic Capacity — 2,280 logic elements suitable for glue logic, bus bridging and control functions.
- On-chip Memory — 28,262 total RAM bits (approx. 27.6 Kbits) of embedded and distributed memory for FIFOs, state storage and small buffers.
- I/O Density — 211 I/Os in the 256-ball package to support wide GPIO and peripheral interfacing requirements.
- Non‑volatile, Instant‑On — Single-chip non-volatile configuration with fast power-up; no external configuration memory required.
- Reconfiguration Options — SRAM and non‑volatile memory programmable through JTAG, background programming support and TransFR™ in-field reconfiguration for live updates.
- Flexible I/O Buffering — Programmable sysIO™ buffer supports a wide range of interfaces documented for the MachXO family (multiple LVCMOS levels, LVTTL and differential options).
- Clocking — Family supports up to two analog PLLs for clock multiply/divide and phase shifting.
- Power and Low‑Power Modes — Core supply range 1.14 V to 1.26 V and a Sleep Mode that can reduce static current by up to 100×.
- Package & Mounting — 256-LFBGA / CSPBGA (supplier package: 256-CABGA 14×14 mm), surface-mount package suitable for compact board layouts.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C.
- Standards & Programming — IEEE 1149.1 boundary-scan and IEEE 1532 compliant in-system programming supported by the MachXO family documentation.
- RoHS Compliant — Device meets RoHS environmental requirements.
Typical Applications
- Glue Logic and Board-Level Control — Implement address decoding, bus arbitration and simple state machines using the device’s 2,280 logic elements and on-chip RAM.
- Bus Bridging and Interfacing — Use the 211 I/Os and flexible sysIO buffering to bridge and condition signals between different voltage domains and interfaces.
- Power-Up and Reset Control — Instant-on non-volatile configuration and low-power Sleep Mode make it well suited for power sequencing and supervisory functions.
- Field-Updatable Control Logic — TransFR™ reconfiguration and JTAG-programmable non-volatile memory enable in-field updates without external configuration memory.
Unique Advantages
- Single‑Chip Non‑Volatile Configuration: Eliminates the need for external configuration memory and enables microsecond-scale power-up.
- High I/O to Logic Ratio: 211 I/Os paired with 2,280 logic elements simplifies designs that require many external connections alongside moderate logic density.
- In-Field Reconfiguration: Background programming and TransFR™ support allow updates with minimal system disruption.
- Low-Power Options: Sleep Mode provides significant static current reduction for energy-sensitive systems.
- Compact, Surface-Mount Packaging: 256-ball BGA (14×14 mm supplier package) enables high-density PCB designs while maintaining routing flexibility.
- Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in industrial environments.
Why Choose LCMXO2280E-4BN256I?
This MachXO device delivers a balanced mix of non-volatile instant-on operation, substantial I/O capacity and on-chip memory—packaged for compact, industrial use. Its reconfiguration features and support for in-system programming make it a practical choice for designs that require field updates and secure configuration without external memory.
Engineers building board-level control, interfacing or power-management logic will find the LCMXO2280E-4BN256I suitable for applications that benefit from rapid startup, flexible I/O and the MachXO family’s toolchain support for implementation and timing verification.
Request a quote or submit an inquiry to receive pricing and lead-time information for the LCMXO2280E-4BN256I.