LCMXO2280E-4BN256I

IC FPGA 211 I/O 256CABGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LFBGA, CSPBGA

Quantity 1,442 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGA, CSPBGANumber of I/O211Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280E-4BN256I – MachXO Field Programmable Gate Array (FPGA)

The LCMXO2280E-4BN256I is a MachXO family FPGA offering 2,280 logic elements in a non-volatile, instant-on architecture designed for control, glue-logic and interface applications. It combines on-chip RAM, flexible I/O and reconfiguration capabilities in a single 256-ball BGA package for compact, industrial-grade designs.

This device targets system control and interfacing roles where fast power-up, dedicated I/O capacity and in-field reconfiguration are important. Key value propositions include single-chip non-volatile configuration, a high I/O count and industry temperature range for reliable operation in industrial environments.

Key Features

  • Logic Capacity — 2,280 logic elements suitable for glue logic, bus bridging and control functions.
  • On-chip Memory — 28,262 total RAM bits (approx. 27.6 Kbits) of embedded and distributed memory for FIFOs, state storage and small buffers.
  • I/O Density — 211 I/Os in the 256-ball package to support wide GPIO and peripheral interfacing requirements.
  • Non‑volatile, Instant‑On — Single-chip non-volatile configuration with fast power-up; no external configuration memory required.
  • Reconfiguration Options — SRAM and non‑volatile memory programmable through JTAG, background programming support and TransFR™ in-field reconfiguration for live updates.
  • Flexible I/O Buffering — Programmable sysIO™ buffer supports a wide range of interfaces documented for the MachXO family (multiple LVCMOS levels, LVTTL and differential options).
  • Clocking — Family supports up to two analog PLLs for clock multiply/divide and phase shifting.
  • Power and Low‑Power Modes — Core supply range 1.14 V to 1.26 V and a Sleep Mode that can reduce static current by up to 100×.
  • Package & Mounting — 256-LFBGA / CSPBGA (supplier package: 256-CABGA 14×14 mm), surface-mount package suitable for compact board layouts.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C.
  • Standards & Programming — IEEE 1149.1 boundary-scan and IEEE 1532 compliant in-system programming supported by the MachXO family documentation.
  • RoHS Compliant — Device meets RoHS environmental requirements.

Typical Applications

  • Glue Logic and Board-Level Control — Implement address decoding, bus arbitration and simple state machines using the device’s 2,280 logic elements and on-chip RAM.
  • Bus Bridging and Interfacing — Use the 211 I/Os and flexible sysIO buffering to bridge and condition signals between different voltage domains and interfaces.
  • Power-Up and Reset Control — Instant-on non-volatile configuration and low-power Sleep Mode make it well suited for power sequencing and supervisory functions.
  • Field-Updatable Control Logic — TransFR™ reconfiguration and JTAG-programmable non-volatile memory enable in-field updates without external configuration memory.

Unique Advantages

  • Single‑Chip Non‑Volatile Configuration: Eliminates the need for external configuration memory and enables microsecond-scale power-up.
  • High I/O to Logic Ratio: 211 I/Os paired with 2,280 logic elements simplifies designs that require many external connections alongside moderate logic density.
  • In-Field Reconfiguration: Background programming and TransFR™ support allow updates with minimal system disruption.
  • Low-Power Options: Sleep Mode provides significant static current reduction for energy-sensitive systems.
  • Compact, Surface-Mount Packaging: 256-ball BGA (14×14 mm supplier package) enables high-density PCB designs while maintaining routing flexibility.
  • Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in industrial environments.

Why Choose LCMXO2280E-4BN256I?

This MachXO device delivers a balanced mix of non-volatile instant-on operation, substantial I/O capacity and on-chip memory—packaged for compact, industrial use. Its reconfiguration features and support for in-system programming make it a practical choice for designs that require field updates and secure configuration without external memory.

Engineers building board-level control, interfacing or power-management logic will find the LCMXO2280E-4BN256I suitable for applications that benefit from rapid startup, flexible I/O and the MachXO family’s toolchain support for implementation and timing verification.

Request a quote or submit an inquiry to receive pricing and lead-time information for the LCMXO2280E-4BN256I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up