LCMXO256C-5MN100C

IC FPGA 78 I/O 100CSBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 78 256 100-LFBGA, CSPBGA

Quantity 696 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package100-CSBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LFBGA, CSPBGANumber of I/O78Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32Number of Logic Elements/Cells256
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO256C-5MN100C – MachXO FPGA, 78 I/O, 256 logic elements (100-ball csBGA / 100-LFBGA)

The LCMXO256C-5MN100C is a MachXO family Field Programmable Gate Array (FPGA) optimized for glue logic, bus bridging, bus interfacing, power-up sequencing and general control logic. It combines non-volatile configuration and FPGA-style LUT-based logic to deliver instant-on operation and flexible reconfiguration for commercial embedded designs.

This surface-mount device provides 256 logic elements, up to 78 general-purpose I/O pins in a compact 100-ball csBGA / 100-LFBGA package, and a broad supply voltage window to simplify multi-voltage system integration.

Key Features

  • Non-volatile instant-on configuration – Single-chip non-volatile architecture enables instant-on behavior and eliminates the need for external configuration memory.
  • Reconfigurable logic – 256 logic elements suitable for glue logic and control tasks; supports background reconfiguration and in-field logic updates.
  • I/O capacity and flexibility – 78 I/O pins in the 100-ball package with programmable sysIO buffers that support multiple interface standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
  • Embedded and distributed memory – Approximately 2.0 Kbits of distributed RAM in the LCMXO256 device family to support small on-chip data storage and buffering; no embedded block SRAM.
  • Power and voltage support – Wide operating supply range (1.71 V to 3.465 V) to accommodate common system rails and simplify mixed-voltage designs.
  • Low-power modes – Family features include sleep mode capability for significant static current reduction during idle periods.
  • System-level support – IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support; JTAG-accessible programming and background programming of non-volatile memory.
  • Package and mounting – Surface-mount 100-CSBGA (8×8 mm) / 100-LFBGA options for compact board layouts; commercial grade operating temperature range of 0 °C to 85 °C.
  • No analog PLLs on this device – The LCMXO256 device does not include dedicated analog PLLs (family table indicates zero PLLs for this density).

Typical Applications

  • Glue Logic and Bus Bridging – Implement address decoding, level translation and protocol bridging between system buses.
  • Power-Up and Reset Control – Manage power sequencing, reset distribution and supervisory control with instant-on configuration.
  • User Interface and Control – Drive buttons, LEDs, switches and simple state machines for embedded control panels and appliances.
  • Sensor and Peripheral Interfacing – Aggregate and condition signals from sensors or peripherals using flexible I/O standards and on-chip distributed RAM.

Unique Advantages

  • Instant-on operation: Non-volatile single-chip configuration removes the need for external flash and delivers immediate startup behavior.
  • Compact, surface-mount packaging: 100-ball csBGA / 100-LFBGA packages enable small form-factor board designs without sacrificing I/O count.
  • Flexible multi-standard I/O: Programmable sysIO buffers support a wide range of voltage levels and interface standards to ease system integration.
  • Field reprogrammability: JTAG-accessible programming and background non-volatile memory updates allow in-field logic changes with minimal disruption.
  • Commercial temperature rating: Designed for 0 °C to 85 °C operation, suitable for mainstream embedded and industrial-adjacent electronics.
  • Lower BOM and simplified board design: Built-in non-volatile configuration and integrated I/O reduce external components and simplify system architecture.

Why Choose LCMXO256C-5MN100C?

The LCMXO256C-5MN100C positions itself as a compact, non-volatile FPGA solution for designs that require instant-on behavior, flexible I/O support and dependable control logic in a small surface-mount package. With 256 logic elements and 78 I/Os, it is well suited for glue logic, interface bridging and embedded control applications where reduced board complexity and rapid reconfiguration are important.

Designers benefit from family-level tools and workflow compatibility that support density migration within the MachXO family, enabling straightforward scaling for projects that may grow in logic or I/O requirements over time.

Request a quote or submit a purchasing inquiry to receive pricing and availability for the LCMXO256C-5MN100C.

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