LCMXO256E-3M100I

IC FPGA 78 I/O 100CSBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 78 256 100-LFBGA, CSPBGA

Quantity 506 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package100-CSBGA (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-LFBGA, CSPBGANumber of I/O78Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32Number of Logic Elements/Cells256
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO256E-3M100I – MachXO Non-Volatile FPGA, 256 Logic Elements, 78 I/Os

The LCMXO256E-3M100I is a MachXO family field programmable gate array (FPGA) in a compact 100-ball LFBGA/CSPBGA package, designed for industrial applications. It provides 256 logic elements and up to 78 general-purpose I/Os in a single, non-volatile device optimized for glue logic, bus bridging, power-up control and general control logic tasks. Key value propositions include single-chip instant-on operation, flexible I/O support, and industrial temperature operation.

Key Features

  • Logic Density  Approximately 256 logic elements for implementing glue logic, control functions and interface bridging within a compact FPGA footprint.
  • I/O and Package Options  Up to 78 I/Os provided in a 100-LFBGA / 100-CSBGA (8×8 mm) package for high pin-to-pin connectivity in small form factors.
  • Non-Volatile, Instant-On Configuration  Family-level capability: single-chip non-volatile configuration enables instant-on behavior and eliminates the need for external configuration memory.
  • Reconfiguration and Field Updates  Support for in-system reconfiguration, including background programming through standard JTAG-based methods (family-level TransFR reconfiguration and JTAG programming supported).
  • Flexible I/O Standards  Family-level programmable I/O buffer support for a wide range of interfaces and voltage standards, enabling compatibility with common system signaling.
  • Voltage and Temperature  Operates with a core supply range of 1.14 V to 1.26 V and is rated for industrial operation from −40 °C to 100 °C.
  • Mounting and Compliance  Surface-mount package with RoHS-compliant materials for modern manufacturing flows.

Typical Applications

  • Glue Logic and System Control  Implement glue logic and startup control functions where compact, single-chip, non-volatile logic is required.
  • Bus Bridging and Interface Management  Implement protocol bridging and bus interfacing with flexible I/O options and dense I/O count relative to logic size.
  • Power-Up and Reset Control  Use instant-on configuration for deterministic power-up sequencing and system initialization tasks.
  • Embedded Control and Peripheral Management  Control discrete peripherals, manage sensor interfaces, or implement user-interface logic in industrial environments.

Unique Advantages

  • Single-Chip Non-Volatile Solution: Reduces BOM by removing the need for external configuration memory while enabling instant-on behavior.
  • Compact, High-I/O Package: 100-ball LFBGA/CSPBGA package delivers up to 78 I/Os in an 8×8 mm footprint for space-constrained designs.
  • Industrial Temperature Rating: Rated from −40 °C to 100 °C to meet a wide range of industrial operating environments.
  • Low-Voltage Core: Operates at a core supply of 1.14 V to 1.26 V for compatibility with modern low-voltage power domains.
  • Field Reconfiguration: Supports in-system updates and background programming via JTAG and family-level reconfiguration features, enabling maintenance and feature updates in the field.

Why Choose LCMXO256E-3M100I?

The LCMXO256E-3M100I positions itself as a compact, industrial-grade MachXO FPGA for designs that require non-volatile, instant-on programmable logic with up to 78 I/Os. Its 256 logic elements and small 100-ball BGA package make it suited to replacing discrete glue logic assemblies and consolidating interface control in a single device. Backed by MachXO family-level configuration and reprogramming features and RoHS-compliant packaging, this part addresses applications where size, single-chip configuration and industrial temperature operation are key considerations.

For designs requiring a concise logic implementation with flexible I/O in an industrial footprint, the LCMXO256E-3M100I offers a pragmatic balance of integration, configurability and environmental robustness.

Request a quote or submit an inquiry to check availability and pricing for the LCMXO256E-3M100I.

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