LCMXO256E-3MN100C

The LCMXO256E-3MN100C is a MachXO family field programmable gate array (FPGA) in a compact 100-ball LFBGA/CSPBGA package. It provides 256 logic elements arranged across 32 configurable logic blocks (CLBs) with up to 78 user I/Os, targeted for glue logic, control, and interface tasks in commercial applications.

Built for low-voltage systems, the device supports a core supply range of 1.14 V to 1.26 V, is RoHS compliant, and is specified for commercial operating temperatures from 0 °C to 85 °C. Its single-chip MachXO architecture delivers non-volatile configuration and instant-on behavior for fast system startup and secure configuration.

Key Features

• Core Logic – 256 logic elements organized across 32 CLBs for small- to mid-scale glue logic, bus interfacing, and control implementations.
• I/O Density – Up to 78 I/Os to support a variety of peripheral and bus connections in compact designs.
• Non-volatile Configuration – MachXO family characteristics include non-volatile, instant-on configuration and single-chip operation without external configuration memory.
• Reconfiguration & Programming – Supports in-system reconfiguration mechanisms from the MachXO family feature set, enabling field updates while installed.
• Power and Voltage – Core supply range specified at 1.14 V to 1.26 V to match low-voltage system rails; surface-mount mounting for standard PCB integration.
• Package & Mounting – 100-LFBGA / CSPBGA package (100-CSBGA, 8×8 mm supplier package) for space-constrained boards.
• Environmental & Grade – Commercial-grade device rated for 0 °C to 85 °C and RoHS compliant.
• On-chip RAM – Total on-chip RAM bits specified as 0 for this part number.

Typical Applications

• Glue Logic and Bus Bridging – Implement address decoding, bus arbitration, and protocol bridging between digital subsystems using compact programmable logic.
• Power-up and System Control – Manage power sequencing, reset distribution, and startup control with instant-on configuration for predictable system behavior.
• Peripheral and Interface Control – Provide customizable I/O handling and interface glue for sensors, displays, and communication peripherals in compact system boards.

Unique Advantages

• Instant-on, Single-Chip Configuration: Eliminates the need for external configuration memory and reduces system complexity at startup.
• Compact Package, High Pin Count: 100-ball LFBGA/CSPBGA packaging delivers substantial I/O in a small footprint for space-constrained designs.
• Low-Voltage Core Support: Core supply range of 1.14 V–1.26 V enables integration into modern low-voltage power domains.
• Field Reconfigurability: MachXO family reconfiguration capabilities permit in-field updates and iterative development without hardware replacement.
• Commercial Temperature Range: Specified operation from 0 °C to 85 °C for standard commercial deployments.
• Regulatory Compliance: RoHS-compliant packaging supports environmental and manufacturing requirements.

Why Choose LCMXO256E-3MN100C?

The LCMXO256E-3MN100C targets designers who need a compact, non-volatile FPGA solution with 256 logic elements and a substantial I/O complement for glue logic, interface control, and startup management. Its MachXO lineage brings instant-on configuration and field reprogrammability while fitting into low-voltage system architectures and small PCBs.

Choose this part when you require a single-chip programmable solution with predictable commercial-temperature operation, RoHS compliance, and compact LFBGA/CSPBGA packaging to streamline BOM and simplify board-level integration.

Request a quote or submit a pricing and availability request to obtain lead-time and ordering information for the LCMXO256E-3MN100C.