LCMXO256E-3T100C

IC FPGA 78 I/O 100TQFP
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 78 256 100-LQFP

Quantity 875 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LQFPNumber of I/O78Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32Number of Logic Elements/Cells256
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO256E-3T100C – MachXO Field Programmable Gate Array (FPGA) IC, 78 I/Os, 256 Logic Elements, 100‑LQFP

The LCMXO256E-3T100C is a MachXO family FPGA optimized for low-capacity, high-pin-count control and glue-logic functions. This non-volatile, instantly configurable device combines a small logic fabric with flexible I/O to address applications such as bus interfacing, power-up control, and general-purpose control logic.

With 256 logic elements, 78 I/Os, single‑chip non-volatile configuration and a compact 100-pin surface-mount package, the device targets compact embedded systems that require fast startup, in-field reconfiguration, and low part-count designs. It operates within a core supply range of 1.14 V to 1.26 V and a commercial temperature range of 0 °C to 85 °C.

Key Features

  • Non-volatile, instant-on configuration  Single-chip non-volatile architecture enables microsecond power-up without external configuration memory.
  • Reconfiguration capability  SRAM-based logic can be reconfigured in milliseconds and non-volatile memory is programmable via the JTAG interface for field updates.
  • Sleep mode for low static current  Built-in sleep mode supports significant static current reduction for power-sensitive applications.
  • TransFR™ in-field reconfiguration  Supports background logic updates while the system remains operational for in-field maintenance and upgrades.
  • Logic density  Provides 256 logic elements suitable for glue logic, control tasks, and small-scale FPGA functions.
  • Flexible I/O  78 I/O pins in a compact package, enabling multiple parallel interfaces and signal routing options on space-constrained boards.
  • Package and mounting  Surface-mount 100-pin LQFP package for compact PCB integration.
  • Supply and temperature  Core supply range: 1.14 V to 1.26 V; operating temperature: 0 °C to 85 °C (commercial grade).
  • Compliance  RoHS compliant packaging.

Typical Applications

  • Glue Logic and System Control  Implement board-level glue logic, reset sequencing and control functions with a compact, single‑chip solution.
  • Bus Bridging and Interfacing  Serve as protocol adapters or bus interface controllers where multiple I/Os and fast startup are required.
  • Power-Up and Reset Management  Manage power sequencing, watchdog logic and system bring-up with instant-on configuration.
  • In-Field Logic Updates  Support field upgrades and incremental feature additions using TransFR™ reconfiguration without taking the system offline.

Unique Advantages

  • Single-chip, secure configuration: Eliminates the need for external configuration memory, reducing BOM and attack surface for bitstream interception.
  • Fast system availability: Instant-on behavior enables systems to begin operation in microseconds after power-up, improving responsiveness for control applications.
  • Field maintainability: Background and in-field reconfiguration let you update logic while the system is running, simplifying firmware rollout and bug fixes.
  • Power management flexibility: Sleep mode enables substantial static current reduction for lower standby power in battery-powered or energy-conscious systems.
  • Compact integration: 78 I/Os and 256 logic elements in a 100-pin surface-mount package support high pin-to-logic density on small PCBs.
  • Design tool support: Family documentation indicates toolchain support (ispLEVER) for synthesis, place-and-route, and timing verification to streamline development.

Why Choose LCMXO256E-3T100C?

The LCMXO256E-3T100C positions itself as a compact, non-volatile MachXO FPGA well suited for designers needing reliable glue logic, interface bridging, and fast power-up control in commercial-temperature systems. Its combination of instant-on configuration, reconfigurability, and a high I/O count in a small package reduces board-level complexity and BOM.

This device is attractive for teams seeking a maintainable platform with field update capability, low standby power options, and straightforward integration using documented design flows. The MachXO family characteristics and toolchain support provide a clear migration path for similar low-density control applications.

Request a quote or submit an inquiry to receive pricing and availability information for the LCMXO256E-3T100C.

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