LCMXO256E-3T100C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 78 256 100-LQFP |
|---|---|
| Quantity | 875 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 78 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32 | Number of Logic Elements/Cells | 256 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO256E-3T100C – MachXO Field Programmable Gate Array (FPGA) IC, 78 I/Os, 256 Logic Elements, 100‑LQFP
The LCMXO256E-3T100C is a MachXO family FPGA optimized for low-capacity, high-pin-count control and glue-logic functions. This non-volatile, instantly configurable device combines a small logic fabric with flexible I/O to address applications such as bus interfacing, power-up control, and general-purpose control logic.
With 256 logic elements, 78 I/Os, single‑chip non-volatile configuration and a compact 100-pin surface-mount package, the device targets compact embedded systems that require fast startup, in-field reconfiguration, and low part-count designs. It operates within a core supply range of 1.14 V to 1.26 V and a commercial temperature range of 0 °C to 85 °C.
Key Features
- Non-volatile, instant-on configuration Single-chip non-volatile architecture enables microsecond power-up without external configuration memory.
- Reconfiguration capability SRAM-based logic can be reconfigured in milliseconds and non-volatile memory is programmable via the JTAG interface for field updates.
- Sleep mode for low static current Built-in sleep mode supports significant static current reduction for power-sensitive applications.
- TransFR™ in-field reconfiguration Supports background logic updates while the system remains operational for in-field maintenance and upgrades.
- Logic density Provides 256 logic elements suitable for glue logic, control tasks, and small-scale FPGA functions.
- Flexible I/O 78 I/O pins in a compact package, enabling multiple parallel interfaces and signal routing options on space-constrained boards.
- Package and mounting Surface-mount 100-pin LQFP package for compact PCB integration.
- Supply and temperature Core supply range: 1.14 V to 1.26 V; operating temperature: 0 °C to 85 °C (commercial grade).
- Compliance RoHS compliant packaging.
Typical Applications
- Glue Logic and System Control Implement board-level glue logic, reset sequencing and control functions with a compact, single‑chip solution.
- Bus Bridging and Interfacing Serve as protocol adapters or bus interface controllers where multiple I/Os and fast startup are required.
- Power-Up and Reset Management Manage power sequencing, watchdog logic and system bring-up with instant-on configuration.
- In-Field Logic Updates Support field upgrades and incremental feature additions using TransFR™ reconfiguration without taking the system offline.
Unique Advantages
- Single-chip, secure configuration: Eliminates the need for external configuration memory, reducing BOM and attack surface for bitstream interception.
- Fast system availability: Instant-on behavior enables systems to begin operation in microseconds after power-up, improving responsiveness for control applications.
- Field maintainability: Background and in-field reconfiguration let you update logic while the system is running, simplifying firmware rollout and bug fixes.
- Power management flexibility: Sleep mode enables substantial static current reduction for lower standby power in battery-powered or energy-conscious systems.
- Compact integration: 78 I/Os and 256 logic elements in a 100-pin surface-mount package support high pin-to-logic density on small PCBs.
- Design tool support: Family documentation indicates toolchain support (ispLEVER) for synthesis, place-and-route, and timing verification to streamline development.
Why Choose LCMXO256E-3T100C?
The LCMXO256E-3T100C positions itself as a compact, non-volatile MachXO FPGA well suited for designers needing reliable glue logic, interface bridging, and fast power-up control in commercial-temperature systems. Its combination of instant-on configuration, reconfigurability, and a high I/O count in a small package reduces board-level complexity and BOM.
This device is attractive for teams seeking a maintainable platform with field update capability, low standby power options, and straightforward integration using documented design flows. The MachXO family characteristics and toolchain support provide a clear migration path for similar low-density control applications.
Request a quote or submit an inquiry to receive pricing and availability information for the LCMXO256E-3T100C.

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