LCMXO256E-3MN100I

IC FPGA 78 I/O 100CSBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 78 256 100-LFBGA, CSPBGA

Quantity 1,009 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package100-CSBGA (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-LFBGA, CSPBGANumber of I/O78Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32Number of Logic Elements/Cells256
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO256E-3MN100I – MachXO FPGA, 256 logic elements, 78 I/O, 100-LFBGA

The LCMXO256E-3MN100I is a non-volatile MachXO field programmable gate array (FPGA) optimized for glue logic, bus interfacing, power-up control and general control tasks. Built on the MachXO family architecture, it combines instant-on non-volatile configuration with reconfigurable FPGA-style logic to deliver a compact, single‑chip solution for industrial embedded designs.

This surface-mount 100‑ball LFBGA/CSPBGA device provides 78 I/Os, 32 logic blocks and approximately 256 logic elements, making it suitable for small to medium complexity control and interface applications that require industrial temperature operation and low overall system BOM.

Key Features

  • Non-volatile, instant-on configuration Single-chip non-volatile architecture enables microsecond-scale power-up and eliminates the need for external configuration memory.
  • Core logic resources 32 logic blocks delivering approximately 256 logic elements for implementing glue logic, state machines and interface bridging.
  • Embedded and distributed memory Distributed RAM resources appropriate for small FIFOs and buffering; the LCMXO256 family member does not include embedded block SRAM.
  • I/O flexibility Up to 78 I/Os provided in the 100‑LFBGA/CSPBGA package for broad peripheral and bus interfacing requirements.
  • Programmable I/O buffer options Family-level sysIO buffer support includes multiple industry interfaces (LVCMOS, LVTTL, LVDS variants, PCI, LVPECL, RSDS) to accommodate diverse board-level connectivity.
  • Power and low-power modes Core supply range 1.14 V to 1.26 V and a Sleep Mode that can reduce static current by up to 100× for low-power standby operation.
  • Reconfiguration and field updates TransFR reconfiguration enables in-field logic updates while a system operates; SRAM-based portions can be reprogrammed in milliseconds.
  • Packaging and temperature Surface-mount 100‑LFBGA / csBGA (8×8 mm) package, industrial-grade operation from −40 °C to 100 °C.
  • No on-chip analog PLLs in this device The LCMXO256 device does not include analog PLLs; timing and clocking should be planned accordingly.

Typical Applications

  • Glue Logic and Board-Level Control – Implement address decoding, protocol translation and small control finite state machines without external configuration memory.
  • Bus Bridging and Interface Conditioning – Use the 78 I/Os and programmable I/O buffer support to bridge between different logic families and bus standards.
  • Power-Up Sequencing and System Control – Instant-on non-volatile configuration and low-power sleep modes make the device suitable for power sequencing and supervisory control.
  • Peripheral and Sensor Interfaces – Compact package and industrial temperature range enable board-level signal conditioning and peripheral aggregation in embedded systems.

Unique Advantages

  • Single-chip, no external configuration memory: Reduces BOM and board area by integrating non-volatile configuration on the FPGA.
  • Instant-on operation: Powers up in microseconds so downstream systems can initialize immediately after power application.
  • Field reconfigurability: In-field TransFR updates and fast SRAM reconfiguration enable iterative feature updates and rapid fixes without hardware swaps.
  • Low-power standby: Sleep Mode support provides substantial static current reduction for energy-sensitive designs.
  • Industrial temperature capability: Rated for −40 °C to 100 °C to meet the demands of industrial embedded applications.
  • Compact surface-mount package: 100‑LFBGA/csBGA (8×8 mm) mounting minimizes board footprint while providing ample I/O count.

Why Choose LCMXO256E-3MN100I?

The LCMXO256E-3MN100I positions itself as a compact, industrial-grade FPGA option for designers who need non-volatile instant-on behavior combined with reconfigurable logic. Its combination of roughly 256 logic elements, 78 I/Os, sleep-mode power reduction and single-chip configuration simplifies system design, reduces external components, and supports rapid in-field updates.

Engineers designing board-level control, interface bridging or power sequencing functions will find the MachXO family’s toolchain support and the LCMXO256E’s balanced resource set well suited for reliable, long-lived embedded deployments.

Request a quote or submit an inquiry to receive pricing and availability information for the LCMXO256E-3MN100I.

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