LCMXO640C-4MN132I

IC FPGA 101 I/O 132CSBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 101 640 132-LFBGA, CSPBGA

Quantity 1,398 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package132-CSPBGA (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case132-LFBGA, CSPBGANumber of I/O101Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640C-4MN132I – MachXO Field Programmable Gate Array IC, 640 logic elements, 101 I/O (132-LFBGA)

The LCMXO640C-4MN132I is a MachXO family FPGA offering 640 logic elements in a non-volatile, instant-on architecture optimized for glue logic, bus bridging, bus interfacing, power-up control and general control logic. This industrial-grade, surface-mount device provides a compact 132-ball CSPBGA (8×8 mm) package with 101 I/Os and targeted features for system-level integration.

Designed for designs that require single-chip configuration and rapid start-up, the device supports flexible I/O signaling and wide operating conditions, including a 1.71 V to 3.465 V supply range and an operating temperature range of −40 °C to 100 °C.

Key Features

  • Core & Logic  640 logic elements with an architecture of logic blocks suitable for glue logic and control functions; device-level topology follows the MachXO family logic array organization.
  • Memory  Approximately 6.1 Kbits of distributed RAM (family data for LCMXO640); no embedded block SRAM (EBR) on this density.
  • I/O & Interface Flexibility  101 user I/Os in the 132-ball CSPBGA package. The MachXO family supports programmable sysIO buffer options across common signaling standards to simplify interfacing.
  • Configuration & Reconfiguration  Non-volatile, single-chip configuration with instant-on behavior and no external configuration memory required. Supports JTAG programming and background update of non-volatile memory; TransFR™ reconfiguration enables in-field logic updates.
  • Low-Power Modes  Family-level sleep mode allows significant static current reduction (documented as up to 100× reduction), useful for low-power system states.
  • Power & Timing  Operates from 1.71 V to 3.465 V supply rails; family architecture includes support for system clocking and timing control features (family sysCLOCK PLLs available in other densities).
  • Package & Thermal  132-LFBGA (CSPBGA 8×8 mm) surface-mount package; industrial-grade operating temperature from −40 °C to 100 °C.
  • System-Level Support & Compliance  Family-level support includes IEEE 1149.1 boundary scan and IEEE 1532 in-system programming; lead-free / RoHS-compliant packaging.

Typical Applications

  • Glue Logic  Implement board-level glue and control logic with a compact, non-volatile FPGA that eliminates external configuration memory.
  • Bus Bridging & Interfacing  Bridge or interface between different buses and signaling standards using the device’s flexible I/O and programmable buffer capabilities.
  • Power-Up & System Control  Perform power-up sequencing, reset control, and system management tasks with instant-on capability and reconfigurable control logic.
  • General Control Logic  Replace multiple discrete logic devices with an integrated, reprogrammable solution for board space and BOM reduction.

Unique Advantages

  • Instant-on, single-chip configuration: Eliminates external configuration memory and enables microsecond-scale start-up for faster system availability.
  • In-field reconfiguration: TransFR™ and background programming through JTAG allow safe, in-system updates to logic without removing the device from the board.
  • Compact, high-pin-count package: 132-ball CSPBGA (8×8 mm) delivers 101 I/Os in a small footprint, aiding high-density board designs.
  • Industrial temperature capability: Rated −40 °C to 100 °C for reliable operation in industrial environments.
  • Reduced system BOM: Non-volatile configuration and integrated logic reduce the need for external configuration components and discrete glue logic.
  • Standards and programming support: Supports boundary-scan and IEEE 1532 in-system programming for streamlined manufacturing and field serviceability.

Why Choose LCMXO640C-4MN132I?

The LCMXO640C-4MN132I positions itself as a compact, industrial-grade MachXO FPGA for applications that demand instant-on configuration, flexible I/O, and reliable control logic in a small BGA package. Its non-volatile single-chip configuration, in-field reprogramming capabilities, and broad voltage and temperature ranges make it a practical choice for designers consolidating glue logic and system control functions.

Engineers targeting reduced BOM, fast system start-up, and in-system programmability will find this device well-suited to industrial control, board-level bridging, and power-up management tasks while benefiting from the MachXO family’s system-level support.

Request a quote or submit a purchase inquiry to receive pricing and availability for the LCMXO640C-4MN132I.

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