LCMXO640C-4T144C

The LCMXO640C-4T144C is a MachXO family FPGA from Lattice Semiconductor designed for commercial embedded applications that require instant-on, non-volatile logic with flexible I/O. Built around a LUT-based logic array, this single-chip device targets glue logic, bus bridging, bus interfacing, power-up control and general control tasks where compact integration and fast configuration are important.

Its architecture combines 640 LUTs across 80 CLBs with programmable I/O and non-volatile configuration for instant-on behavior, enabling compact, single-chip implementations without external configuration memory.

Key Features

• Core Logic — 640 LUTs organized across 80 CLBs provide reprogrammable logic density for glue logic and control functions.
• Memory — Approximately 6.1 Kbits of distributed RAM for small data buffering and state storage; no embedded block SRAM is present for this device variant.
• I/O and Interfaces — 113 user I/Os in the 144-pin package with programmable sysIO buffer support for LVCMOS and LVTTL and other interface standards described in the MachXO family data sheet.
• Configuration & Security — Non-volatile, single-chip configuration enables instant-on operation and removes the need for external configuration memory; supports in-system programming and background programming via JTAG.
• Reconfiguration — SRAM-based logic can be reconfigured in milliseconds and supports TransFR™ in-field reconfiguration while the system operates.
• Power & Low Power Modes — Supports a Sleep Mode to significantly reduce static current draw; device operates from a wide supply range of 1.71 V to 3.465 V.
• Package & Mounting — Surface-mount 144-LQFP (supplier 144-TQFP 20×20 mm) package, suitable for compact board-level integration.
• Operating Range & Compliance — Commercial grade with an operating temperature range of 0 °C to 85 °C; RoHS compliant.
• Design Tools & Ecosystem — Supported by the MachXO family design flow and tools referenced in the data sheet for synthesis, place-and-route and timing verification.

Typical Applications

• Glue Logic — Replace discrete TTL/LSI glue logic with programmable LUTs to consolidate functions and reduce BOM.
• Bus Bridging & Protocol Translation — Implement bus interface logic and simple protocol bridging using programmable I/O and on-chip logic.
• Power-up & Reset Control — Centralize power sequencing, reset generation and supervisory control within a single non-volatile device for predictable start-up.
• Control Logic — Implement board-level control, state machines and user interface control in compact commercial designs.

Unique Advantages

• Instant-on, single-chip configuration: Non-volatile configuration eliminates external configuration memory and delivers immediate operation after power-up.
• In-field reconfiguration: TransFR™ and JTAG-based background programming let you update logic while the system is operating or perform safe field updates.
• Flexible I/O support: Programmable sysIO buffers support multiple signaling standards enabling adaptation to diverse board-level interfaces.
• Compact, surface-mount package: 144-LQFP (20×20 mm) packaging balances pin count and board-area efficiency for commercial applications.
• Low-power operational modes: Sleep Mode provides substantial static current reduction for power-sensitive designs.
• Commercial temperature and RoHS compliance: Specified for 0 °C to 85 °C operation and RoHS-compliant packaging for mainstream electronic products.

Why Choose LCMXO640C-4T144C?

The LCMXO640C-4T144C positions itself as a compact, non-volatile FPGA for commercial embedded designs that need instant-on capability, flexible I/O and reliable board-level control without external configuration memory. With 640 LUTs, distributed RAM, and support for in-field reconfiguration, it is well suited for consolidating glue logic, managing power-up sequences and implementing protocol bridging in space-constrained systems.

Backed by the MachXO family design tools and a migration path across MachXO densities, this device supports iterative development and density scaling while simplifying BOM and improving system integration for commercial product lines.

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