LCMXO640C-4TN100C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 74 640 100-LQFP |
|---|---|
| Quantity | 53 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 74 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80 | Number of Logic Elements/Cells | 640 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO640C-4TN100C – MachXO Field Programmable Gate Array (FPGA) IC 74 640 100-LQFP
The LCMXO640C-4TN100C is a MachXO family FPGA in a 100-pin LQFP surface-mount package optimized for glue logic, bus interfacing and control applications. It delivers 640 logic elements arranged across 80 CLBs, up to 74 user I/Os, and supports single-chip, non-volatile configuration for instant-on operation.
Designed for commercial applications, this device operates from 1.71 V to 3.465 V and across a 0 °C to 85 °C ambient range, providing flexible I/O and system-level configuration options suitable for low- to mid-density logic integration.
Key Features
- Core Logic 640 logic elements implemented across 80 CLBs provide mid-density programmable logic capacity for glue logic, control and interface functions.
- Memory Approximately 6.1 Kbits of distributed RAM for small FIFOs and state storage; no embedded block SRAM (EBR) blocks in this device.
- Flexible I/O 74 I/O pins with programmable sysIO buffer support for a wide range of standards including LVCMOS (1.2/1.5/1.8/2.5/3.3 V) and legacy interfaces, enabling direct interfacing to common peripherals and buses.
- Non‑volatile Configuration & Instant‑on Single-chip, non-volatile configuration enables instant-on behavior without external configuration memory and supports JTAG programming and background programming of non-volatile memory.
- In-field Reconfiguration & Low-power Modes Supports in-field logic updates (TransFR reconfiguration) and a Sleep Mode that can reduce static current significantly for low-power standby operation.
- Package & Mounting 100-pin LQFP (14 × 14 mm) surface-mount package with a 74 I/O pinout suitable for compact board layouts and straightforward assembly.
- Commercial Grade & Compliance Rated for 0 °C to 85 °C operation and RoHS compliant.
Typical Applications
- Glue Logic and System Control — Implement address decoding, bus arbitration, reset/power sequencing and other board-level control tasks with compact, non-volatile logic.
- Bus Bridging and Interfacing — Bridge between different voltage domains and bus protocols using flexible I/O and programmable logic.
- Peripheral and Sensor Interfaces — Aggregate and preprocess sensor data or manage peripheral handshakes with distributed RAM and reconfigurable logic.
- Power-up and Sequencing Control — Implement deterministic power-up control and instant-on functionality without external configuration memory.
Unique Advantages
- Instant-on, single-chip configuration: Eliminates the need for external configuration memory and delivers immediate availability at power-up.
- In-field logic updates: TransFR reconfiguration enables targetted logic changes while the system remains operational, simplifying firmware updates and field fixes.
- Flexible I/O standards: Programmable I/O buffers support multiple voltage domains and interface standards, reducing the need for external level-shifters or translators.
- Compact, surface-mount package: 100-pin LQFP (14×14 mm) package balances I/O count and board space for compact designs.
- Simplified low-power operation: Sleep Mode capability provides a substantial reduction in static current for power-sensitive applications.
- Design tool support: Supported by ispLEVER design tools and common synthesis flows to streamline implementation and timing closure.
Why Choose LCMXO640C-4TN100C?
The LCMXO640C-4TN100C positions itself as a practical, mid-density MachXO device for designers who need non-volatile, instant-on programmable logic with flexible I/O and in-field reconfiguration. Its combination of 640 logic elements, approximately 6.1 Kbits of distributed RAM, and 74 I/Os in a compact 100-LQFP package makes it well suited for board-level glue logic, protocol bridging, control sequencing and peripheral interfacing in commercial applications.
Backed by MachXO family capabilities—single-chip configuration, JTAG programmability, TransFR reconfiguration and ispLEVER tool support—this device provides a balanced, easy-to-integrate solution for reducing BOM complexity and accelerating time-to-market.
Request a quote or submit an RFQ to receive pricing, lead time and availability for the LCMXO640C-4TN100C.

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