LCMXO640C-5B256C

IC FPGA 159 I/O 256CABGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LFBGA, CSPBGA

Quantity 156 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGA, CSPBGANumber of I/O159Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640C-5B256C – MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LFBGA, CSPBGA

The LCMXO640C-5B256C is a MachXO family FPGA offering non-volatile, instant-on programmable logic in a single-chip solution. It provides a balance of logic density and I/O capability for glue logic, bus bridging, power-up control and general control logic applications.

Built for commercial-grade systems, this device combines approximately 640 logic elements with up to 159 I/Os in a 256-ball BGA package, supporting single-chip configuration without external memory and fast in-field reconfiguration options.

Key Features

  • Core Logic  Approximately 640 logic elements delivering flexible LUT-based logic for glue logic, bus interfacing and control functions.
  • Logic Block Count  80 logic blocks supporting an efficient mapping of combinational and sequential logic.
  • Memory  Distributed on-chip RAM available in the MachXO640 family (approximately 6.1 Kbits as defined for the family member).
  • Instant-On, Non-Volatile  Single-chip non-volatile configuration enables instant-on startup without external configuration memory and eliminates external bitstream storage.
  • In-Field Reconfiguration  Supports TransFR™ reconfiguration for logic updates while the system operates and background programming via JTAG.
  • I/O and Package  Up to 159 I/Os in a 256-ball caBGA / LFBGA footprint (256-CABGA, 14×14 mm supplier package), with broad interface support across standard voltage rails.
  • Voltage Range  Operates across a wide supply range: 1.71 V to 3.465 V to accommodate multiple I/O standards and mixed-voltage designs.
  • Power and Sleep  Includes sleep mode capability for substantial static current reduction during low-power states.
  • Commercial Temperature Grade  Specified for operation from 0 °C to 85 °C for commercial applications.
  • RoHS Compliant  Device and packaging meet RoHS requirements.

Typical Applications

  • Glue Logic and Bus Bridging  Use the device to implement glue logic, bus translators and protocol adaptation between system components.
  • Power-Up and Reset Control  Single-chip non-volatile configuration and instant-on behavior simplify power sequencing and start-up control tasks.
  • Control Logic  Implement system state machines, peripheral control and timing logic with the device’s LUT-based resources and I/O capacity.
  • Board-Level I/O Management  Leverage up to 159 I/Os in compact BGA packages for dense board routing and flexible interface selection.

Unique Advantages

  • Single-Chip Non-Volatile Configuration  Eliminates the need for external configuration memory and simplifies BOM and board design.
  • Instant-On  Powers up in microseconds, enabling faster system availability after power-up compared with designs that require external configuration.
  • Field Reconfiguration  Supports in-system updates and background programming, allowing design fixes and feature updates without removing the device from the system.
  • Flexible Voltage Support  Wide supply voltage range (1.71 V–3.465 V) enables compatibility with multiple I/O standards and mixed-voltage system domains.
  • Compact, High I/O Density Package  256-ball BGA packaging (14×14 mm) delivers a high I/O count (159) in a space-efficient footprint for dense board designs.
  • Commercial-Grade Availability  Specified for 0 °C to 85 °C operation with RoHS-compliant packaging for commercial applications.

Why Choose LCMXO640C-5B256C?

The LCMXO640C-5B256C positions itself as a practical, single-chip FPGA solution for commercial embedded designs that require instant-on behavior, moderate logic density and substantial I/O capability. Its non-volatile configuration, in-field reconfiguration features and compact 256-ball BGA package make it well suited for board-level glue logic, control functions and interface bridging where minimizing external components and reducing system complexity are priorities.

Designers benefit from a commercial-grade device with broad voltage support and RoHS-compliant packaging, enabling straightforward integration into a wide range of consumer and industrial-facing products that operate within the specified temperature range.

Request a quote or submit an inquiry to get pricing and availability for the LCMXO640C-5B256C and to discuss how it fits your next design.

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