LCMXO640C-5B256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LFBGA, CSPBGA |
|---|---|
| Quantity | 156 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA, CSPBGA | Number of I/O | 159 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80 | Number of Logic Elements/Cells | 640 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO640C-5B256C – MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LFBGA, CSPBGA
The LCMXO640C-5B256C is a MachXO family FPGA offering non-volatile, instant-on programmable logic in a single-chip solution. It provides a balance of logic density and I/O capability for glue logic, bus bridging, power-up control and general control logic applications.
Built for commercial-grade systems, this device combines approximately 640 logic elements with up to 159 I/Os in a 256-ball BGA package, supporting single-chip configuration without external memory and fast in-field reconfiguration options.
Key Features
- Core Logic Approximately 640 logic elements delivering flexible LUT-based logic for glue logic, bus interfacing and control functions.
- Logic Block Count 80 logic blocks supporting an efficient mapping of combinational and sequential logic.
- Memory Distributed on-chip RAM available in the MachXO640 family (approximately 6.1 Kbits as defined for the family member).
- Instant-On, Non-Volatile Single-chip non-volatile configuration enables instant-on startup without external configuration memory and eliminates external bitstream storage.
- In-Field Reconfiguration Supports TransFR™ reconfiguration for logic updates while the system operates and background programming via JTAG.
- I/O and Package Up to 159 I/Os in a 256-ball caBGA / LFBGA footprint (256-CABGA, 14×14 mm supplier package), with broad interface support across standard voltage rails.
- Voltage Range Operates across a wide supply range: 1.71 V to 3.465 V to accommodate multiple I/O standards and mixed-voltage designs.
- Power and Sleep Includes sleep mode capability for substantial static current reduction during low-power states.
- Commercial Temperature Grade Specified for operation from 0 °C to 85 °C for commercial applications.
- RoHS Compliant Device and packaging meet RoHS requirements.
Typical Applications
- Glue Logic and Bus Bridging Use the device to implement glue logic, bus translators and protocol adaptation between system components.
- Power-Up and Reset Control Single-chip non-volatile configuration and instant-on behavior simplify power sequencing and start-up control tasks.
- Control Logic Implement system state machines, peripheral control and timing logic with the device’s LUT-based resources and I/O capacity.
- Board-Level I/O Management Leverage up to 159 I/Os in compact BGA packages for dense board routing and flexible interface selection.
Unique Advantages
- Single-Chip Non-Volatile Configuration Eliminates the need for external configuration memory and simplifies BOM and board design.
- Instant-On Powers up in microseconds, enabling faster system availability after power-up compared with designs that require external configuration.
- Field Reconfiguration Supports in-system updates and background programming, allowing design fixes and feature updates without removing the device from the system.
- Flexible Voltage Support Wide supply voltage range (1.71 V–3.465 V) enables compatibility with multiple I/O standards and mixed-voltage system domains.
- Compact, High I/O Density Package 256-ball BGA packaging (14×14 mm) delivers a high I/O count (159) in a space-efficient footprint for dense board designs.
- Commercial-Grade Availability Specified for 0 °C to 85 °C operation with RoHS-compliant packaging for commercial applications.
Why Choose LCMXO640C-5B256C?
The LCMXO640C-5B256C positions itself as a practical, single-chip FPGA solution for commercial embedded designs that require instant-on behavior, moderate logic density and substantial I/O capability. Its non-volatile configuration, in-field reconfiguration features and compact 256-ball BGA package make it well suited for board-level glue logic, control functions and interface bridging where minimizing external components and reducing system complexity are priorities.
Designers benefit from a commercial-grade device with broad voltage support and RoHS-compliant packaging, enabling straightforward integration into a wide range of consumer and industrial-facing products that operate within the specified temperature range.
Request a quote or submit an inquiry to get pricing and availability for the LCMXO640C-5B256C and to discuss how it fits your next design.