LCMXO640C-5FTN256C

The LCMXO640C-5FTN256C is a MachXO family non-volatile FPGA optimized for glue logic, bus bridging and general control functions. Its architecture combines 640 logic elements arranged across 80 logic blocks with a high pin count—up to 159 I/Os—delivered in a 256-ball BGA package to address compact system and board-level interfacing needs.

Designed for commercial applications, the device offers instant-on single-chip configuration and flexible I/O options to simplify system design and reduce external component count. The part supports a wide supply range (1.71 V to 3.465 V) and commercial operating temperatures (0 °C to 85 °C).

Key Features

• Non-volatile, instant-on configuration — Single-chip non-volatile architecture enables immediate start-up without external configuration memory.
• Reconfigurability — Supports in-field reconfiguration and background programming of non-volatile memory for rapid updates.
• Logic density — 640 logic elements distributed across 80 logic blocks to implement glue logic, control paths and bus interfacing.
• I/O capacity and flexibility — Up to 159 I/Os with programmable sysIO buffer support for multiple interface standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS (as described in the MachXO family datasheet).
• Low-power modes — Sleep mode enables significant static current reduction for lower standby power.
• Package and mounting — Surface-mount 256-LBGA (supplier package: 256-FTBGA, 17×17 mm) for high pin count in a compact footprint.
• Supply and temperature — Operates from 1.71 V to 3.465 V and specified for commercial grade operation from 0 °C to 85 °C.
• Standards and system support — MachXO family architecture supports IEEE 1149.1 boundary scan and in-system programming standards noted in the family datasheet.

Typical Applications

• Glue Logic and System Control — Implement chip-to-chip glue logic, power-up sequencing and control-state machines where compact, non-volatile FPGA functionality is required.
• Bus Bridging and Interfacing — Bridge and adapt between bus standards using the device’s high I/O count and programmable I/O buffer capabilities.
• Board-Level Integration — Replace discrete logic or reduce external glue to simplify BOM and PCB routing in compact systems.

Unique Advantages

• Instant-on operation: Non-volatile single-chip configuration removes the need for external configuration memory and enables immediate device availability at power-up.
• Reduced BOM and board area: High I/O-to-logic density and a compact 256-ball BGA package minimize the need for external glue logic and associated components.
• Flexible interfacing: Programmable sysIO buffer and broad interface support simplify design across multiple voltage domains and signaling standards.
• Field update capability: Background programming and in-field reconfiguration support maintenance and feature updates without prolonged downtime.
• Low-power standby: Sleep mode provides substantial static current reduction for systems that require low standby consumption.
• Commercial-grade operating range: Specified for 0 °C to 85 °C operation and a wide supply voltage range to match common commercial system requirements.

Why Choose LCMXO640C-5FTN256C?

The LCMXO640C-5FTN256C combines non-volatile instant-on behavior with a dense logic fabric and extensive I/O to address a wide range of commercial system-level functions—glue logic, bus interfacing and control applications—while minimizing external components. Its compact 256-ball BGA package and programmable I/O support simplify board-level integration in space-constrained designs.

Built on the MachXO family architecture, the device benefits from established design flow support and in-system programmability options described in the MachXO family datasheet, making it suitable for teams that need a reliable, reconfigurable solution for commercial embedded systems.

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