LCMXO640C-5M100C

IC FPGA 74 I/O 100CSBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 74 640 100-LFBGA, CSPBGA

Quantity 542 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-CSBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LFBGA, CSPBGANumber of I/O74Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640C-5M100C – MachXO FPGA, 640 logic elements, 74 I/Os, 100-LFBGA

The LCMXO640C-5M100C is a MachXO family Field Programmable Gate Array (FPGA) from Lattice Semiconductor designed for single-chip, non-volatile logic implementations. It combines 640 logic elements with up to 74 I/Os in a compact 100-ball LFBGA/CSPBGA package for space‑efficient board designs.

Optimized for glue logic, bus bridging, bus interfacing, power‑up control and general control logic, the device delivers instant-on non‑volatile operation, flexible I/O buffering and in-field reconfiguration options while operating over a wide supply range and commercial temperature grade.

Key Features

  • Core Logic  640 logic elements (LUT4 architecture) suitable for glue logic and control functions; family architecture supports density migration across MachXO devices.
  • Memory  Approximately 6.1 Kbits of distributed RAM (family data); no embedded block SRAM (EBR) in this density point.
  • I/O  74 user I/Os with a programmable sysIO buffer supporting a wide range of interfaces, including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS.
  • Non‑volatile, Instant‑on  Single‑chip non‑volatile architecture provides instant-on operation without external configuration memory and supports background programming and in-field updates.
  • Reconfiguration  TransFR™ reconfiguration enables in-field logic updates while the system is operating; SRAM-based logic can be reconfigured in milliseconds and non‑volatile memory can be programmed via JTAG.
  • Low‑power Modes  Sleep mode available for up to 100× static current reduction to minimize standby power consumption.
  • Power and Clocking  Operates across a wide VCC range (1.71 V to 3.465 V); family devices include onboard oscillator and system clock support (family-level PLL options vary by density).
  • Packaging and Grade  Available in a 100‑LFBGA / 100‑ball csBGA (8×8 mm) package; commercial grade with an operating temperature range of 0 °C to 85 °C.
  • System Support  Supports IEEE 1149.1 boundary scan and IEEE 1532 in-system programming for board-level testability and field programming.

Typical Applications

  • Glue Logic and Control  Implement glue logic to integrate ASICs, microcontrollers and peripherals with compact, reprogrammable logic in a single chip.
  • Bus Bridging and Interfacing  Bridge or adapt between bus standards and manage signal conditioning with flexible I/O options and programmable buffers.
  • Power‑up and Reset Control  Centralize power sequencing, reset distribution and system supervision using instant‑on, non‑volatile logic that initializes in microseconds.
  • Peripheral and UI Control  Manage user interfaces, LEDs, buttons and local peripherals where compact footprint and reconfigurability speed product updates.

Unique Advantages

  • Single‑chip non‑volatile design: Eliminates the need for external configuration memory for simpler BOM and faster start-up.
  • Instant‑on capability: Powers up in microseconds to meet fast initialization requirements in embedded systems.
  • Field reconfiguration: TransFR™ and JTAG programming enable in‑field updates and background programming without taking the system offline.
  • Flexible I/O support: Broad interface support (LVCMOS/LVTTL/PCI/LVDS and more) simplifies integration across mixed‑signal and mixed‑voltage environments.
  • Low standby power: Sleep mode reduces static current by up to 100×, aiding power-sensitive applications.
  • Compact packaging: 100‑ball LFBGA/CSPBGA option provides high I/O density in an 8×8 mm footprint for space-constrained boards.

Why Choose LCMXO640C-5M100C?

The LCMXO640C-5M100C is positioned to deliver a balanced combination of instant‑on non‑volatile operation, reconfigurability and versatile I/O in a compact commercial‑grade package. With 640 logic elements and 74 I/Os, it is well suited for designers implementing glue logic, protocol bridging, power‑up control and peripheral management where board space and fast initialization matter.

Backed by MachXO family features such as background programming, in‑system programming, and support from the MachXO design tools, this device provides a practical, scalable solution for embedded systems that require field updateability and reliable single‑chip configuration.

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