LCMXO640C-5T100C

IC FPGA 74 I/O 100TQFP
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 74 640 100-LQFP

Quantity 1,442 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LQFPNumber of I/O74Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640C-5T100C – MachXO Field Programmable Gate Array (FPGA) IC 74 I/O 640 Logic Elements 100-LQFP

The LCMXO640C-5T100C is a MachXO family field programmable gate array (FPGA) in a 100-pin LQFP package optimized for glue logic, interfacing and system control applications. It delivers a non-volatile, reconfigurable core with 640 logic elements and 74 user I/Os, supporting compact, single-chip implementations where instant-on behavior and flexible I/O are required.

Designed for commercial-grade designs, the device combines MachXO family capabilities—single-chip non-volatile configuration, in-field reconfiguration and low-power modes—with a surface-mount 100-LQFP (14×14 mm) footprint, making it suitable for space- and cost-conscious embedded systems.

Key Features

  • Reconfigurable non-volatile core – MachXO family architecture provides single-chip non-volatile configuration with instant-on behavior and no external configuration memory required.
  • Logic capacity – 640 logic elements suitable for glue logic, bus bridging and control logic tasks.
  • I/O – 74 general-purpose I/Os exposed in the 100-LQFP package to support a wide range of external interfaces.
  • Voltage flexibility – Operates from 1.71 V to 3.465 V, enabling compatibility with multiple system voltage rails.
  • Packaging and mounting – 100-LQFP (supplier package listed as 100-TQFP 14×14) in a surface-mount package for standard PCB assembly.
  • Commercial temperature grade – Specified for 0 °C to 85 °C operation to match typical commercial embedded environments.
  • Low-power and field update features – Family-level capabilities include sleep mode with substantial static current reduction and TransFR™ in-field reconfiguration for background updates while the system operates.
  • Programmability and security – Supports JTAG-based programming and single-chip configuration for simplified deployment and improved bitstream security.
  • Environmental compliance – RoHS compliant to meet current lead-free manufacturing requirements.

Typical Applications

  • System Glue Logic – Replace discrete glue components with compact FPGA logic for bus interfacing, address decoding and control signal consolidation.
  • Peripheral and Bus Bridging – Implement protocol adaptation and bridge functions between different voltage domains using the device’s flexible I/O and voltage range.
  • Power-up and Control Sequencing – Use the instant-on, single-chip configuration to manage power sequencing and deterministic system bring-up.
  • Embedded Control and State Machines – Implement compact control logic, user interfaces and finite-state machines leveraging 640 logic elements and abundant I/O.

Unique Advantages

  • Single-chip, instant-on implementation: Eliminates external configuration memory and accelerates system start-up.
  • Flexible I/O and voltage support: 74 I/Os and a wide supply voltage range simplify integration with multiple peripherals and power rails.
  • Commercial-grade reliability: Specified 0 °C to 85 °C operation and surface-mount packaging for standard production environments.
  • Field update capability: TransFR™ background reconfiguration enables in-field logic updates without halting system operation.
  • RoHS compliance: Supports lead-free manufacturing processes and environmental requirements.
  • Compact package: 100-LQFP (14×14 mm) reduces board area while providing ample I/O for mid-density designs.

Why Choose LCMXO640C-5T100C?

The LCMXO640C-5T100C pairs a non-volatile MachXO family architecture with a mid-density logic resource set—640 logic elements—and 74 I/Os in a compact 100-LQFP surface-mount package. It is targeted at engineers who need instant-on, single-chip configurability for glue logic, bus bridging and embedded control without the overhead of external configuration memories.

For commercial embedded designs where board space, power flexibility and field reconfiguration matter, this device offers a practical balance of integration and system-level capabilities supported by MachXO family features such as low-power sleep modes, JTAG programmability and background reprogramming.

Request a quote or submit an inquiry to receive pricing and availability for the LCMXO640C-5T100C for your next design.

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