LCMXO640E-3B256C

IC FPGA 159 I/O 256CABGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LFBGA, CSPBGA

Quantity 1,825 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGA, CSPBGANumber of I/O159Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640E-3B256C – MachXO FPGA, 640 logic elements, 159 I/Os, 256-LFBGA

The LCMXO640E-3B256C is a MachXO family field programmable gate array (FPGA) offered in a 256-ball LFBGA/CSPBGA package. It combines non-volatile, instant-on operation with a compact FPGA architecture providing 640 logic elements and up to 159 I/Os for glue logic, bus interfacing and control applications.

Designed for commercial-grade embedded designs, this device supports in-field reconfiguration and low-power modes while operating from a core supply of 1.14 V to 1.26 V and a commercial temperature range of 0 °C to 85 °C.

Key Features

  • Non-volatile, instant-on architecture  Single-chip non-volatile configuration enables power-up in microseconds without external configuration memory.
  • Reconfigurability and field updates  Supports in-field logic updates and background programming of non-volatile memory for flexible maintenance and upgrades.
  • Logic capacity  Contains 640 logic elements (LUTs) suitable for glue logic, bridging and control functions.
  • I/O and package  Provides up to 159 I/Os in a 256-LFBGA (caBGA/CSPBGA) package for dense pin requirements in compact systems.
  • Embedded and distributed memory  MachXO family devices include distributed RAM (LCMXO640 family lists approximately 6.1 Kbits of distributed RAM in family documentation) for small buffering and state storage.
  • Low-power modes  Supports a sleep mode to substantially reduce static current for power-sensitive applications.
  • Voltage and temperature  Operates from a core supply range of 1.14 V to 1.26 V and rated for commercial operation from 0 °C to 85 °C.
  • Standards and programmability  Family-level support for JTAG programming and IEEE 1149.1 boundary scan; devices are RoHS compliant.

Typical Applications

  • Glue logic and system control  Implement power-up sequencing, reset control, and board-level control functions using compact reprogrammable logic.
  • Bus bridging and interfacing  Bridge between disparate buses or perform protocol adaptation with flexible I/O options and dense pin count.
  • User interface and peripheral control  Manage keypads, LEDs, and peripheral timing without external microcontroller overhead.
  • Embedded system glue  Replace discrete logic libraries with a single-chip, reconfigurable solution to reduce BOM and PCB area.

Unique Advantages

  • Instant-on, single-chip configuration: Eliminates the need for external configuration memory and enables rapid system startup.
  • Field reconfiguration capability: Allows in-field logic updates and background programming of non-volatile memory for iterative development and updates.
  • High I/O density in a compact package: 159 I/Os in a 256-ball LFBGA provide extensive connectivity in space-constrained designs.
  • Commercial-grade robustness: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream embedded applications.
  • Developer ecosystem: MachXO family support with ispLEVER design tools and common synthesis tool support to streamline implementation and timing closure.

Why Choose LCMXO640E-3B256C?

The LCMXO640E-3B256C is positioned for designers who need a compact, non-volatile FPGA with enough logic and I/O to replace discrete glue logic and simple CPLD implementations. With 640 logic elements, up to 159 I/Os, single-chip non-volatile configuration and field reconfiguration support, it simplifies board design while enabling fast power-up and flexible in-field updates.

This part is suitable for commercial embedded systems that require reduced BOM complexity, instant-on behavior, and a compact BGA package. The MachXO family tooling and density migration options support scalable design choices and ongoing product maintenance.

If you would like pricing, availability, or a formal quote for the LCMXO640E-3B256C, request a quote or submit an inquiry to receive a prompt response.

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