LCMXO640E-3BN256C

The LCMXO640E-3BN256C is a MachXO-family FPGA optimized for glue logic, bus bridging, power-up control and general control logic. It combines non-volatile configuration, instant-on behavior and reconfigurable FPGA-style logic in a single surface-mount package.

This device provides 640 logic elements and up to 159 I/Os in a 256-ball package (256-LFBGA / 256-CABGA 14×14 mm), operating from a 1.14 V to 1.26 V supply and rated for commercial temperatures (0 °C to 85 °C).

Key Features

• Non-volatile instant-on architecture  Single-chip configuration with no external configuration memory required, enabling microsecond startup and enhanced design security.
• Reconfigurability and in-field updates  Supports background programming and TransFR™ reconfiguration for in-field logic updates and millisecond SRAM logic reconfiguration.
• Logic density  640 logic elements (LUT-based) suitable for glue logic, bus interfacing and control applications.
• Memory  Approximately 6.1 Kbits of distributed RAM available in the LCMXO640 family; no embedded block SRAM (EBR) in this density level.
• I/O capacity and flexibility  Up to 159 I/Os with programmable sysIO™ buffer support for multiple signaling standards including LVCMOS (1.2–3.3 V), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS (as documented for the MachXO family).
• Low-power operation  Family sleep mode reduces static current by up to 100×, useful for power-sensitive control applications.
• Package and mounting  Surface-mount 256-ball LFBGA / caBGA (256-CABGA, 14×14 mm) package suitable for compact board designs.
• Commercial temperature grade  Rated for 0 °C to 85 °C operation.

Typical Applications

• Glue Logic and System Control  Implement control-state machines, reset sequencing and system glue logic with instant-on non-volatile configuration.
• Bus Bridging and Interfacing  Bridge and translate between different bus standards using flexible I/O buffers and abundant I/O pins.
• Power-Up and Reset Control  Manage power sequencing and deterministic startup behavior leveraging single-chip configuration and fast startup.
• Peripheral and Sensor Interfaces  Aggregate and condition peripheral signals or sensor data with compact logic and I/O resources.

Unique Advantages

• Single-chip, secure configuration: Eliminates external configuration memory and bit-stream transfer, simplifying BOM and improving design security.
• Instant-on behavior: Microsecond-scale power-up enables predictable, fast system startup for time-sensitive applications.
• Flexible I/O standards: Wide range of supported interfaces lets you adapt the device to diverse signaling environments without additional level-shifting ICs.
• Field reprogrammability: Background programming and TransFR™ reconfiguration enable in-field updates and quick feature iterations.
• Low-power sleep capability: Dramatically reduces static current during idle periods, extending usability in power-conscious designs.
• Compact package with high I/O count: 159 I/Os in a 256-ball package enable dense, board-efficient designs.

Why Choose LCMXO640E-3BN256C?

The LCMXO640E-3BN256C positions itself as a compact, non-volatile FPGA solution for designers who need instant-on behavior, flexible I/O and field reconfigurability in a single surface-mount package. With 640 logic elements and up to 159 I/Os, it is well suited to glue logic, bus interfacing and control tasks where a predictable startup and secure configuration are important.

Its commercial temperature rating, defined supply range (1.14 V–1.26 V) and 256-ball package make it a practical choice for space-constrained PCBs and mid-volume embedded systems. The MachXO family ecosystem supports background programming and in-field updates, offering a clear upgrade path for evolving designs.

Request a quote or submit an inquiry to start procurement and evaluate the LCMXO640E-3BN256C for your next control or interface design.