LCMXO640E-3FN256I

IC FPGA 159 I/O 256FBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-BGA

Quantity 753 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O159Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640E-3FN256I – MachXO Field Programmable Gate Array (FPGA) IC 159 I/Os, 640 Logic Elements, 256-BGA

The LCMXO640E-3FN256I is a MachXO field-programmable gate array from Lattice Semiconductor Corporation. It provides approximately 640 logic elements and up to 159 I/Os in a compact 256-FPBGA (17×17) surface-mount package.

Engineered for industrial applications, this device operates from a 1.14 V to 1.26 V supply and is specified for an operating temperature range of −40 °C to 100 °C. RoHS compliance supports environmental requirements in production designs.

Key Features

  • FPGA Core  Approximately 640 logic elements provide mid-density programmable logic for integration of custom logic functions.
  • I/O Capability  159 available I/O pins enable broad external connectivity for interfacing with peripherals and system signals.
  • Package and Mounting  256-FPBGA (17×17) package in a surface-mount form factor for compact board integration.
  • Supply Voltage  Operates from 1.14 V to 1.26 V, allowing designs targeting this low-voltage domain.
  • Industrial Temperature Rating  Specified for −40 °C to 100 °C, meeting temperature requirements for industrial environments.
  • Environmental Compliance  RoHS compliant to align with regulatory and assembly process requirements.

Unique Advantages

  • Compact, high-density package: The 256-FPBGA (17×17) package enables a small PCB footprint while supporting a substantial I/O count.
  • Mid-density programmable logic: Approximately 640 logic elements allow implementation of glue logic, control functions, and custom peripheral interfaces without discrete IC proliferation.
  • Broad I/O availability: 159 I/Os provide flexibility to connect multiple peripherals and sensors directly to the FPGA fabric.
  • Industrial temperature support: Rated from −40 °C to 100 °C for deployment in industrial environments requiring extended temperature operation.
  • Low-voltage operation: The 1.14 V–1.26 V supply range supports power-sensitive designs and modern low-voltage systems.
  • Regulatory alignment: RoHS compliance supports environmental and manufacturing requirements.

Why Choose LCMXO640E-3FN256I?

The LCMXO640E-3FN256I delivers a balance of programmable logic capacity, high I/O count, and compact packaging tailored for industrial applications. Its operating voltage and temperature specifications make it suitable for designs that require reliable performance across a wide environmental range.

This device is well suited to engineers and procurement teams seeking a mid-density FPGA solution from Lattice Semiconductor Corporation that combines integration, small footprint, and industrial-grade temperature capability for long-term deployment.

Request a quote or contact sales to obtain pricing, availability, and technical support for the LCMXO640E-3FN256I.

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