LCMXO640E-3FTN256I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LBGA |
|---|---|
| Quantity | 46 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 159 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80 | Number of Logic Elements/Cells | 640 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO640E-3FTN256I – MachXO FPGA with 640 Logic Elements, 159 I/Os
The LCMXO640E-3FTN256I is a MachXO family Field Programmable Gate Array (FPGA) from Lattice Semiconductor, featuring 640 logic elements and up to 159 user I/Os in a 256-ball BGA package. Designed for glue logic, bus interfacing and control applications, this non-volatile, instant-on device delivers single-chip configurability with in-field reconfiguration and low-power modes suited to industrial systems.
Key Features
- Core Logic 640 logic elements provide flexible programmable logic capacity for control, glue logic and interface tasks.
- Memory Distributed on-chip RAM capacity is available for small data buffering and state storage (family-level distributed RAM ~6.1 Kbits).
- I/O and Package Up to 159 I/Os in a 256-ball package (supplier package: 256-FTBGA, 17×17 mm) for high pin-count requirements in compact footprints.
- Power Supply Operates from a core supply range of 1.14 V to 1.26 V, enabling compatibility with standard low-voltage system rails.
- Thermal and Grade Industrial-grade device rated for operation from -40 °C to 100 °C.
- Non-volatile, Instant-on Architecture Single-chip non-volatile configuration enables microsecond power-up and removes the need for external configuration memory.
- Reconfiguration and Programming Supports in-field reconfiguration (TransFR™) and background programming; JTAG-programmable SRAM and non-volatile memory for secure updates.
- Flexible I/O Buffering Programmable sysIO buffers support multiple interface standards at the family level, including LVCMOS (1.2–3.3 V ranges listed at the family level), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
- System Support Boundary-scan (IEEE 1149.1), onboard oscillator and IEEE 1532 in-system programming support simplify board bring-up and lifecycle updates.
- Low-Power Modes Sleep mode capability enables significant static current reduction for power-sensitive systems (family-level sleep mode reduces static current by up to 100×).
- RoHS Compliant Manufactured to meet RoHS environmental requirements.
Typical Applications
- Glue Logic and System Control Implement power-up sequencing, reset generation and board-level control using compact programmable logic.
- Bus Bridging and Protocol Translation Use the device’s I/O density and flexible buffers to bridge mismatched interfaces or implement protocol adapters.
- User Interface and Peripheral Control Handle button scanning, LED control, and peripheral timing tasks with low-latency, deterministic logic.
- Industrial Automation Industrial temperature rating and robust I/O count make the device suitable for control-plane logic and signal conditioning in industrial equipment.
Unique Advantages
- Single-chip, instant-on configuration: Eliminates external configuration memory and enables microsecond power-up for systems that require fast startup.
- Field-updatable logic: TransFR™ reconfiguration and JTAG-programmable non-volatile memory let you update logic in the field without removing the device.
- High I/O density in a compact package: 159 I/Os in a 256-ball BGA (17×17 mm supplier package) supports complex board-level interfacing with a small PCB footprint.
- Industrial operating range: Rated from -40 °C to 100 °C for deployment in temperature-challenging environments.
- Power-efficient operation: Sleep mode delivers substantial static current reduction for power-managed systems.
- Standards-based system support: Boundary-scan and IEEE 1532 in-system programming simplify manufacturing test and field maintenance.
Why Choose LCMXO640E-3FTN256I?
The LCMXO640E-3FTN256I brings MachXO family advantages—non-volatile, instant-on configuration and in-field reprogrammability—into a compact, industrial-rated FPGA optimized for glue logic, interface bridging and control applications. Its combination of 640 logic elements, up to 159 I/Os, flexible I/O standards and low-power modes provides a practical, single-chip solution to reduce BOM complexity and accelerate system integration.
This device suits engineers and procurement teams seeking a reliable, reprogrammable logic element for industrial systems that need rapid startup, field updates and a dense I/O count in a small BGA package. Family-level tooling and standards support help ensure predictable integration and long-term maintainability.
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