LCMXO640E-3FTN256I

IC FPGA 159 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LBGA

Quantity 46 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O159Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640E-3FTN256I – MachXO FPGA with 640 Logic Elements, 159 I/Os

The LCMXO640E-3FTN256I is a MachXO family Field Programmable Gate Array (FPGA) from Lattice Semiconductor, featuring 640 logic elements and up to 159 user I/Os in a 256-ball BGA package. Designed for glue logic, bus interfacing and control applications, this non-volatile, instant-on device delivers single-chip configurability with in-field reconfiguration and low-power modes suited to industrial systems.

Key Features

  • Core Logic  640 logic elements provide flexible programmable logic capacity for control, glue logic and interface tasks.
  • Memory  Distributed on-chip RAM capacity is available for small data buffering and state storage (family-level distributed RAM ~6.1 Kbits).
  • I/O and Package  Up to 159 I/Os in a 256-ball package (supplier package: 256-FTBGA, 17×17 mm) for high pin-count requirements in compact footprints.
  • Power Supply  Operates from a core supply range of 1.14 V to 1.26 V, enabling compatibility with standard low-voltage system rails.
  • Thermal and Grade  Industrial-grade device rated for operation from -40 °C to 100 °C.
  • Non-volatile, Instant-on Architecture  Single-chip non-volatile configuration enables microsecond power-up and removes the need for external configuration memory.
  • Reconfiguration and Programming  Supports in-field reconfiguration (TransFR™) and background programming; JTAG-programmable SRAM and non-volatile memory for secure updates.
  • Flexible I/O Buffering  Programmable sysIO buffers support multiple interface standards at the family level, including LVCMOS (1.2–3.3 V ranges listed at the family level), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
  • System Support  Boundary-scan (IEEE 1149.1), onboard oscillator and IEEE 1532 in-system programming support simplify board bring-up and lifecycle updates.
  • Low-Power Modes  Sleep mode capability enables significant static current reduction for power-sensitive systems (family-level sleep mode reduces static current by up to 100×).
  • RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

  • Glue Logic and System Control  Implement power-up sequencing, reset generation and board-level control using compact programmable logic.
  • Bus Bridging and Protocol Translation  Use the device’s I/O density and flexible buffers to bridge mismatched interfaces or implement protocol adapters.
  • User Interface and Peripheral Control  Handle button scanning, LED control, and peripheral timing tasks with low-latency, deterministic logic.
  • Industrial Automation  Industrial temperature rating and robust I/O count make the device suitable for control-plane logic and signal conditioning in industrial equipment.

Unique Advantages

  • Single-chip, instant-on configuration: Eliminates external configuration memory and enables microsecond power-up for systems that require fast startup.
  • Field-updatable logic: TransFR™ reconfiguration and JTAG-programmable non-volatile memory let you update logic in the field without removing the device.
  • High I/O density in a compact package: 159 I/Os in a 256-ball BGA (17×17 mm supplier package) supports complex board-level interfacing with a small PCB footprint.
  • Industrial operating range: Rated from -40 °C to 100 °C for deployment in temperature-challenging environments.
  • Power-efficient operation: Sleep mode delivers substantial static current reduction for power-managed systems.
  • Standards-based system support: Boundary-scan and IEEE 1532 in-system programming simplify manufacturing test and field maintenance.

Why Choose LCMXO640E-3FTN256I?

The LCMXO640E-3FTN256I brings MachXO family advantages—non-volatile, instant-on configuration and in-field reprogrammability—into a compact, industrial-rated FPGA optimized for glue logic, interface bridging and control applications. Its combination of 640 logic elements, up to 159 I/Os, flexible I/O standards and low-power modes provides a practical, single-chip solution to reduce BOM complexity and accelerate system integration.

This device suits engineers and procurement teams seeking a reliable, reprogrammable logic element for industrial systems that need rapid startup, field updates and a dense I/O count in a small BGA package. Family-level tooling and standards support help ensure predictable integration and long-term maintainability.

Request a quote or submit an inquiry now to check availability and pricing for LCMXO640E-3FTN256I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up