LCMXO640E-3M132C

IC FPGA 101 I/O 132CSBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 101 640 132-LFBGA, CSPBGA

Quantity 817 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package132-CSPBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case132-LFBGA, CSPBGANumber of I/O101Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640E-3M132C – MachXO Non‑Volatile FPGA, 640 Logic Elements, 132‑LFBGA (101 I/O)

The LCMXO640E-3M132C is a member of the MachXO family of non‑volatile, instant‑on FPGAs optimized for glue logic, bus bridging, power‑up control and general control logic. It combines reconfigurable LUT‑based logic with flexible I/O in a compact 132‑ball CSPBGA (8×8 mm) surface‑mount package for commercial‑grade embedded designs.

Designed for single‑chip configuration with background programming and fast in‑field updates, the device addresses applications that require instant availability at power‑up, moderate logic density, and extensive I/O in a small footprint.

Key Features

  • Non‑volatile MachXO architecture Instant‑on single‑chip FPGA that requires no external configuration memory; supports non‑volatile and SRAM reconfiguration through JTAG and background programming.
  • Logic resources 640 logic elements and 80 logic blocks, providing a compact reconfigurable fabric for glue logic and control functions.
  • Embedded memory (family) LCMXO640 family devices provide approximately 6.1 Kbits of distributed RAM for small data buffering and state storage.
  • I/O count and package 101 I/O pins in a 132‑LFBGA (132‑CSPBGA, 8×8) package, offering a high pin‑to‑pin density in a compact footprint.
  • Power Core supply range 1.14 V to 1.26 V; family support for standard I/O power rails (multiple I/O voltage options supported by MachXO family architectures).
  • Low‑power modes Sleep mode capability enables up to 100× reduction in static current for energy‑sensitive designs.
  • Reconfiguration features TransFR™ in‑field reconfiguration and the ability to reprogram SRAM‑based logic in milliseconds for field updates while the system operates.
  • System features Single‑chip solution with no external configuration memory, JTAG programmability and support for background programming and secure configuration.
  • Package and grade Surface‑mount 132‑LFBGA (CSPBGA) package; commercial grade with operating temperature 0 °C to 85 °C.
  • Environmental compliance RoHS compliant.

Typical Applications

  • Glue Logic and System Control Implement address decoding, control sequencing and interface glue in compact embedded systems where instant‑on behavior and reconfigurability are valuable.
  • Bus Bridging and Interfacing Bridge disparate buses and manage protocol conversions using the device’s flexible I/O and moderate logic resource set.
  • Power‑Up and Reset Control Provide reliable power sequencing, reset management and supervisory control without external configuration memory.
  • Peripheral and Sensor Control Consolidate multiple small state machines and timing functions for sensors, displays and peripheral devices into a single package.

Unique Advantages

  • Single‑chip, instant‑on operation: Eliminates the need for external configuration memory and delivers immediate availability at power‑up.
  • Compact, pin‑rich package: 101 I/Os in a 132‑ball CSPBGA (8×8 mm) balances I/O density with a small PCB footprint.
  • Field reconfigurable: TransFR™ and JTAG‑based programming enable rapid in‑field updates and background programming to reduce downtime.
  • Low static power option: Sleep mode reduces static current by up to 100× for power‑sensitive applications.
  • Family ecosystem: MachXO family features—such as flexible I/O standards and family migration options—support design scalability and reuse.
  • Commercial grade reliability: Rated for 0 °C to 85 °C operating temperature and RoHS compliance for standard commercial deployments.

Why Choose LCMXO640E-3M132C?

LCMXO640E-3M132C is positioned for embedded and control applications that require a compact, non‑volatile FPGA with moderate logic capacity and a generous number of I/Os. Its instant‑on behavior, single‑chip configuration and in‑field reconfiguration capabilities make it well suited for designs where boot time, security of configuration and post‑deployment updates matter.

This device is ideal for engineers seeking to reduce BOM complexity and PCB area while maintaining flexible, reprogrammable logic and robust I/O support. Backed by the MachXO family features, it offers a clear upgrade path for similar design requirements within the same architecture family.

Request a quote or submit a sales inquiry to check availability, lead times and pricing for the LCMXO640E-3M132C. Our team can provide technical information and support to help integrate this device into your design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up