LCMXO640E-3MN100I

The LCMXO640E-3MN100I is a MachXO family Field Programmable Gate Array (FPGA) optimized for glue logic, interface bridging, power-up control and general control tasks. It combines non-volatile instant-on architecture with a compact 100-ball csBGA / 100-LFBGA package and is targeted at industrial applications requiring robust temperature range and flexible I/O.

This device provides 640 logic elements and 74 user I/Os in a surface-mount 100-ball package, delivering a compact, reconfigurable solution for board-level control and interface functions while supporting in-field reconfiguration and reduced system-level BOM.

Key Features

• Non-volatile, Instant-On – Single-chip non-volatile architecture enables rapid power-up without external configuration memory.
• Reconfigurable Logic – Approximately 640 logic elements for implementing glue logic, bus interfacing, and control functions with background and in-field reconfiguration support.
• TransFR™ In-field Update – Supports in-field logic updates while the system is operating (series-level TransFR capability).
• Flexible I/O – 74 I/Os provided in the 100-ball package with programmable I/O buffer support across common digital interfaces (series-level sysIO buffer support).
• Low Power Modes – Sleep mode support for substantial static current reduction (series-level sleep mode capability).
• Package and Mounting – Surface-mount 100-LFBGA / 100-CSBGA (8×8 mm) packaging for compact board footprint and high pin density.
• Voltage and Temperature – Operates from 1.14 V to 1.26 V; specified operating temperature from −40 °C to 100 °C for industrial deployments.
• RoHS Compliant – Meets RoHS requirements for lead-free manufacturing.

Typical Applications

• Glue Logic and System Control – Implement board-level control, reset sequencing, and custom state machines using the device’s reconfigurable logic.
• Bus Bridging and Interfacing – Bridge and adapt interfaces between subsystems with flexible I/O and programmable buffers.
• Power-Up and Reset Management – Manage power sequencing, supervisors, and deterministic start-up using non-volatile instant-on behavior.
• Field Upgradeable Control – Enable in-field logic updates for firmware-like feature additions or bug fixes without replacing hardware.

Unique Advantages

• Instant-On Single-Chip Solution: Eliminates external configuration memory and delivers immediate availability at power-up, simplifying system design.
• Compact, High-Density Package: 100-ball csBGA / LFBGA in an 8×8 mm footprint provides a small board area with 74 usable I/Os.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support a wide range of industrial environments.
• In-Field Reconfiguration: TransFR capability lets you update logic while the system is live, reducing downtime for feature updates or fixes.
• Reduced System BOM: Non-volatile configuration and integrated functionality reduce external components and simplify supply chain management.

Why Choose LCMXO640E-3MN100I?

The LCMXO640E-3MN100I delivers a balanced mix of non-volatile instant-on architecture, 640 logic elements, and 74 flexible I/Os in a compact 100-ball surface-mount package. Its support for in-field reconfiguration and sleep modes makes it well suited for industrial control, interface bridging, and system management tasks where small footprint and rapid availability at power-up matter.

Engineers seeking a compact, reconfigurable device with industrial temperature tolerance and RoHS compliance will find the LCMXO640E-3MN100I a practical choice for reducing BOM complexity while retaining field upgradeability and reliable board-level control.

If you would like pricing or availability, request a quote or submit an inquiry to receive further purchasing information and lead-time details.