LCMXO640E-3MN100C

IC FPGA 74 I/O 100CSBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 74 640 100-LFBGA, CSPBGA

Quantity 901 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package100-CSBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LFBGA, CSPBGANumber of I/O74Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640E-3MN100C – MachXO Field Programmable Gate Array (FPGA) IC 74 I/Os, 640 Logic Elements, 100-LFBGA/CSPBGA

The LCMXO640E-3MN100C is a MachXO family FPGA from Lattice Semiconductor optimized for glue logic, bus bridging, power-up control and other system control functions. It combines non-volatile, instant-on operation with a compact 100-ball CSP/BGA package and a balanced mix of logic capacity and I/O for space-conscious commercial designs.

With 640 logic elements and 74 I/Os in a 100-LFBGA/CSPBGA footprint, this device addresses applications that require reconfigurable control and interface logic while minimizing external configuration complexity and board area.

Key Features

  • Non-volatile, instant-on — Single-chip non-volatile architecture enables instant-on operation and eliminates the need for external configuration memory.
  • Reconfigurable in the field — Supports in-field reconfiguration and background programming of non-volatile memory for rapid updates and system flexibility.
  • Sleep mode — Provides a sleep mode that allows significant static current reduction for lower-power standby operation.
  • Logic capacity — 640 logic elements suitable for glue logic, control and bridging tasks in commercial applications.
  • I/O and package — 74 I/Os in a 100-LFBGA / 100-CSBGA (8×8 mm) package for high pin-to-footprint density.
  • Low-voltage core — Core supply specified at 1.14 V to 1.26 V to match system low-voltage designs.
  • Commercial temperature range — Rated for 0 °C to 85 °C operation for standard commercial environments.
  • RoHS compliant — Device is lead-free and RoHS compliant.

Typical Applications

  • Glue Logic and System Control — Implement power sequencing, reset logic, and board-level control functions with instant-on, single-chip configuration.
  • Bus Bridging and Interfacing — Bridge between buses and implement protocol adaptation using available I/O and reconfigurable logic.
  • I/O Expansion and Signal Conditioning — Provide programmable I/O buffering and custom interface logic in compact designs.
  • Field-Updatable Control Logic — Deploy firmware updates and feature upgrades in the field with background programming and reconfiguration capabilities.

Unique Advantages

  • Single-chip configuration — Eliminates external configuration memory and simplifies BOM and board layout.
  • Instant-on responsiveness — Powers up in microseconds to reduce system initialization time.
  • Compact package with high I/O count — 100-ball CSP/BGA package delivers 74 I/Os and 640 logic elements in a small footprint for space-constrained designs.
  • Field flexibility — In-field reconfiguration and non-volatile background programming enable maintenance and feature upgrades without full system downtime.
  • Commercial-grade reliability — Designed for 0 °C to 85 °C operation and RoHS-compliant manufacturing processes.
  • Low-voltage core operation — 1.14–1.26 V core supply supports integration into modern low-voltage power architectures.

Why Choose LCMXO640E-3MN100C?

The LCMXO640E-3MN100C positions itself as a compact, non-volatile FPGA option for commercial embedded designs that require instant-on behavior, field programmability, and a high I/O-to-footprint ratio. Its 640 logic elements and 74 I/Os in a 100-LFBGA/CSPBGA package make it well suited for board-level control, interface bridging, and I/O expansion tasks where minimizing external components and PCB area is important.

Backed by the MachXO family architecture, this device provides a practical balance of reconfigurability, low-voltage operation, and commercial-grade robustness—making it a fit for engineers seeking scalable, serviceable logic solutions with reduced system complexity.

Request a quote or submit an inquiry to get pricing and availability for the LCMXO640E-3MN100C and to discuss how it can fit into your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up