LCMXO640E-3M132I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 101 640 132-LFBGA, CSPBGA |
|---|---|
| Quantity | 608 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSPBGA (8x8) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-LFBGA, CSPBGA | Number of I/O | 101 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80 | Number of Logic Elements/Cells | 640 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO640E-3M132I – MachXO Field Programmable Gate Array (FPGA) IC 101 I/O, 640 Logic Elements, 132-LFBGA/CSPBGA
The LCMXO640E-3M132I is a MachXO family FPGA optimized for glue logic, control and interfacing tasks. It combines a compact BGA package with 640 logic elements and 101 programmable I/Os to deliver a flexible, instant-on programmable-logic solution for industrial applications.
Built for surface-mount deployment and rated for industrial temperature operation, this device targets system control, bus interfacing and board-level glue logic where integration, configurability and low-power standby are important.
Key Features
- Core Logic — 640 logic elements provide a mid-range programmable fabric suitable for control, glue logic and interfacing functions.
- Programmable I/O — 101 I/O pins in the 132-ball CSPBGA package enable dense pin routing and flexible signal interfacing across multiple buses and peripherals.
- Non-volatile, Instant-On Family Features — As part of the MachXO family, the device supports single-chip non-volatile configuration and instant-on startup without external configuration memory.
- In-field Reconfiguration — MachXO family features include TransFR™ reconfiguration for updating SRAM-based logic while the system operates and background programming of non-volatile memory.
- Low-power and Sleep Mode — Family-level sleep mode capability can dramatically reduce static current for low-power standby operation.
- Flexible I/O Standards — Family support for a wide range of I/O interfaces (including LVCMOS, LVTTL, LVDS, Bus-LVDS, LVPECL, RSDS and PCI) enables compatibility with diverse board-level signaling requirements.
- Packaging and Mounting — 132-LFBGA / 132-CSPBGA (8×8 mm) surface-mount package balances small PCB footprint with 101 I/Os for compact board designs.
- Power and Temperature — Core supply range 1.14 V to 1.26 V and industrial operating temperature of −40 °C to 100 °C support robust deployment in harsh environments.
- Compliance — RoHS-compliant packaging supports restricted-substance conformance.
- System Support — MachXO family-level features include IEEE 1149.1 boundary scan and IEEE 1532 in-system programming for manufacturing test and field updates.
Typical Applications
- Glue Logic and Board-Level Integration — Implement address decoding, timing alignment and protocol adaptation with 640 logic elements and abundant I/O.
- Bus Bridging and Interfacing — Use the flexible I/O standards support to bridge between disparate bus voltages and signaling formats.
- Power-Up and System Control — Implement power sequencing, reset management and supervisory control with instant-on configuration and low-power sleep capability.
- Industrial Control and Automation — Industrial temperature rating and surface-mount BGA package make the device suitable for embedded controllers and sensor interfaces in industrial equipment.
Unique Advantages
- Instant-On, Single-Chip Configuration: Eliminates external configuration memory and reduces system complexity and boot time.
- In-Field Logic Updates: TransFR™ reconfiguration enables updates to SRAM-based logic while the system remains operational, minimizing downtime.
- Compact, High-Pin-Count Package: 132-ball CSPBGA (8×8 mm) delivers 101 I/Os in a small footprint for space-constrained PCBs.
- Industrial Temperature Range: Rated −40 °C to 100 °C to support deployment in demanding environments.
- Broad Interface Support: Programmable I/O compatibility with multiple standards simplifies integration with legacy and modern interfaces.
- RoHS Compliance: Environmentally compliant packaging reduces regulatory risk for manufacturing.
Why Choose LCMXO640E-3M132I?
The LCMXO640E-3M132I positions itself as a compact, industrial-grade programmable logic device for designers who need reliable board-level integration without external configuration memory. With 640 logic elements, 101 I/Os and MachXO family capabilities such as instant-on configuration and in-field reconfiguration, it reduces BOM complexity while enabling flexible interface and control implementations.
This device is well-suited for engineers building industrial controllers, bus bridges, power-sequencing circuits and other embedded systems that require a balance of logic capacity, I/O density and temperature robustness, backed by MachXO family system features like boundary scan and in-system programming.
Request a quote or submit an inquiry to receive pricing, lead-time and availability information for the LCMXO640E-3M132I. Our team will assist with technical details and procurement options.

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