LCMXO640E-3MN132I

The LCMXO640E-3MN132I is a MachXO family FPGA optimized for glue logic, bus bridging, control and interfacing tasks. It combines non-volatile, reconfigurable logic with a compact 132‑ball CSPBGA package and an industrial temperature rating, delivering an integrated solution for space‑constrained embedded systems.

Key platform attributes include 640 logic elements, 101 user I/Os, a core supply range of 1.14–1.26 V, and operation from ‑40 °C to 100 °C. The device is RoHS compliant and designed for surface‑mount PCB assembly.

Key Features

• Non‑volatile, instant‑on architecture — MachXO family features enable single‑chip configuration without external memory and fast power‑up behavior suitable for systems that require immediate availability.
• Reconfigurable logic — 640 logic elements provide flexible implementation of glue logic, bus interfacing, and control functions, with in‑field reconfiguration capability as supported by the MachXO family.
• Programmable I/O — 101 I/Os in the 132‑ball CSPBGA package enable high I/O‑to‑logic density for signal buffering, bridging, and peripheral interfaces.
• Power and low‑power modes — Core voltage support of 1.14–1.26 V and MachXO family sleep mode capability allow designers to manage static current for power‑sensitive applications.
• Package and mounting — 132‑LFBGA (CSPBGA, 8×8 mm) surface‑mount package provides a compact footprint for space‑constrained boards.
• Industrial temperature range — Rated for operation from ‑40 °C to 100 °C to meet industrial environment requirements.
• Standards and programmability — MachXO family supports JTAG programming and background programming of non‑volatile memory, enabling secure configuration and in‑field updates.
• Compliance — Device is RoHS compliant.

Typical Applications

• Glue Logic and System Control — Implement power‑up sequencing, reset control, and simple state machines using the device’s reconfigurable logic.
• Bus Bridging and Protocol Interfacing — Use the 101 I/Os to bridge legacy and modern buses or to implement custom interface logic in compact designs.
• Peripheral and Sensor Aggregation — Consolidate discrete glue functions and I/O buffering for sensors and peripherals to reduce BOM and PCB complexity.
• Embedded Control in Industrial Equipment — Leverage the industrial temperature rating and surface‑mount package for control logic in factory and process environments.

Unique Advantages

• Single‑chip non‑volatile solution: Eliminates the need for external configuration memory, simplifying BOM and board routing.
• Fast system availability: Instant‑on behavior reduces system initialization time where quick startup is important.
• Compact, high I/O density: 101 configurable I/Os in a 132‑ball CSPBGA enable high connectivity in a small package footprint.
• Industrial robustness: Operation from ‑40 °C to 100 °C supports deployment in harsher operating environments.
• In‑field reconfiguration: Background programming and JTAG support allow updates to non‑volatile configuration without extensive downtime.
• RoHS compliance: Environmentally compliant packaging suitable for modern manufacturing requirements.

Why Choose LCMXO640E-3MN132I?

The LCMXO640E-3MN132I positions itself as a compact, industrial‑rated MachXO FPGA option for designers who need reconfigurable, non‑volatile logic with a high I/O count in a small CSPBGA package. Its combination of 640 logic elements, 101 configurable I/Os, instant‑on capability, and in‑field programmability makes it well suited for glue logic, interface bridging, and control roles in embedded and industrial systems.

Choose this device when you need a space‑efficient, RoHS‑compliant programmable logic solution that supports fast startup, flexible I/O, and the ability to update system logic in the field while maintaining industrial temperature resilience.

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