LCMXO640E-3T144I

IC FPGA 113 I/O 144TQFP
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 113 640 144-LQFP

Quantity 1,560 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O113Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640E-3T144I – MachXO Field Programmable Gate Array (FPGA) IC 113 640 144-LQFP

The LCMXO640E-3T144I is a MachXO family FPGA that combines non-volatile, instant-on configuration with a compact surface-mount 144-pin package. With 640 logic elements and up to 113 I/Os in a 20 × 20 mm 144-pin TQFP/LQFP footprint, it targets control, glue-logic and I/O-intensive applications where fast startup, field reconfiguration and compact packaging are important.

Designed for industrial use, the device supports a broad operating temperature range and RoHS-compliant packaging, offering a reliable, single-chip programmable logic option for board-level control and interfacing tasks.

Key Features

  • Core logic — 640 logic elements (LUTs) organized across 80 logic clusters, providing flexible combinational and sequential logic resources.
  • I/O density — 113 user I/Os in the 144-pin package, enabling extensive peripheral and bus connectivity in a compact form factor.
  • Non-volatile, instant-on configuration — MachXO family architecture offers single-chip, non-volatile configuration for microsecond power-up and no external configuration memory requirement.
  • In-field reconfiguration — Supports background programming and TransFR reconfiguration for updates while the system is operating (family-level capability).
  • Power and supply — Core supply specified at 1.14 V to 1.26 V to match system voltage requirements.
  • Package & mounting — 144-pin LQFP/TQFP surface-mount package (supplier: 144-TQFP, 20 × 20 mm), suitable for compact PCB layouts.
  • Industrial grade temperature — Rated for operation from −40 °C to 100 °C for industrial environments.
  • Regulatory compliance — RoHS compliant.

Typical Applications

  • Glue Logic & System Control — Implement power-up sequencing, reset control, and board-level control logic with instant-on behavior.
  • Bus Bridging and Interfacing — Use the high I/O count to implement bus adapters, protocol translators and interface glue between subsystems.
  • Peripheral and I/O Expansion — Add custom I/O handling, signal conditioning logic and interface glue in a compact package.
  • Field-Upgradeable Logic — Enable in-field updates and background programming to evolve system functionality without hardware replacement.

Unique Advantages

  • Single-chip, non-volatile solution: Eliminates the need for external configuration memory and enables microsecond-class power-up for faster system availability.
  • High I/O-to-logic ratio: 113 I/Os paired with 640 logic elements supports dense interfacing and flexible logic implementation on the same device.
  • Compact surface-mount package: 144-pin LQFP/TQFP (20 × 20 mm) delivers significant integration while fitting space-constrained PCB designs.
  • Industrial temperature operation: −40 °C to 100 °C rating makes the device suitable for demanding embedded and industrial environments.
  • Reconfigurability in the field: Background programming and TransFR capabilities (family-level) reduce maintenance time and extend product lifetime through firmware updates.
  • RoHS-compliant packaging: Meets common environmental and manufacturing requirements for modern assemblies.

Why Choose LCMXO640E-3T144I?

The LCMXO640E-3T144I positions itself as a compact, industrial-grade MachXO FPGA option for designers who need instant-on non-volatile logic, significant I/O capacity and flexible in-field reconfiguration. Its 640 logic elements and 113 I/Os in a 144-pin surface-mount package provide a strong balance of integration and board-level flexibility for control, bridging and interface functions.

This device is well suited to development teams and product designers seeking a reliable, reconfigurable single-chip solution that simplifies BOM, accelerates startup time and supports iterative in-field updates while operating across industrial temperature ranges.

Request a quote or submit an inquiry to learn more about availability, pricing and lead times for the LCMXO640E-3T144I.

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