LCMXO640E-3T144I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 113 640 144-LQFP |
|---|---|
| Quantity | 1,560 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 113 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80 | Number of Logic Elements/Cells | 640 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO640E-3T144I – MachXO Field Programmable Gate Array (FPGA) IC 113 640 144-LQFP
The LCMXO640E-3T144I is a MachXO family FPGA that combines non-volatile, instant-on configuration with a compact surface-mount 144-pin package. With 640 logic elements and up to 113 I/Os in a 20 × 20 mm 144-pin TQFP/LQFP footprint, it targets control, glue-logic and I/O-intensive applications where fast startup, field reconfiguration and compact packaging are important.
Designed for industrial use, the device supports a broad operating temperature range and RoHS-compliant packaging, offering a reliable, single-chip programmable logic option for board-level control and interfacing tasks.
Key Features
- Core logic — 640 logic elements (LUTs) organized across 80 logic clusters, providing flexible combinational and sequential logic resources.
- I/O density — 113 user I/Os in the 144-pin package, enabling extensive peripheral and bus connectivity in a compact form factor.
- Non-volatile, instant-on configuration — MachXO family architecture offers single-chip, non-volatile configuration for microsecond power-up and no external configuration memory requirement.
- In-field reconfiguration — Supports background programming and TransFR reconfiguration for updates while the system is operating (family-level capability).
- Power and supply — Core supply specified at 1.14 V to 1.26 V to match system voltage requirements.
- Package & mounting — 144-pin LQFP/TQFP surface-mount package (supplier: 144-TQFP, 20 × 20 mm), suitable for compact PCB layouts.
- Industrial grade temperature — Rated for operation from −40 °C to 100 °C for industrial environments.
- Regulatory compliance — RoHS compliant.
Typical Applications
- Glue Logic & System Control — Implement power-up sequencing, reset control, and board-level control logic with instant-on behavior.
- Bus Bridging and Interfacing — Use the high I/O count to implement bus adapters, protocol translators and interface glue between subsystems.
- Peripheral and I/O Expansion — Add custom I/O handling, signal conditioning logic and interface glue in a compact package.
- Field-Upgradeable Logic — Enable in-field updates and background programming to evolve system functionality without hardware replacement.
Unique Advantages
- Single-chip, non-volatile solution: Eliminates the need for external configuration memory and enables microsecond-class power-up for faster system availability.
- High I/O-to-logic ratio: 113 I/Os paired with 640 logic elements supports dense interfacing and flexible logic implementation on the same device.
- Compact surface-mount package: 144-pin LQFP/TQFP (20 × 20 mm) delivers significant integration while fitting space-constrained PCB designs.
- Industrial temperature operation: −40 °C to 100 °C rating makes the device suitable for demanding embedded and industrial environments.
- Reconfigurability in the field: Background programming and TransFR capabilities (family-level) reduce maintenance time and extend product lifetime through firmware updates.
- RoHS-compliant packaging: Meets common environmental and manufacturing requirements for modern assemblies.
Why Choose LCMXO640E-3T144I?
The LCMXO640E-3T144I positions itself as a compact, industrial-grade MachXO FPGA option for designers who need instant-on non-volatile logic, significant I/O capacity and flexible in-field reconfiguration. Its 640 logic elements and 113 I/Os in a 144-pin surface-mount package provide a strong balance of integration and board-level flexibility for control, bridging and interface functions.
This device is well suited to development teams and product designers seeking a reliable, reconfigurable single-chip solution that simplifies BOM, accelerates startup time and supports iterative in-field updates while operating across industrial temperature ranges.
Request a quote or submit an inquiry to learn more about availability, pricing and lead times for the LCMXO640E-3T144I.