LCMXO640E-3TN144I

The LCMXO640E-3TN144I is a MachXO family field programmable gate array (FPGA) in a surface-mount 144‑lead LQFP package. It provides 640 logic elements with up to 113 general-purpose I/O pins and is targeted at control and glue-logic functions where single-chip, non-volatile, instant-on operation and in-field reconfiguration are important.

Designed for industrial applications, this device offers a compact single-chip solution with flexible I/O, non-volatile configuration, and a wide operating temperature range to support reliable deployment in embedded systems and control applications.

Key Features

• Core logic — 640 logic elements for implementing glue logic, control functions and bus interfacing.
• I/O and package — 113 I/Os in a surface-mount 144‑LQFP package (supplier package listed as 144‑TQFP, 20×20 mm footprint) for high pin-count breakout in a compact form factor.
• Non‑volatile single‑chip configuration — MachXO family architecture provides instant-on operation with no external configuration memory required.
• In‑field reconfiguration (TransFR™) — Supports background and in-system logic updates to modify functionality while the system is operating.
• Sleep mode — Enables substantial static current reduction (up to 100× reduction described in family data) for lower standby power.
• Embedded memory (family data) — LCMXO640 family devices include approximately 6.1 Kbits of distributed RAM; no embedded block SRAM (EBR) blocks for this density.
• Clocking and PLLs — This device variant has no integrated PLLs (Number of PLLs = 0 for LCMXO640 family member shown in datasheet table).
• Power — Core supply range specified at 1.14 V to 1.26 V for the device.
• Industrial temperature and grade — Rated for industrial operation from -40 °C to 100 °C.
• Compliance — RoHS compliant.

Typical Applications

• Glue logic and system control — Implement board-level control, power sequencing and state machines in a single non-volatile device.
• Bus bridging and interfacing — Use the device to bridge disparate bus standards and perform protocol adaptation at the I/O level.
• Power-up control and supervision — Instant-on configuration and single-chip architecture simplify power sequencing and reduce BOM.
• Field-upgradable control logic — In-field reconfiguration supports iterative product updates and bug fixes without external configuration memory.

Unique Advantages

• Single‑chip, non‑volatile solution: Eliminates the need for external configuration memory, simplifying PCB design and reducing component count.
• Instant-on responsiveness: Device powers up configured and ready in microseconds, reducing system initialization time.
• In-field reconfiguration: TransFR™ capability and background programming allow logic updates while the system remains operational.
• Compact, high‑I/O footprint: 113 I/Os in a 144‑lead LQFP package provide a balance of pin density and accessible package size for prototyping and production boards.
• Industrial robustness: Rated for -40 °C to 100 °C operation and supplied in RoHS‑compliant packaging for industrial deployments.
• Low standby power option: Sleep mode enables significant static current reduction for energy-sensitive applications.

Why Choose LCMXO640E-3TN144I?

The LCMXO640E-3TN144I combines a non-volatile MachXO architecture with 640 logic elements and 113 I/Os to deliver a compact, single-chip FPGA well suited for glue logic, interface bridging, and control applications. Its instant-on behavior and in-field reconfiguration capabilities reduce system complexity and support iterative development and updates without external configuration components.

This variant is positioned for engineers and procurement teams seeking an industrial-grade, surface-mount FPGA solution with predictable power and thermal characteristics (core supply 1.14–1.26 V, -40 °C to 100 °C) and a high I/O count in a 144‑lead package.

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