LCMXO640E-4B256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,347 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA, CSPBGA | Number of I/O | 159 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80 | Number of Logic Elements/Cells | 640 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO640E-4B256C – MachXO Field Programmable Gate Array, 640 logic elements, 159 I/O, 256‑LFBGA
The LCMXO640E-4B256C is a MachXO family FPGA from Lattice Semiconductor that combines non-volatile, instant-on architecture with mid-range logic density. This surface-mount 256‑ball LFBGA device provides 640 logic elements and up to 159 I/Os in a 14×14 mm package, targeting glue logic, bus bridging, control and interface tasks in commercial designs.
Designed for compact system integration, the device supports single-chip configuration without external memory and operates across a core supply range of 1.14 V to 1.26 V within a commercial temperature range of 0 °C to 85 °C. The package is RoHS compliant for modern manufacturing environments.
Key Features
- Non‑volatile, single‑chip architecture — Instant-on operation and no external configuration memory required enable fast power-up and simplified BOM.
- Reconfiguration and background programming — Family-level MachXO features include background programming and in-field reconfiguration (TransFR) for live updates without full system downtime.
- Logic density — 640 logic elements provide capacity for glue logic, protocol bridging and mid‑complexity control tasks.
- I/O capacity and flexibility — Up to 159 I/Os in the 256‑LFBGA package allow high pin-to-pin connectivity for multi‑bus and multi‑interface applications.
- On‑device memory (family reference) — The MachXO family selection guide lists approximately 6.1 Kbits of distributed RAM for the LCMXO640 family; the family does not include embedded block SRAM for this density point.
- Power and sleep — Family features include sleep mode for significant static current reduction, helping lower standby power.
- Package and mounting — 256‑LFBGA (256‑cabga 14×14 mm) surface‑mount package suitable for compact PCB implementations.
- Commercial temperature and compliance — Rated for 0 °C to 85 °C operation and RoHS compliant.
Typical Applications
- Glue logic and system control — Implement power-up sequencing, reset control and board-level supervisory logic leveraging the non‑volatile, instant-on capability.
- Bus bridging and protocol interfacing — Use the device’s 159 I/Os and flexible routing for bus interfacing, level translation and protocol conversion tasks.
- Board-level subsystem integration — Replace discrete glue circuits with a single programmable device to reduce BOM and PCB area.
- Field-updatable control logic — In-system and background programming capabilities enable updates to control logic without external configuration memory.
Unique Advantages
- Single-chip configuration: Eliminates the need for external configuration memory, simplifying design and reducing component count.
- Instant-on availability: Rapid power-up behavior supports applications that require immediate logic availability after power is applied.
- High I/O-to-logic ratio: 159 I/Os alongside 640 logic elements enable dense interfacing for multi-signal designs without oversizing the logic fabric.
- Compact, production-ready packaging: The 256‑LFBGA surface-mount package is suited for space-constrained boards and standard manufacturing processes.
- Design flexibility and future-proofing: In-field reconfiguration and background programming let designs evolve post-deployment with minimal disruption.
Why Choose LCMXO640E-4B256C?
The LCMXO640E-4B256C positions itself as a practical, mid-density MachXO device for commercial embedded designs that require non-volatile instant-on logic, broad I/O connectivity and compact packaging. With 640 logic elements and up to 159 I/Os in a 256‑ball LFBGA, it suits applications where board-level integration, reduced BOM and quick startup are priorities.
Engineers benefit from the MachXO family’s configuration model, background programming and reconfiguration capabilities, enabling iterative development and in-field updates. The device’s commercial temperature rating and RoHS compliance make it suitable for mainstream consumer and industrial‑adjacent applications where these specifications are required.
Request a quote or submit a quote request for the LCMXO640E-4B256C to begin sourcing this MachXO FPGA for your next design.