LCMXO640E-4B256C

IC FPGA 159 I/O 256CABGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LFBGA, CSPBGA

Quantity 1,347 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGA, CSPBGANumber of I/O159Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640E-4B256C – MachXO Field Programmable Gate Array, 640 logic elements, 159 I/O, 256‑LFBGA

The LCMXO640E-4B256C is a MachXO family FPGA from Lattice Semiconductor that combines non-volatile, instant-on architecture with mid-range logic density. This surface-mount 256‑ball LFBGA device provides 640 logic elements and up to 159 I/Os in a 14×14 mm package, targeting glue logic, bus bridging, control and interface tasks in commercial designs.

Designed for compact system integration, the device supports single-chip configuration without external memory and operates across a core supply range of 1.14 V to 1.26 V within a commercial temperature range of 0 °C to 85 °C. The package is RoHS compliant for modern manufacturing environments.

Key Features

  • Non‑volatile, single‑chip architecture — Instant-on operation and no external configuration memory required enable fast power-up and simplified BOM.
  • Reconfiguration and background programming — Family-level MachXO features include background programming and in-field reconfiguration (TransFR) for live updates without full system downtime.
  • Logic density — 640 logic elements provide capacity for glue logic, protocol bridging and mid‑complexity control tasks.
  • I/O capacity and flexibility — Up to 159 I/Os in the 256‑LFBGA package allow high pin-to-pin connectivity for multi‑bus and multi‑interface applications.
  • On‑device memory (family reference) — The MachXO family selection guide lists approximately 6.1 Kbits of distributed RAM for the LCMXO640 family; the family does not include embedded block SRAM for this density point.
  • Power and sleep — Family features include sleep mode for significant static current reduction, helping lower standby power.
  • Package and mounting — 256‑LFBGA (256‑cabga 14×14 mm) surface‑mount package suitable for compact PCB implementations.
  • Commercial temperature and compliance — Rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

  • Glue logic and system control — Implement power-up sequencing, reset control and board-level supervisory logic leveraging the non‑volatile, instant-on capability.
  • Bus bridging and protocol interfacing — Use the device’s 159 I/Os and flexible routing for bus interfacing, level translation and protocol conversion tasks.
  • Board-level subsystem integration — Replace discrete glue circuits with a single programmable device to reduce BOM and PCB area.
  • Field-updatable control logic — In-system and background programming capabilities enable updates to control logic without external configuration memory.

Unique Advantages

  • Single-chip configuration: Eliminates the need for external configuration memory, simplifying design and reducing component count.
  • Instant-on availability: Rapid power-up behavior supports applications that require immediate logic availability after power is applied.
  • High I/O-to-logic ratio: 159 I/Os alongside 640 logic elements enable dense interfacing for multi-signal designs without oversizing the logic fabric.
  • Compact, production-ready packaging: The 256‑LFBGA surface-mount package is suited for space-constrained boards and standard manufacturing processes.
  • Design flexibility and future-proofing: In-field reconfiguration and background programming let designs evolve post-deployment with minimal disruption.

Why Choose LCMXO640E-4B256C?

The LCMXO640E-4B256C positions itself as a practical, mid-density MachXO device for commercial embedded designs that require non-volatile instant-on logic, broad I/O connectivity and compact packaging. With 640 logic elements and up to 159 I/Os in a 256‑ball LFBGA, it suits applications where board-level integration, reduced BOM and quick startup are priorities.

Engineers benefit from the MachXO family’s configuration model, background programming and reconfiguration capabilities, enabling iterative development and in-field updates. The device’s commercial temperature rating and RoHS compliance make it suitable for mainstream consumer and industrial‑adjacent applications where these specifications are required.

Request a quote or submit a quote request for the LCMXO640E-4B256C to begin sourcing this MachXO FPGA for your next design.

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