LCMXO640E-4F256I

IC FPGA 159 I/O 256FBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-BGA

Quantity 122 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O159Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640E-4F256I – MachXO FPGA, 159 I/O, 640 logic elements, 256-FPBGA (17×17)

The LCMXO640E-4F256I is a MachXO family field programmable gate array (FPGA) in a 256-ball FPBGA (17×17 mm) package, designed for industrial applications. It combines instant-on, non-volatile configuration with a compact FPGA architecture that targets glue logic, bus bridging, system control, and I/O-intensive designs.

This device delivers 640 logic elements and up to 159 user I/Os in a surface-mount 256-BGA package, supporting reliable operation across an industrial temperature range and a tight core voltage window for predictable power budgeting.

Key Features

  • Core Logic  640 logic elements provide programmable logic capacity suitable for glue logic, interface bridging, and control functions.
  • I/O Density  159 user I/Os in the 256-FPBGA package enable high pin-to-logic ratios for board-level signal aggregation and bus interfacing.
  • Non-volatile, Instant-on Configuration  MachXO family architecture supports single-chip non-volatile configuration for immediate start-up without external configuration memory.
  • Reconfigurability and In-field Update  Family-level TransFR™ reconfiguration and background programming capabilities enable in-field logic updates while the system remains operational.
  • Distributed Memory  Family documentation indicates distributed RAM on LCMXO640 devices (approximately 6.1 Kbits) for small FIFOs and buffering within designs.
  • Low-power Modes  Sleep mode support can reduce static current substantially, aiding low-power standby and energy-sensitive applications.
  • Flexible I/O Buffering  Programmable I/O buffers support a wide range of signaling standards (including various LVCMOS levels, LVTTL, LVDS variants and others) for interface flexibility.
  • Packaging and Mounting  256-ball FPBGA (17×17 mm) surface-mount package for compact board integration with industrial-grade robustness.
  • Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C to meet typical industrial environment requirements.
  • Supply Voltage  Core supply specified from 1.14 V to 1.26 V for predictable power design and decoupling requirements.
  • Regulatory  RoHS-compliant packaging.

Typical Applications

  • Glue Logic and System Control  Implement command sequencing, reset control, and simple state machines to consolidate discrete logic into a single programmable device.
  • Bus Bridging and Protocol Conversion  Use the device’s I/O density to bridge between different bus standards or isolate legacy interfaces without large external logic assemblies.
  • Sensor and Peripheral Interfacing  Aggregate signals from sensors and peripherals, providing deterministic control and buffering using on-chip logic and distributed RAM.
  • Power-up and Sequencing Control  Leverage instant-on non-volatile configuration for reliable startup behavior and integrated control of power sequencing functions.

Unique Advantages

  • Instant-on, single-chip configuration: Eliminates the need for external configuration memory and reduces system initialization complexity.
  • High I/O-to-logic ratio: 159 I/Os paired with 640 logic elements supports dense interfacing without large-scale FPGA resources.
  • Industrial-ready operation: Specified −40 °C to 100 °C and surface-mount 256-FPBGA packaging for robust deployment in industrial systems.
  • In-field update capability: Family-level background programming and reconfiguration enable firmware updates with minimal system disruption.
  • Power-conscious modes: Sleep mode support reduces static current for energy-efficient standby operation.
  • Flexible I/O standards: Programmable I/O buffers support multiple signaling standards to simplify board-level interfacing.

Why Choose LCMXO640E-4F256I?

This Lattice MachXO device blends non-volatile instant-on configuration with a compact FPGA architecture offering 640 logic elements and 159 I/Os in a 256-FPBGA package. It is positioned for engineers who need a reliable, reconfigurable solution for glue logic, interface bridging, and system control within industrial temperature ranges.

With single-chip configuration, in-field reconfiguration capability, and configurable I/O, the LCMXO640E-4F256I reduces BOM complexity while providing predictable power and thermal characteristics for long-term deployments. It is a practical choice for teams seeking a stable, reprogrammable building block supported by MachXO family design flows.

Request a quote or submit an inquiry to obtain pricing, availability, and delivery details for the LCMXO640E-4F256I.

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