LCMXO640E-4F256I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-BGA |
|---|---|
| Quantity | 122 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 159 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80 | Number of Logic Elements/Cells | 640 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO640E-4F256I – MachXO FPGA, 159 I/O, 640 logic elements, 256-FPBGA (17×17)
The LCMXO640E-4F256I is a MachXO family field programmable gate array (FPGA) in a 256-ball FPBGA (17×17 mm) package, designed for industrial applications. It combines instant-on, non-volatile configuration with a compact FPGA architecture that targets glue logic, bus bridging, system control, and I/O-intensive designs.
This device delivers 640 logic elements and up to 159 user I/Os in a surface-mount 256-BGA package, supporting reliable operation across an industrial temperature range and a tight core voltage window for predictable power budgeting.
Key Features
- Core Logic 640 logic elements provide programmable logic capacity suitable for glue logic, interface bridging, and control functions.
- I/O Density 159 user I/Os in the 256-FPBGA package enable high pin-to-logic ratios for board-level signal aggregation and bus interfacing.
- Non-volatile, Instant-on Configuration MachXO family architecture supports single-chip non-volatile configuration for immediate start-up without external configuration memory.
- Reconfigurability and In-field Update Family-level TransFR™ reconfiguration and background programming capabilities enable in-field logic updates while the system remains operational.
- Distributed Memory Family documentation indicates distributed RAM on LCMXO640 devices (approximately 6.1 Kbits) for small FIFOs and buffering within designs.
- Low-power Modes Sleep mode support can reduce static current substantially, aiding low-power standby and energy-sensitive applications.
- Flexible I/O Buffering Programmable I/O buffers support a wide range of signaling standards (including various LVCMOS levels, LVTTL, LVDS variants and others) for interface flexibility.
- Packaging and Mounting 256-ball FPBGA (17×17 mm) surface-mount package for compact board integration with industrial-grade robustness.
- Industrial Temperature Range Qualified for operation from −40 °C to 100 °C to meet typical industrial environment requirements.
- Supply Voltage Core supply specified from 1.14 V to 1.26 V for predictable power design and decoupling requirements.
- Regulatory RoHS-compliant packaging.
Typical Applications
- Glue Logic and System Control Implement command sequencing, reset control, and simple state machines to consolidate discrete logic into a single programmable device.
- Bus Bridging and Protocol Conversion Use the device’s I/O density to bridge between different bus standards or isolate legacy interfaces without large external logic assemblies.
- Sensor and Peripheral Interfacing Aggregate signals from sensors and peripherals, providing deterministic control and buffering using on-chip logic and distributed RAM.
- Power-up and Sequencing Control Leverage instant-on non-volatile configuration for reliable startup behavior and integrated control of power sequencing functions.
Unique Advantages
- Instant-on, single-chip configuration: Eliminates the need for external configuration memory and reduces system initialization complexity.
- High I/O-to-logic ratio: 159 I/Os paired with 640 logic elements supports dense interfacing without large-scale FPGA resources.
- Industrial-ready operation: Specified −40 °C to 100 °C and surface-mount 256-FPBGA packaging for robust deployment in industrial systems.
- In-field update capability: Family-level background programming and reconfiguration enable firmware updates with minimal system disruption.
- Power-conscious modes: Sleep mode support reduces static current for energy-efficient standby operation.
- Flexible I/O standards: Programmable I/O buffers support multiple signaling standards to simplify board-level interfacing.
Why Choose LCMXO640E-4F256I?
This Lattice MachXO device blends non-volatile instant-on configuration with a compact FPGA architecture offering 640 logic elements and 159 I/Os in a 256-FPBGA package. It is positioned for engineers who need a reliable, reconfigurable solution for glue logic, interface bridging, and system control within industrial temperature ranges.
With single-chip configuration, in-field reconfiguration capability, and configurable I/O, the LCMXO640E-4F256I reduces BOM complexity while providing predictable power and thermal characteristics for long-term deployments. It is a practical choice for teams seeking a stable, reprogrammable building block supported by MachXO family design flows.
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