LCMXO640E-4FT256I

IC FPGA 159 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LBGA

Quantity 1,551 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O159Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640E-4FT256I – MachXO FPGA, 159 I/Os, 640 logic elements (256-LBGA)

The LCMXO640E-4FT256I is a MachXO family Field Programmable Gate Array (FPGA) IC designed for glue logic, bus bridging, bus interfacing, power-up control and general control logic. It combines non-volatile instant-on behavior with a compact, surface-mount 256-ball BGA package and an industrial operating temperature range for robust deployment in commercial and industrial systems.

Key Features

  • Core logic — 640 logic elements (LUTs) for implementing combinational and sequential logic functions.
  • I/O density — 159 user I/Os to support multiple external interfaces and system interconnects.
  • Non‑volatile, instant-on architecture — Single-chip configuration without external configuration memory and fast power-up behavior as described for the MachXO family.
  • In-field reconfiguration (TransFR) — Family-level TransFR reconfiguration support for updating logic while the system operates.
  • Low-power modes — MachXO family sleep mode enables large reductions in static current for power-sensitive applications.
  • Embedded memory (family data) — LCMXO640 devices are identified with approximately 6.1 Kbits of distributed RAM at the family level.
  • Package & mounting — 256-LBGA package; supplier device package listed as 256-FTBGA (17×17), surface-mount.
  • Voltage supply — Operates within a 1.14 V to 1.26 V supply window.
  • Industrial grade — Specified operating temperature range of −40 °C to 100 °C for industrial environments.
  • Regulatory — RoHS compliant.

Typical Applications

  • Glue logic — Implement address decoding, bus arbitration and custom control glue between ICs with compact, non‑volatile logic.
  • Bus bridging and interfacing — Route and translate signals across buses using the high I/O count and flexible I/O buffers of the MachXO family.
  • Power-up and system control — Handle power sequencing, reset control and supervision tasks with instant-on configuration and single-chip non-volatile operation.
  • Control logic — Replace hardwired state machines and discrete logic with reconfigurable logic elements for faster design iterations and in-field updates.

Unique Advantages

  • Instant-on, single-chip configuration: Eliminates external configuration memory and enables rapid system start-up.
  • High I/O-to-logic ratio: 159 I/Os combined with 640 logic elements provide a practical balance for interface-heavy control designs.
  • In-field reconfiguration: TransFR support allows updates to logic while the system remains operational, simplifying maintenance and feature upgrades.
  • Industrial temperature range: −40 °C to 100 °C specification supports deployment in a wide range of commercial and industrial environments.
  • Compact BGA packaging: 256-ball BGA in a surface-mount form factor helps reduce board area while preserving high pin count.
  • RoHS compliant: Meets common environmental requirements for modern electronic products.

Why Choose LCMXO640E-4FT256I?

The LCMXO640E-4FT256I positions itself as a compact, industrial-grade MachXO family FPGA for applications that require non-volatile instant-on behavior, a substantial I/O complement, and reconfigurability without external configuration memory. Its combination of 640 logic elements and 159 I/Os in a 256-ball BGA package makes it well suited to designers replacing discrete glue logic or implementing mid-density interfacing and control tasks.

Choosing this device provides a path to reduce bill-of-materials complexity, accelerate system startup, and enable in-field updates, backed by MachXO family architecture and tooling referenced in the product datasheet.

If you would like pricing or availability information, request a quote or submit your requirements and our team will respond with a tailored quote and procurement details.

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