LCMXO640E-4FT256I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LBGA |
|---|---|
| Quantity | 1,551 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 159 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80 | Number of Logic Elements/Cells | 640 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO640E-4FT256I – MachXO FPGA, 159 I/Os, 640 logic elements (256-LBGA)
The LCMXO640E-4FT256I is a MachXO family Field Programmable Gate Array (FPGA) IC designed for glue logic, bus bridging, bus interfacing, power-up control and general control logic. It combines non-volatile instant-on behavior with a compact, surface-mount 256-ball BGA package and an industrial operating temperature range for robust deployment in commercial and industrial systems.
Key Features
- Core logic — 640 logic elements (LUTs) for implementing combinational and sequential logic functions.
- I/O density — 159 user I/Os to support multiple external interfaces and system interconnects.
- Non‑volatile, instant-on architecture — Single-chip configuration without external configuration memory and fast power-up behavior as described for the MachXO family.
- In-field reconfiguration (TransFR) — Family-level TransFR reconfiguration support for updating logic while the system operates.
- Low-power modes — MachXO family sleep mode enables large reductions in static current for power-sensitive applications.
- Embedded memory (family data) — LCMXO640 devices are identified with approximately 6.1 Kbits of distributed RAM at the family level.
- Package & mounting — 256-LBGA package; supplier device package listed as 256-FTBGA (17×17), surface-mount.
- Voltage supply — Operates within a 1.14 V to 1.26 V supply window.
- Industrial grade — Specified operating temperature range of −40 °C to 100 °C for industrial environments.
- Regulatory — RoHS compliant.
Typical Applications
- Glue logic — Implement address decoding, bus arbitration and custom control glue between ICs with compact, non‑volatile logic.
- Bus bridging and interfacing — Route and translate signals across buses using the high I/O count and flexible I/O buffers of the MachXO family.
- Power-up and system control — Handle power sequencing, reset control and supervision tasks with instant-on configuration and single-chip non-volatile operation.
- Control logic — Replace hardwired state machines and discrete logic with reconfigurable logic elements for faster design iterations and in-field updates.
Unique Advantages
- Instant-on, single-chip configuration: Eliminates external configuration memory and enables rapid system start-up.
- High I/O-to-logic ratio: 159 I/Os combined with 640 logic elements provide a practical balance for interface-heavy control designs.
- In-field reconfiguration: TransFR support allows updates to logic while the system remains operational, simplifying maintenance and feature upgrades.
- Industrial temperature range: −40 °C to 100 °C specification supports deployment in a wide range of commercial and industrial environments.
- Compact BGA packaging: 256-ball BGA in a surface-mount form factor helps reduce board area while preserving high pin count.
- RoHS compliant: Meets common environmental requirements for modern electronic products.
Why Choose LCMXO640E-4FT256I?
The LCMXO640E-4FT256I positions itself as a compact, industrial-grade MachXO family FPGA for applications that require non-volatile instant-on behavior, a substantial I/O complement, and reconfigurability without external configuration memory. Its combination of 640 logic elements and 159 I/Os in a 256-ball BGA package makes it well suited to designers replacing discrete glue logic or implementing mid-density interfacing and control tasks.
Choosing this device provides a path to reduce bill-of-materials complexity, accelerate system startup, and enable in-field updates, backed by MachXO family architecture and tooling referenced in the product datasheet.
If you would like pricing or availability information, request a quote or submit your requirements and our team will respond with a tailored quote and procurement details.

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