LCMXO640E-4FTN256I

IC FPGA 159 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LBGA

Quantity 141 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O159Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640E-4FTN256I – MachXO Field Programmable Gate Array, 640 logic elements, 159 I/Os, 256‑LBGA

The LCMXO640E-4FTN256I is an industrial‑grade MachXO family FPGA in a compact 256‑ball BGA package (supplier package: 256‑FTBGA, 17×17 mm). It integrates 640 logic elements and 159 user I/Os, delivering a single‑chip, non‑volatile programmable solution tailored for glue logic, bus bridging/interfacing, power‑up control and other system control tasks.

Designed for systems where instant availability, field reconfiguration and low static power are important, the device operates from a core supply range of 1.14 V to 1.26 V and across an industrial temperature range of −40 °C to 100 °C.

Key Features

  • Logic Capacity — 640 logic elements for implementing glue logic, control paths and interface bridging in a small FPGA footprint.
  • I/O Count & Flexibility — 159 user I/Os in a 256‑ball LBGA package; the MachXO family provides flexible programmable I/O buffers that support a wide range of interface standards.
  • Non‑volatile, Instant‑on Operation — Single‑chip, non‑volatile architecture with no external configuration memory required; instant‑on behavior and secure configuration storage.
  • In‑field Reconfiguration — TransFR™ reconfiguration capability for updating logic while the system remains operational and support for background programming of non‑volatile memory.
  • Low‑Power Modes — Sleep mode capability to reduce static current by up to 100× for low standby power operation.
  • System‑Level Support — Onboard oscillator, IEEE 1149.1 boundary scan and IEEE 1532 in‑system programming support for robust development and manufacturing flows.
  • Package & Mounting — Surface‑mount 256‑LBGA (supplier package: 256‑FTBGA 17×17) for dense board integration.
  • Industrial Temperature Rating — Rated for operation from −40 °C to 100 °C for demanding environments.
  • Power Supply — Core voltage range of 1.14 V to 1.26 V for predictable power planning.
  • RoHS Compliant — Device is RoHS compliant.

Typical Applications

  • Glue Logic & System Control — Consolidate discrete logic and control functions into a single programmable device to simplify designs and reduce BOM count.
  • Bus Bridging & Interfacing — Implement protocol bridging and I/O adaptation between different system domains using the device’s extensive I/O count and programmable buffers.
  • Power‑up & Reset Control — Manage power sequencing and supervisory control with instant‑on behavior and secure non‑volatile configuration.
  • Field‑Updatable Control Logic — Deploy in systems requiring in‑field updates and background programming of non‑volatile logic.

Unique Advantages

  • Single‑chip, secure configuration — Non‑volatile architecture eliminates external configuration memory and reduces system complexity.
  • Fast availability at power‑up — Instant‑on capability lets systems become operational in microseconds for rapid startup requirements.
  • Field reconfiguration without downtime — TransFR™ reconfiguration enables logic updates while the system remains active, reducing maintenance windows.
  • Low standby power — Sleep mode provides dramatic static current reduction to conserve energy in standby or battery‑backed systems.
  • Industrial‑rated robustness — Rated operation from −40 °C to 100 °C supports a wide range of industrial environments.
  • High I/O density in a compact package — 159 I/Os in a 256‑ball BGA package help maximize board‑level connectivity while minimizing footprint.

Why Choose LCMXO640E-4FTN256I?

The LCMXO640E-4FTN256I offers a compact, industrial‑grade programmable building block for designs that require secure, instant‑on operation with flexible I/O and the ability to update logic in the field. Its combination of 640 logic elements, high I/O count and non‑volatile single‑chip architecture simplifies system design and reduces external components.

Ideal for embedded control, interface bridging and power sequencing applications, this MachXO device delivers configuration security, low standby power modes and mature system‑level support to streamline development and deployment in industrial systems.

Request a quote or submit a purchase inquiry to receive pricing and availability for the LCMXO640E-4FTN256I.

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