LCMXO640E-4FT256C

IC FPGA 159 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LBGA

Quantity 810 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O159Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640E-4FT256C – MachXO Field Programmable Gate Array (FPGA) IC 159 I/O, 640 Logic Elements, 256-LBGA

The LCMXO640E-4FT256C is a MachXO family non-volatile FPGA optimized for control, glue logic and interface functions. It combines instant-on, single-chip configuration with a compact 256-ball BGA package and a high pin-to-logic ratio, delivering 640 logic elements and up to 159 user I/Os for compact, responsive system designs.

This commercial-grade device targets applications that require fast start-up, flexible I/O support and in-field reconfiguration while minimizing external components and board area. Core supply and thermal operating details are provided for predictable system integration.

Key Features

  • Core Logic — 640 logic elements and 80 logic blocks provide the capacity for glue logic, state machines and control functions.
  • I/O Density — 159 I/Os available in a 256-ball package enable dense peripheral and bus connections without larger packages.
  • Non-volatile, Instant-on Architecture — Single-chip non-volatile implementation enables microsecond power-up and eliminates the need for external configuration memory.
  • Reconfiguration and Programming — Supports background programming and in-field updates; SRAM-based logic can be reconfigured in milliseconds via supported programming interfaces.
  • Embedded and Distributed Memory — Approximately 6.1 Kbits of distributed RAM for small embedded storage and buffering tasks.
  • Flexible I/O Buffering — Family-level support for a wide range of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL and differential standards as listed in the device family documentation.
  • Power and Sleep Modes — Core voltage specified at 1.14 V to 1.26 V and a sleep mode capability that reduces static current by up to 100× as documented for the MachXO family.
  • Package and Mounting — Surface-mount 256-LBGA; supplier device package specified as 256-FTBGA (17 × 17 mm) for compact board integration.
  • Commercial Temperature Range — Rated for 0 °C to 85 °C operation to suit a wide range of commercial applications.
  • Standards and Tool Support — Family documentation references IEEE 1149.1 boundary scan and ispLEVER design tool support for synthesis, place-and-route and timing verification.

Typical Applications

  • Glue Logic and System Control — Implement address decoding, bus arbitration and control-state machines using the device’s logic resources and instant-on capability.
  • Bus Bridging and Interface Conditioning — Use the high I/O count and flexible I/O standards to bridge or condition signals between subsystems and external peripherals.
  • Power-up and Reset Sequencing — Leverage single-chip non-volatile configuration and fast start-up for reliable power-up control and sequencing logic.
  • Field Upgradeable Logic — Perform in-field firmware and logic updates with background programming and TransFR-style reconfiguration supported in the MachXO family.

Unique Advantages

  • Single-Chip Non-volatile Solution: Eliminates external configuration memory and reduces BOM and board area compared with multi-chip configurations.
  • Fast, Predictable Start-up: Instant-on architecture provides immediate availability of implemented logic after power-up, improving system responsiveness.
  • High Pin-to-Logic Ratio: 159 I/Os alongside 640 logic elements enable dense I/O designs without moving to larger, more expensive packages.
  • Low-Power Options: Documented sleep mode capability significantly reduces static current for power-sensitive applications.
  • Compact Surface-Mount Package: 256-LBGA (256-FTBGA 17×17 mm) offers a small footprint for space-constrained PCBs while maintaining robust I/O.
  • Design Ecosystem Support: Family-level support for boundary scan and ispLEVER toolchain simplifies design, verification and in-system programming workflows.

Why Choose LCMXO640E-4FT256C?

The LCMXO640E-4FT256C positions itself as a compact, non-volatile FPGA tailored for control, interfacing and glue-logic roles where fast start-up, field configurability and dense I/O are priorities. Its combination of 640 logic elements, 159 I/Os and a 256-ball BGA footprint lets designers consolidate discrete logic and reduce board complexity.

For teams designing commercial-grade embedded systems that require predictable power-up behavior, flexible I/O, and in-field update capability, this MachXO family device delivers a practical balance of integration, configurability and supported design tools for streamlined development and long-term maintainability.

If you would like pricing or availability information, request a quote or submit your requirements and a representative will respond with a tailored quote and lead-time details.

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