LCMXO640E-4FTN256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LBGA |
|---|---|
| Quantity | 1,769 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 159 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80 | Number of Logic Elements/Cells | 640 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO640E-4FTN256C – MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LBGA
The LCMXO640E-4FTN256C is a MachXO family FPGA offering 640 logic elements and up to 159 I/Os in a 256-ball BGA package. Optimized for glue logic, bus interfacing, power-up control and general control logic, the device combines non-volatile configuration with FPGA-style LUT-based logic for compact, instant-on system integration.
Designed for commercial-grade applications, the device delivers single-chip configuration, flexible I/O support and low-power modes that simplify board-level design and shorten system startup time.
Key Features
- Core Logic Provides 640 logic elements for implementing combinational and sequential logic; architecture based on LUTs for flexible logic mapping.
- I/O Density Up to 159 I/Os in the 256-ball package to support dense pin requirements in a compact BGA footprint.
- Non‑volatile, Instant‑on Configuration Single-chip non-volatile configuration enables instant-on power-up in microseconds without external configuration memory and reduces system complexity.
- In-field Reconfiguration Supports rapid reconfiguration of SRAM-based logic in milliseconds and TransFR™ (in-field logic update) for in-system updates while the system operates.
- Low Power Modes Sleep mode capability provides significant static current reduction (up to 100×) for power-sensitive applications.
- Flexible I/O Buffering Family-level programmable sysIO™ buffers support a wide range of interfaces (examples cited for the MachXO family include LVCMOS, LVTTL, LVDS and other standards), enabling broad interface compatibility.
- Memory Distributed RAM available in the MachXO family (LCMXO640 family devices include distributed RAM) for small data buffering and state storage.
- Package and Mounting 256-ball LBGA (supplier package documented as 256-FTBGA 17×17 mm) in a surface-mount form factor for compact board integration.
- Power and Temperature Rated supply range for the device of 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C.
- Standards and Compliance RoHS-compliant packaging to meet common environmental requirements.
Typical Applications
- Glue Logic and System Control Implement board-level control functions and glue logic between subsystems with compact, non-volatile FPGA resources.
- Bus Bridging and Interfacing Bridge disparate bus standards or adapt signals between controllers using the device’s dense I/O and flexible buffer options.
- Power-up and Reset Management Use instant-on configuration and sleep modes to manage system power sequencing and reduce standby consumption.
- Field-updatable Control Logic Perform in-field logic updates and incremental feature changes using TransFR™ reconfiguration without removing the device from the system.
Unique Advantages
- Single‑chip Configuration: Eliminates the need for external configuration memory, simplifying BOM and board layout.
- Instant System Availability: Non-volatile, instant-on configuration enables systems to power up in microseconds, improving responsiveness at startup.
- High I/O Count in a Compact Package: 159 I/Os in a 256-ball BGA deliver dense connectivity while keeping PCB area minimized.
- Flexible In‑field Updates: TransFR™ and fast reconfiguration let you update logic in-system, reducing maintenance and upgrade effort.
- Low‑Power Operation: Sleep mode support offers substantial static current reduction for energy-conscious designs.
- Commercial Temperature and RoHS Compliance: Designed for commercial environments with a 0 °C to 85 °C range and RoHS-compliant packaging.
Why Choose LCMXO640E-4FTN256C?
The LCMXO640E-4FTN256C is positioned as a compact, non-volatile FPGA solution for engineers needing instant-on logic, flexible I/O, and the ability to perform in-field updates. Its combination of 640 logic elements and 159 I/Os in a 256-ball BGA makes it suitable for dense interface and control tasks where board space and fast startup are priorities.
For customers building commercial-grade embedded systems that require simplified configuration, reduced BOM complexity, and options for low-power standby and field reconfiguration, this MachXO device provides an integrated, verifiable solution supported by family-level features documented in the MachXO datasheet.
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