LCMXO640E-4FTN256C

IC FPGA 159 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LBGA

Quantity 1,769 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O159Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640E-4FTN256C – MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LBGA

The LCMXO640E-4FTN256C is a MachXO family FPGA offering 640 logic elements and up to 159 I/Os in a 256-ball BGA package. Optimized for glue logic, bus interfacing, power-up control and general control logic, the device combines non-volatile configuration with FPGA-style LUT-based logic for compact, instant-on system integration.

Designed for commercial-grade applications, the device delivers single-chip configuration, flexible I/O support and low-power modes that simplify board-level design and shorten system startup time.

Key Features

  • Core Logic  Provides 640 logic elements for implementing combinational and sequential logic; architecture based on LUTs for flexible logic mapping.
  • I/O Density  Up to 159 I/Os in the 256-ball package to support dense pin requirements in a compact BGA footprint.
  • Non‑volatile, Instant‑on Configuration  Single-chip non-volatile configuration enables instant-on power-up in microseconds without external configuration memory and reduces system complexity.
  • In-field Reconfiguration  Supports rapid reconfiguration of SRAM-based logic in milliseconds and TransFR™ (in-field logic update) for in-system updates while the system operates.
  • Low Power Modes  Sleep mode capability provides significant static current reduction (up to 100×) for power-sensitive applications.
  • Flexible I/O Buffering  Family-level programmable sysIO™ buffers support a wide range of interfaces (examples cited for the MachXO family include LVCMOS, LVTTL, LVDS and other standards), enabling broad interface compatibility.
  • Memory  Distributed RAM available in the MachXO family (LCMXO640 family devices include distributed RAM) for small data buffering and state storage.
  • Package and Mounting  256-ball LBGA (supplier package documented as 256-FTBGA 17×17 mm) in a surface-mount form factor for compact board integration.
  • Power and Temperature  Rated supply range for the device of 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C.
  • Standards and Compliance  RoHS-compliant packaging to meet common environmental requirements.

Typical Applications

  • Glue Logic and System Control  Implement board-level control functions and glue logic between subsystems with compact, non-volatile FPGA resources.
  • Bus Bridging and Interfacing  Bridge disparate bus standards or adapt signals between controllers using the device’s dense I/O and flexible buffer options.
  • Power-up and Reset Management  Use instant-on configuration and sleep modes to manage system power sequencing and reduce standby consumption.
  • Field-updatable Control Logic  Perform in-field logic updates and incremental feature changes using TransFR™ reconfiguration without removing the device from the system.

Unique Advantages

  • Single‑chip Configuration: Eliminates the need for external configuration memory, simplifying BOM and board layout.
  • Instant System Availability: Non-volatile, instant-on configuration enables systems to power up in microseconds, improving responsiveness at startup.
  • High I/O Count in a Compact Package: 159 I/Os in a 256-ball BGA deliver dense connectivity while keeping PCB area minimized.
  • Flexible In‑field Updates: TransFR™ and fast reconfiguration let you update logic in-system, reducing maintenance and upgrade effort.
  • Low‑Power Operation: Sleep mode support offers substantial static current reduction for energy-conscious designs.
  • Commercial Temperature and RoHS Compliance: Designed for commercial environments with a 0 °C to 85 °C range and RoHS-compliant packaging.

Why Choose LCMXO640E-4FTN256C?

The LCMXO640E-4FTN256C is positioned as a compact, non-volatile FPGA solution for engineers needing instant-on logic, flexible I/O, and the ability to perform in-field updates. Its combination of 640 logic elements and 159 I/Os in a 256-ball BGA makes it suitable for dense interface and control tasks where board space and fast startup are priorities.

For customers building commercial-grade embedded systems that require simplified configuration, reduced BOM complexity, and options for low-power standby and field reconfiguration, this MachXO device provides an integrated, verifiable solution supported by family-level features documented in the MachXO datasheet.

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