LCMXO640E-4FN256I

The LCMXO640E-4FN256I is a MachXO field programmable gate array (FPGA) IC supplied in a 256-ball BGA package. It provides 640 logic elements and 159 general-purpose I/Os in a compact surface-mount package designed for industrial-grade applications.

With a low-voltage supply range and extended operating temperature, this device is suited for designs that require moderate logic capacity, flexible I/O counts, and reliable operation in industrial environments.

Key Features

• Core Logic  640 logic elements for implementing glue logic, control functions, and moderate FPGA-based designs.
• Logic Blocks  80 logic blocks (reported as LABs/CLBs) to structure and organize user logic efficiently.
• I/O  159 user I/O pins to support a wide range of peripheral interfaces and signal connections.
• Memory  0 bits of on-chip RAM, appropriate for designs that rely on external memory or are optimized for logic and I/O functions.
• Power  Operates from a core supply voltage range of 1.14 V to 1.26 V to match low-voltage system domains.
• Package & Mounting  256-ball FBGA (17 × 17 mm) package, surface-mount for compact board-level integration.
• Temperature Range  Industrial operating range from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Compliance  RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Industrial Control  Custom control logic and interface aggregation in industrial systems, leveraging the industrial temperature rating and robust I/O capacity.
• Interface Bridging  Protocol conversion and signal conditioning tasks where 159 I/Os enable connection between multiple peripherals and subsystems.
• Embedded Logic Integration  Consolidation of glue logic, state machines, and small control functions into a single FPGA with 640 logic elements to reduce component count.

Unique Advantages

• Compact, high-density packaging: The 256-BGA (17 × 17 mm) package delivers significant I/O and logic capacity in a small footprint for space-constrained designs.
• Industrial-grade thermal range: Rated from −40 °C to 100 °C, enabling deployment in industrial and temperature-challenging environments.
• Extensive I/O availability: 159 I/O pins provide flexibility for multi-peripheral connectivity and flexible board-level interfaces.
• Low-voltage core operation: 1.14 V to 1.26 V supply range supports integration with low-voltage system domains.
• RoHS compliant: Conforms to RoHS requirements to support environmentally sensitive manufacturing and procurement.
• Deterministic logic capacity: 640 logic elements and 80 logic blocks make it easy to estimate resource needs for glue logic and control implementations.

Why Choose LCMXO640E-4FN256I?

The LCMXO640E-4FN256I combines a practical logic capacity with a high I/O count and a compact BGA package, delivering a balanced solution for designers needing moderate FPGA functionality in industrial settings. Its low-voltage operation and RoHS compliance make it suitable for modern embedded systems requiring efficient power domains and manufacturing compatibility.

This device is a solid choice for engineers building control, interfacing, or integration-focused designs that benefit from predictable logic resources, broad I/O availability, and an extended operating temperature range.

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