LCMXO640E-4BN256I

IC FPGA 159 I/O 256CABGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LFBGA, CSPBGA

Quantity 493 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGA, CSPBGANumber of I/O159Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640E-4BN256I – MachXO FPGA, 640 logic elements, 159 I/Os, 256-LFBGA

The LCMXO640E-4BN256I is a MachXO family Field Programmable Gate Array (FPGA) optimized for glue logic, bus interfacing and control functions. It combines non-volatile, instant-on operation with a LUT-based logic fabric suitable for low- to mid-density control and interfacing tasks.

Built for industrial applications, the device offers 640 logic elements, up to 159 user I/Os in a 256-ball LFBGA/CSPBGA package, instant-on single-chip configuration and features for in-field reconfiguration and low-power standby.

Key Features

  • Core Logic – 640 logic elements (LUT4s) providing flexible combinational and sequential logic capacity for glue logic and control functions.
  • Logic Blocks – 80 logic blocks supporting structured routing and placement of logic networks.
  • I/O Density – 159 I/Os available in the 256-ball package to support broad interfacing and bus bridging requirements.
  • Non-volatile, Instant-on – Single-chip configuration with no external configuration memory required and instant-on behavior at power-up as described in the MachXO family data.
  • In-field Reconfiguration – Supports background programming and TransFR™ reconfiguration for updating SRAM-based logic while the system operates; programming and configuration supported via JTAG.
  • Embedded Memory – Family-level distributed RAM support (MachXO640 family documented with approximately 6.1 Kbits of distributed RAM).
  • Power Management – Sleep mode capability for significant static current reduction (up to 100× reduction described for the family).
  • Package & Mounting – Surface-mount 256-LFBGA (CSPBGA) / supplier device package 256-CABGA (14×14 mm) for high pin-count, compact board layouts.
  • Voltage & Temperature – Operates with supply in the range 1.14 V to 1.26 V and an industrial operating temperature range of −40°C to 100°C.
  • Standards & Tools – MachXO family supports IEEE 1149.1 boundary-scan and is compatible with Lattice ispLEVER design tools for synthesis, place-and-route and timing verification.

Typical Applications

  • Glue Logic & Bus Bridging – Implement address decoding, bus interfacing and protocol translation with compact, single-chip logic and abundant I/O.
  • Power-up & System Control – Instant-on, non-volatile configuration and low-power sleep modes make the device suited for power sequencing, reset control and supervisory functions.
  • Control & State Machines – Use the LUT-based logic and distributed RAM to implement control logic, finite-state machines and event sequencing.
  • Peripheral & Sensor Interfaces – High I/O count and flexible I/O buffer support enable direct interfacing to a variety of peripherals and sensors for embedded applications.

Unique Advantages

  • Single-chip, non-volatile solution: Eliminates the need for external configuration memory and enables microsecond-class power-up readiness.
  • In-field update capability: TransFR™ reconfiguration and JTAG-based programming allow logic updates while the system remains operational, reducing downtime for field revisions.
  • Industrial temperature range: Rated for −40°C to 100°C operation, supporting deployment in industrial environments.
  • High I/O in a compact package: 159 I/Os in a 256-ball LFBGA footprint provide a high pin-to-area ratio for complex interfacing without large board area.
  • Low-power standby: Sleep mode yields major static current reductions for energy-conscious designs.
  • Design and debug support: Boundary-scan (IEEE 1149.1) and compatibility with ispLEVER tools streamline development and verification.

Why Choose LCMXO640E-4BN256I?

The LCMXO640E-4BN256I positions itself as a reliable, industrial-grade FPGA for designers who need instant-on, non-volatile logic combined with ample I/O and in-field reconfiguration. Its combination of 640 logic elements, significant I/O count and compact 256-ball LFBGA packaging makes it well suited to applications such as glue logic, bus bridging, system control and peripheral interfacing.

With support for background programming, TransFR reconfiguration, sleep mode and established design tool compatibility, this device delivers a practical balance of integration, configurability and deployment robustness for embedded and industrial control designs.

Request a quote to check pricing and availability for the LCMXO640E-4BN256I or submit a request for a formal quote and lead-time information.

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