LCMXO640E-4M100I

IC FPGA 74 I/O 100CSBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 74 640 100-LFBGA, CSPBGA

Quantity 999 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-CSBGA (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-LFBGA, CSPBGANumber of I/O74Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640E-4M100I – MachXO Field Programmable Gate Array (FPGA) IC, 640 logic elements, 100‑LFBGA

The LCMXO640E-4M100I is a MachXO family non-volatile FPGA optimized for glue logic, bus bridging/interfacing, power-up control and general system control functions. It combines instant-on, single-chip configuration with flexible FPGA-style LUT-based logic to deliver configurable control and I/O density in a compact surface-mount package.

Designed for industrial use, the device integrates 640 logic elements and up to 74 I/Os in a 100‑ball LFBGA/CSPBGA package, supporting in-field reconfiguration and low-power sleep modes for system-level flexibility and reduced BOM.

Key Features

  • Non-volatile, instant-on architecture — Single-chip design requires no external configuration memory and powers up in microseconds for fast system initialization.
  • Reconfiguration and in-field updates — Supports TransFR™ reconfiguration for updating SRAM-based logic while the system operates and background programming of non-volatile memory.
  • Logic resources — 640 LUTs (logic elements) suitable for glue logic, control paths and bus interfacing implementations.
  • Embedded and distributed memory — MachXO family devices provide distributed RAM resources; for this density, family documentation lists approximately 6.1 Kbits of distributed RAM and no dedicated embedded block SRAM blocks.
  • I/O and package — 74 user I/Os in a 100‑LFBGA / CSPBGA (100‑CSBGA 8×8) surface-mount package, enabling compact, I/O-dense board layouts.
  • Power and low-power modes — Supports a sleep mode enabling up to 100× static current reduction; device voltage supply specified at 1.14 V to 1.26 V for this part variant.
  • Industrial temperature range — Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
  • RoHS compliant — Lead‑free, RoHS-compliant packaging.
  • System support — Family-level features include JTAG programmability, IEEE 1149.1 boundary scan and in-system programming support to simplify development and production workflows.

Typical Applications

  • Glue logic and board-level control — Implement address decoding, protocol translation and small control FSMs to consolidate discrete logic into a single programmable device.
  • Bus bridging and interfacing — Use flexible I/O and logic to bridge legacy buses or interface between mixed-voltage domains in compact systems.
  • Power-up and sequencing control — Fast, deterministic power-on behavior and single-chip configuration simplify system power sequencing and initialization.
  • Embedded control and peripheral management — Implement supervisory control, sensor interfacing and user-interface logic with compact footprint and industrial temperature tolerance.

Unique Advantages

  • Single-chip, secure configuration: Non-volatile architecture eliminates external config memory and reduces attack surface for bitstream interception.
  • Fast system availability: Instant-on behavior (microsecond power-up) shortens boot time and simplifies sequencing in time-sensitive applications.
  • Field update capability: TransFR™ in-field reconfiguration lets you update logic while the system remains active, reducing service downtime.
  • Low-power operational modes: Sleep mode offers substantial static current reduction for battery-backed or energy-conscious designs.
  • Compact, industrial-grade packaging: 100‑ball LFBGA/CSPBGA package with 74 I/Os supports dense board integration while meeting −40 °C to 100 °C operating requirements.
  • Development and production support: JTAG programmability, boundary-scan and in-system programming capabilities accelerate prototyping and manufacturing.

Why Choose LCMXO640E-4M100I?

The LCMXO640E-4M100I delivers a pragmatic combination of non-volatile, instant-on FPGA architecture and mid-range logic density tailored for control, interfacing and glue-logic tasks in industrial systems. Its compact 100‑ball BGA package, 74 I/Os and industrial temperature rating make it well suited for space-constrained boards that require robust operation across a wide temperature range.

Engineers benefit from single-chip configuration, in-field reconfiguration capabilities and low-power sleep modes to simplify BOM, accelerate time-to-market and enable flexible field updates. The MachXO family ecosystem and programming support streamline development and production flows for long-term deployment.

Request a quote or submit an inquiry to receive pricing and availability information for the LCMXO640E-4M100I.

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