LCMXO640E-3FTN256C

The LCMXO640E-3FTN256C is a MachXO family, non-volatile FPGA optimized for glue logic, bus bridging, bus interfacing, power-up control and general system control logic. It combines instant-on configuration with a compact, surface-mount 256-ball package and is targeted at commercial embedded designs that require flexible I/O and reliable single-chip configuration.

Device highlights include 640 logic elements, 159 I/Os, single-chip non-volatile configuration for microsecond power-up, and a commercial operating range of 0 °C to 85 °C. Supply operation is specified from 1.14 V to 1.26 V and the device is RoHS compliant.

Key Features

• Core Logic  640 logic elements (LUT-based architecture) suitable for implementing glue logic and control functions.
• Non-volatile Instant-On  Single-chip, non-volatile configuration with instant-on behavior—powers up in microseconds and requires no external configuration memory.
• In-field Reconfiguration (TransFR)  Supports TransFR reconfiguration for updating SRAM-based logic while the system is operating, enabling field updates with minimal disruption.
• Low-power Modes  Sleep mode capability provides substantial static current reduction (up to 100× as described in family data), aiding low-power system designs.
• I/O and Interface Flexibility  159 I/Os with programmable sysIO buffer support for multiple standards (LVCMOS 3.3/2.5/1.8/1.5/1.2, LVTTL, PCI, LVDS, Bus-LVDS, LVPECL, RSDS) to accommodate diverse interface requirements.
• Embedded and Distributed Memory  Family documentation lists approximately 6.1 Kbits of distributed RAM for LCMXO640-class devices and indicates no embedded block SRAM for this device class.
• Package and Grade  Surface mount, 256-ball LBGA package (supplier device package: 256-FTBGA, 17×17 mm). Commercial grade, RoHS compliant, operating temperature 0 °C to 85 °C.
• Design Tool Support  MachXO family devices are supported by the ispLEVER design tools and common synthesis tool flows for efficient implementation and timing verification.

Typical Applications

• Glue Logic and System Control  Implement combinatorial and sequential glue logic functions to simplify board-level design and reduce external components.
• Bus Bridging and Interfacing  Bridge and interface between different bus standards using the device’s high I/O count and flexible sysIO buffer options.
• Power-up and Reset Management  Centralize power sequencing, reset control, and supervisory functions with the device’s instant-on and non-volatile configuration.
• Field Upgradeable Control Logic  Use TransFR reconfiguration to deploy in-field updates to control logic without taking systems offline.

Unique Advantages

• Single-chip, secure configuration: Eliminates external configuration memory and bitstream interception risk by storing configuration on-chip.
• Fast system availability: Instant-on behavior enables designs to be operational in microseconds after power-up, reducing system boot time.
• Reduced BOM and board area: Single-chip non-volatile FPGA minimizes component count compared with multi-device solutions that require external configuration PROMs.
• Flexible interfacing: Wide range of supported I/O standards and 159 I/Os simplify integration with diverse peripherals and buses.
• Field update capability: TransFR in-field reconfiguration allows safe logic updates while the system runs, improving maintainability and feature rollout.
• Commercial-grade reliability: RoHS-compliant, surface-mount package and defined commercial temperature range support volume production for mainstream embedded applications.

Why Choose LCMXO640E-3FTN256C?

LCMXO640E-3FTN256C positions itself as a compact, non-volatile FPGA solution for designers who need instant-on behavior, flexible I/O, and the ability to implement glue logic and control functions without external configuration memory. Its 640 logic elements and 159 I/Os make it well suited to replace discrete logic or to consolidate mid-density control functions into a single device.

Backed by MachXO family documentation and supported design tools, this device offers a practical balance of integration, quick power-up, and in-field update capability—delivering long-term design scalability and simplified system BOM for commercial embedded applications.

Request a quote or submit an inquiry to receive pricing and availability information for LCMXO640E-3FTN256C.