LCMXO640E-3FN256C

IC FPGA 159 I/O 256FBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-BGA

Quantity 1,332 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O159Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640E-3FN256C – MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-BGA

The LCMXO640E-3FN256C is a MachXO series Field Programmable Gate Array (FPGA) offered in a 256-ball BGA package. It provides 640 logic elements and 80 CLBs to implement custom digital logic in commercial embedded systems.

Designed for commercial-grade applications, the device features up to 159 general-purpose I/Os, a compact 256-FPBGA (17×17) package, RoHS compliance, and single-supply operation in the 1.14 V to 1.26 V range, supporting deployment across a range of space-constrained designs.

Key Features

  • Logic Resources  The device includes 640 logic elements and 80 CLBs for implementing combinational and sequential logic functions.
  • I/O Density  Up to 159 I/O pins provide flexibility for interfacing with peripherals, sensors, and other system components.
  • Power Supply  Operates from a 1.14 V to 1.26 V supply range, enabling integration into low-voltage power domains.
  • Package  Supplied in a 256-FPBGA (17×17) package, providing a high-density, surface-mount form factor.
  • Mounting and Grade  Surface mount device rated for commercial grade operation.
  • Operating Temperature  Specified for 0°C to 85°C operation suitable for commercial-environment deployments.
  • On-chip Memory  No embedded RAM bits are provided in this device.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Commercial embedded systems  Implement custom control and glue logic where a compact FPGA with up to 159 I/Os is required.
  • User interface and peripheral control  Integrate I/O expansion and control logic in space-constrained boards using the 256-BGA package.
  • Protocol bridging and I/O routing  Deploy the device for signal routing, protocol adaptation, or I/O aggregation in commercial products.

Unique Advantages

  • Compact high-density package: 256-FPBGA (17×17) package delivers many I/Os in a small footprint to optimize board real estate.
  • Right-sized logic capacity: 640 logic elements with 80 CLBs provide sufficient resources for medium-complexity logic integration without unnecessary overhead.
  • Low-voltage operation: 1.14 V to 1.26 V supply simplifies integration into modern low-voltage power architectures.
  • Commercial temperature rating: Specified 0°C to 85°C range for reliable performance in standard commercial environments.
  • RoHS compliant: Meets RoHS requirements for environmental and regulatory considerations.

Why Choose LCMXO640E-3FN256C?

The LCMXO640E-3FN256C positions itself as a compact, commercial-grade FPGA option that balances logic capacity, I/O count, and a small BGA footprint. Its combination of 640 logic elements, 80 CLBs, and up to 159 I/Os makes it well suited for designers who need to consolidate glue logic, I/O expansion, or protocol adaptation into a single, surface-mount device.

This device provides a straightforward integration path for commercial embedded designs that require low-voltage operation and a high-density package, while maintaining environmental compliance and a standard commercial temperature range.

Request a quote or submit an inquiry to receive pricing and availability information for the LCMXO640E-3FN256C.

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