LCMXO640E-3BN256I

The LCMXO640E-3BN256I is a MachXO family FPGA optimized for glue logic, bus interfacing, power-up control and general control logic in industrial applications. It combines non-volatile configuration with a compact, high I/O-to-logic-density architecture to address designs that require instant-on behavior and robust I/O capability.

This device provides 640 logic elements, up to 159 I/Os in a 256-ball BGA package and is rated for industrial operation from -40 °C to 100 °C. The part operates with a core supply range of 1.14 V to 1.26 V and is RoHS compliant.

Key Features

• Non-volatile instant-on configuration  Single-chip non-volatile architecture enables instant-on operation and removes the need for external configuration memory.
• Reconfiguration and in-field updates  Family-level features include the ability to reconfigure SRAM-based logic and support background programming and in-field updates.
• Sleep mode for low static current  Sleep mode support enables significant static current reduction for power-sensitive industrial designs.
• Logic density  640 logic elements provide flexible implementation of glue logic and control functions.
• High I/O count  Up to 159 I/Os in the 256-ball package support complex peripheral and bus interfacing requirements.
• Flexible I/O standards (family-level)  MachXO family sysIO buffer support includes a wide range of interfaces such as LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
• Industrial temperature range  Qualified for operation from -40 °C to 100 °C for reliable performance in harsh environments.
• Compact BGA package  Available in a 256-ball LFBGA / caBGA (14 × 14 mm) package for dense board-level integration.
• Regulatory status  RoHS compliant.

Typical Applications

• Glue Logic and System Control  Implement power-up sequencing, reset control and board-level glue logic using the device's instant-on, non-volatile configuration.
• Bus Bridging and Interfacing  Support bus conversion and protocol interfacing with abundant I/O and family-level support for multiple I/O standards.
• Power-Up and Reset Management  Integrate power sequencing and supervisory functions where deterministic startup behavior is required.
• Industrial Control Logic  Deploy as compact, industrial-grade control and glue logic in instrumentation, factory automation and communications equipment.

Unique Advantages

• Instant-on, single-chip configuration: Eliminates external configuration memory and delivers deterministic start-up behavior.
• High I/O-to-logic ratio: 159 I/Os paired with 640 logic elements simplifies designs that need many peripheral connections without large FPGA counts.
• Field reconfigurability: Supports in-field updates and background programming to enable firmware evolution and feature upgrades.
• Industrial reliability: Rated for -40 °C to 100 °C operation to meet demanding environmental requirements.
• Compact package integration: 256-ball BGA footprint enables space-efficient placement on modern PCBs.
• Regulatory and supply readiness: RoHS compliance supports eco-conscious manufacturing and global deployment.

Why Choose LCMXO640E-3BN256I?

The LCMXO640E-3BN256I delivers a practical balance of instant-on non-volatile configuration, a high I/O count and 640 logic elements in a compact industrial-grade BGA package. It is well suited to engineers building board-level glue logic, bus interfaces, power-up control and other control functions where deterministic startup, field upgradability and reliable operation across a wide temperature range are required.

With MachXO family-level features such as background programming, sleep mode and broad sysIO support, this device provides a flexible platform that reduces BOM complexity while enabling in-field evolution and robust system control for industrial applications.

Request a quote or submit a sales inquiry to receive pricing and availability for LCMXO640E-3BN256I.