LCMXO640E-3FT256I

The LCMXO640E-3FT256I is a MachXO family Field Programmable Gate Array (FPGA) offered in a 256-ball BGA package. It combines non-volatile, instant-on architecture with a compact logic fabric—providing 640 logic elements and 159 I/O pins—targeted for control, glue-logic and interface applications in industrial environments.

This device is configured for surface-mount assembly, supports industrial temperature operation from -40 °C to 100 °C, and is RoHS-compliant, making it suitable for robust embedded systems that require high I/O density and single-chip configuration.

Key Features

• Logic Capacity  Approximately 640 logic elements arranged across 80 logic blocks for implementing glue logic, control state machines and interface bridging.
• I/O Density  159 user I/Os in a high-pin-count package to support complex bus interfacing and multi-signal systems.
• Non-volatile, Instant-on Family Architecture  MachXO family characteristics include non-volatile configuration and instant-on behavior, enabling single-chip designs without external configuration memory.
• Reconfiguration and In-field Updates  Family-level capabilities include reconfigurable SRAM logic and in-field update mechanisms for background programming and runtime updates.
• Flexible I/O Standards (Family)  Family supports a broad range of I/O buffer standards (e.g., multiple LVCMOS levels and differential interfaces), enabling interface flexibility across supply domains.
• Power  Rated voltage supply range: 1.14 V to 1.26 V as specified for this device.
• Package & Mounting  256-ball FT-BGA (17×17 mm) package, surface-mount mounting type for compact board-level integration.
• Industrial Temperature  Operating temperature range -40 °C to 100 °C for industrial-grade system deployment.
• Regulatory  RoHS-compliant lead-free packaging.

Typical Applications

• Glue Logic and System Control  Implement power-up sequencing, reset control and board-level combinational logic without external configuration components.
• Bus Bridging and Interfacing  High I/O count enables conversion, buffering and bus bridging between parallel and serial domains or between different voltage domains.
• Embedded Control  State machines, control paths and peripheral interfaces for industrial controllers and instrumentation.
• Field-updatable Logic  In-field reconfiguration allows updates to control logic and interfaces while minimizing system downtime.

Unique Advantages

• Single-chip, instant-on architecture  Removes the need for external configuration memory and shortens system boot time.
• High I/O-to-logic density  159 I/Os paired with 640 logic elements simplifies designs that require many external signals with modest logic requirements.
• Industrial temperature rating  -40 °C to 100 °C operation supports deployment in harsh and industrial environments.
• Compact BGA package  256-ball FT-BGA (17×17 mm) balances high pin count with small board footprint for space-constrained layouts.
• RoHS-compliant  Lead-free packaging supports regulatory requirements and modern PCB assembly processes.

Why Choose LCMXO640E-3FT256I?

The LCMXO640E-3FT256I is positioned for engineers who need a compact, non-volatile FPGA with substantial I/O capability and moderate logic density. Its MachXO family heritage brings instant-on configuration and field-update capabilities while the industrial temperature rating and BGA package enable robust, board-level integration.

Choose this device for designs that demand reliable in-field updates, compact single-chip configuration, and a high number of I/Os relative to logic resources—backed by documented family-level features for flexible I/O standards and configuration management.

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