LCMXO640C-5FN256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-BGA |
|---|---|
| Quantity | 217 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 159 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80 | Number of Logic Elements/Cells | 640 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO640C-5FN256C – MachXO Field Programmable Gate Array (FPGA) IC 159 I/O, 640 Logic Elements, 256‑BGA
The LCMXO640C-5FN256C is a MachXO family FPGA device optimized for glue logic, bus bridging, power-up control and general control logic. This non-volatile, instant-on FPGA integrates 640 logic elements and up to 159 I/O in a compact 256‑ball BGA (17×17 mm) package for commercial embedded applications.
Designed for single‑chip system control and interface tasks, the device offers flexible I/O options, background reconfiguration capability, and low-power modes to help reduce board-level complexity and accelerate system startup.
Key Features
- Core Logic — 640 logic elements provide the equivalent of moderate-density programmable logic suitable for glue logic, bus interfacing and control tasks.
- I/O Density — Up to 159 programmable I/O pins in a 256‑BGA footprint enable high pin‑to‑logic connectivity for bus bridging and multi‑interface designs.
- Non‑volatile, Instant‑on — Single‑chip non‑volatile configuration enables microsecond power‑up behavior with no external configuration memory required.
- In‑field Reconfiguration — Supports in-system reconfiguration and background programming for field updates without removing the device.
- Flexible sysIO Buffer — Family I/O buffer support includes a wide range of interfaces (LVCMOS at multiple voltages, LVTTL, PCI, LVDS and others) for flexible board-level interfacing.
- Distributed Memory — MachXO family support includes distributed RAM (LCMXO640 family entry is specified with approximately 6.1 Kbits of distributed RAM in family documentation).
- Power and Sleep — Low-power sleep mode can significantly reduce static current during idle periods to extend system efficiency.
- Voltage Range — Operates across a wide supply range from 1.71 V to 3.465 V to accommodate mixed-voltage systems.
- Package and Mounting — 256‑ball FPBGA (17×17 mm) surface‑mount package for compact, high‑density board designs.
- Commercial Grade & RoHS — Commercial temperature grade (0 °C to 85 °C) and RoHS‑compliant packaging.
Typical Applications
- Glue Logic & System Control — Implement board-level orchestration, power sequencing and control state machines with fast, non‑volatile startup.
- Bus Bridging & Interface Translation — Use the device’s high I/O count and flexible I/O buffers to bridge disparate bus standards and perform protocol adaptation.
- Peripheral & Sensor Interfacing — Consolidate multiple sensor and peripheral interfaces into a single programmable device to reduce BOM and PCB area.
- Field‑Upgradeable Control Logic — Leverage in‑system reconfiguration and background programming to deploy updates without hardware changes.
Unique Advantages
- Instant‑on Non‑Volatile Configuration — Single‑chip configuration eliminates the need for external boot memory and enables immediate device availability after power‑up.
- High Pin‑to‑Logic Ratio — 159 I/Os with 640 logic elements provide a strong balance for designs that require many external signals relative to logic density.
- Flexible Voltage Support — Wide supply range (1.71 V–3.465 V) supports integration into mixed‑voltage systems without complex level‑shifting.
- Compact, Surface‑Mount BGA — 256‑ball (17×17 mm) FPBGA delivers high I/O density in a compact footprint for space‑constrained designs.
- Field Maintenance and Security — Background programming and non‑volatile configuration simplify field updates while avoiding external bitstream exposure.
Why Choose LCMXO640C-5FN256C?
The LCMXO640C-5FN256C positions itself as a compact, non‑volatile FPGA solution for designers needing reliable glue logic, interface bridging and system control in commercial applications. Its combination of 640 logic elements, up to 159 I/Os, single‑chip configuration and BGA packaging reduces component count and simplifies board design.
This part is well suited for teams looking for fast startup, in‑field update capability and flexible I/O interfacing within a commercial temperature range. Backed by MachXO family design documentation and programming tools, the device supports scalable design migration across the MachXO family.
Request a quote or submit a purchasing inquiry to obtain pricing, availability and lead‑time information for the LCMXO640C-5FN256C.

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