LCMXO640C-5FN256C

IC FPGA 159 I/O 256FBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-BGA

Quantity 217 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O159Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640C-5FN256C – MachXO Field Programmable Gate Array (FPGA) IC 159 I/O, 640 Logic Elements, 256‑BGA

The LCMXO640C-5FN256C is a MachXO family FPGA device optimized for glue logic, bus bridging, power-up control and general control logic. This non-volatile, instant-on FPGA integrates 640 logic elements and up to 159 I/O in a compact 256‑ball BGA (17×17 mm) package for commercial embedded applications.

Designed for single‑chip system control and interface tasks, the device offers flexible I/O options, background reconfiguration capability, and low-power modes to help reduce board-level complexity and accelerate system startup.

Key Features

  • Core Logic — 640 logic elements provide the equivalent of moderate-density programmable logic suitable for glue logic, bus interfacing and control tasks.
  • I/O Density — Up to 159 programmable I/O pins in a 256‑BGA footprint enable high pin‑to‑logic connectivity for bus bridging and multi‑interface designs.
  • Non‑volatile, Instant‑on — Single‑chip non‑volatile configuration enables microsecond power‑up behavior with no external configuration memory required.
  • In‑field Reconfiguration — Supports in-system reconfiguration and background programming for field updates without removing the device.
  • Flexible sysIO Buffer — Family I/O buffer support includes a wide range of interfaces (LVCMOS at multiple voltages, LVTTL, PCI, LVDS and others) for flexible board-level interfacing.
  • Distributed Memory — MachXO family support includes distributed RAM (LCMXO640 family entry is specified with approximately 6.1 Kbits of distributed RAM in family documentation).
  • Power and Sleep — Low-power sleep mode can significantly reduce static current during idle periods to extend system efficiency.
  • Voltage Range — Operates across a wide supply range from 1.71 V to 3.465 V to accommodate mixed-voltage systems.
  • Package and Mounting — 256‑ball FPBGA (17×17 mm) surface‑mount package for compact, high‑density board designs.
  • Commercial Grade & RoHS — Commercial temperature grade (0 °C to 85 °C) and RoHS‑compliant packaging.

Typical Applications

  • Glue Logic & System Control — Implement board-level orchestration, power sequencing and control state machines with fast, non‑volatile startup.
  • Bus Bridging & Interface Translation — Use the device’s high I/O count and flexible I/O buffers to bridge disparate bus standards and perform protocol adaptation.
  • Peripheral & Sensor Interfacing — Consolidate multiple sensor and peripheral interfaces into a single programmable device to reduce BOM and PCB area.
  • Field‑Upgradeable Control Logic — Leverage in‑system reconfiguration and background programming to deploy updates without hardware changes.

Unique Advantages

  • Instant‑on Non‑Volatile Configuration — Single‑chip configuration eliminates the need for external boot memory and enables immediate device availability after power‑up.
  • High Pin‑to‑Logic Ratio — 159 I/Os with 640 logic elements provide a strong balance for designs that require many external signals relative to logic density.
  • Flexible Voltage Support — Wide supply range (1.71 V–3.465 V) supports integration into mixed‑voltage systems without complex level‑shifting.
  • Compact, Surface‑Mount BGA — 256‑ball (17×17 mm) FPBGA delivers high I/O density in a compact footprint for space‑constrained designs.
  • Field Maintenance and Security — Background programming and non‑volatile configuration simplify field updates while avoiding external bitstream exposure.

Why Choose LCMXO640C-5FN256C?

The LCMXO640C-5FN256C positions itself as a compact, non‑volatile FPGA solution for designers needing reliable glue logic, interface bridging and system control in commercial applications. Its combination of 640 logic elements, up to 159 I/Os, single‑chip configuration and BGA packaging reduces component count and simplifies board design.

This part is well suited for teams looking for fast startup, in‑field update capability and flexible I/O interfacing within a commercial temperature range. Backed by MachXO family design documentation and programming tools, the device supports scalable design migration across the MachXO family.

Request a quote or submit a purchasing inquiry to obtain pricing, availability and lead‑time information for the LCMXO640C-5FN256C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up