LCMXO640E-5BN256C

The LCMXO640E-5BN256C is a member of the MachXO family of non-volatile, instant-on FPGAs optimized for glue logic, bus bridging, bus interfacing, power-up control and general control logic. It combines a compact 256-ball caBGA package with 640 logic elements and up to 159 I/Os to deliver a single-chip configurable solution for system-level integration.

Designed for commercial applications, this surface-mount FPGA offers single-chip configuration without external memory, fast power-up behavior, and flexible I/O support to simplify board design where reliable, reconfigurable logic is required.

Key Features

• Non-volatile, instant-on configuration  Single-chip non-volatile architecture with instant-on capability and no external configuration memory required.
• In-field reconfiguration (TransFR)  Supports background programming and in-field logic updates while the system operates.
• Power management  Sleep mode provides significant static current reduction for lower-power standby operation.
• Logic capacity  640 logic elements for implementing glue logic and control functions.
• I/O density and flexibility  Up to 159 I/Os with programmable sysIO buffer support for common interfaces (LVCMOS 3.3/2.5/1.8/1.5/1.2, LVTTL, PCI, LVDS, Bus-LVDS, LVPECL, RSDS as described for the MachXO family).
• Embedded and distributed memory (family data)  MachXO family documentation lists approximately 6.1 Kbits of distributed RAM for the LCMXO640 class; the family has no embedded block SRAM for this density.
• Package and mounting  256-ball caBGA (256-LFBGA / CSPBGA) surface-mount package, 14×14 mm supplier package format.
• Power and temperature  Core supply range specified at 1.14 V to 1.26 V. Commercial operating temperature range: 0 °C to 85 °C.
• Standards and programmability  Supports JTAG programming and background non-volatile memory programming as described for the MachXO family; RoHS compliant packaging.

Typical Applications

• Glue Logic & System Control  Implement multiplexing, address decoding and board-level control functions using the device’s 640 logic elements and dense I/O.
• Bus Bridging & Interfacing  Bridge disparate buses and translate signaling standards with flexible sysIO buffer support and high I/O count.
• Power-up Sequencing & Reset Control  Handle power sequencing and system supervision with instant-on operation and single-chip non-volatile configuration.
• Peripheral & Interface Management  Manage sensors, peripherals and front-panel interfaces where reconfigurability and compact package size are beneficial.

Unique Advantages

• Instant-on, single-chip configuration: Eliminates the need for external configuration memory and enables microsecond-class power-up behavior.
• High I/O-to-logic density: 159 I/Os paired with 640 logic elements provide a compact solution for multi-signal interfacing and control.
• Field reprogrammability: Background programming and TransFR reconfiguration allow in-field updates without taking the system offline.
• Low-power standby: Sleep mode capability enables significant static current reduction for power-sensitive applications.
• Compact BGA packaging: 256-ball caBGA (14×14 mm) surface-mount package enables high pin count in a small PCB footprint.
• RoHS compliant: Lead-free packaging aligns with common environmental and manufacturing requirements.

Why Choose LCMXO640E-5BN256C?

The LCMXO640E-5BN256C positions itself as a compact, non-volatile FPGA suited for designers who need reliable, reconfigurable glue logic and high I/O density in a single-chip solution. With instant-on operation, field reconfiguration capabilities and flexible I/O support, it simplifies board-level integration for commercial systems that require fast startup and adaptable logic.

Supported by the MachXO family architecture and design tool flow described in the family datasheet, this device is appropriate for development teams looking for a balance of integration, reprogrammability and compact packaging while maintaining commercial temperature operation and RoHS compliance.

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