LCMXO640E-5M100C

The LCMXO640E-5M100C is a MachXO-series FPGA from Lattice Semiconductor that combines non-volatile, instantly available logic with a compact 100-ball LFBGA/CSPBGA package. With 640 logic elements and 74 I/O pins, this commercial-grade device is targeted at applications such as glue logic, bus bridging and interfacing, power-up sequencing, and general control logic where single-chip configurability and a small PCB footprint are important.

As a member of the MachXO family, the device leverages single-chip non-volatile configuration, instant-on behavior, and field reconfiguration capabilities to simplify system design and reduce BOM complexity.

Key Features

• Logic Capacity — 640 logic elements (LUT-based architecture) for implementing glue logic, control paths, and interfacing functions.
• I/O and Package — 74 user I/Os in a 100-LFBGA / CSPBGA footprint (100-CSBGA, 8×8 mm supplier package) to support dense pin usage in a compact form factor.
• Non-volatile, Instant-on Configuration — Single-chip non-volatile configuration eliminates the need for external configuration memory and enables rapid power-up behavior.
• In-field Reconfiguration — Supports background and in-field updates (TransFR™ Reconfiguration) to refresh or change logic while the system is in operation.
• Flexible I/O Buffer Support — MachXO family I/O supports a wide range of interface standards for system compatibility (family-level feature).
• Power — Core voltage supply specified at 1.14 V to 1.26 V for device operation.
• Sleep Mode — Family-level sleep mode capability for significant static current reduction when inactive.
• Commercial Temperature Range — Rated for operation from 0 °C to 85 °C.
• RoHS Compliant — Lead-free, environmentally compliant packaging.

Typical Applications

• Glue Logic and System Sequencing — Replace discrete glue logic with a single reconfigurable device to simplify board layout and routing.
• Bus Bridging and Interfacing — Implement protocol adaptation, level translation, and signal steering between system buses using the device’s flexible I/O and I/O count.
• Power-up and Reset Control — Implement reliable power sequencing and reset logic using non-volatile, instant-on configuration for immediate operation after power-up.
• Control and State Machines — Integrate control logic, debouncing, and small finite state machines into a single compact package for reduced BOM.

Unique Advantages

• Single-chip, non-volatile configuration: Eliminates external configuration memory and enables instant-on operation, reducing system components and simplifying secure deployment.
• Compact BGA footprint: 100-LFBGA/CSPBGA package provides high I/O density in an 8×8 mm supplier package to minimize PCB area.
• Field update capability: Supports in-field and background programming to update logic without removing the device from the system.
• Low-voltage core operation: Operates from a defined core voltage range of 1.14 V to 1.26 V, enabling compatibility with low-voltage system rails.
• Commercial-ready temperature range: Rated 0 °C to 85 °C for standard commercial applications.
• Environmentally compliant packaging: RoHS-compliant device packaging supports regulatory and manufacturing requirements.

Why Choose LCMXO640E-5M100C?

The LCMXO640E-5M100C positions itself as a compact, single-chip solution for designers needing reliable, instantly available programmable logic with moderate capacity—640 logic elements and 74 I/Os—delivered in a small 100-ball BGA package. Its MachXO-family capabilities such as non-volatile configuration, in-field reconfiguration, and flexible I/O make it well suited for applications that require quick power-up, secure configuration, and space-efficient implementation.

Supported by the MachXO family ecosystem and design tooling, this part is a practical choice for engineers building glue logic, interface bridges, power sequencing, and control circuits where reduced BOM and predictable, instant-on behavior matter.

Request a quote or submit a pricing inquiry to evaluate the LCMXO640E-5M100C for your next hardware design.