LFCPNX-100-7BBG484C
| Part Description |
CertusPro™-NX Field Programmable Gate Array (FPGA) IC 313 3833856 96000 484-LFBGA |
|---|---|
| Quantity | 581 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-CABGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-LFBGA | Number of I/O | 313 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24000 | Number of Logic Elements/Cells | 96000 | ||
| Number of Gates | N/A | ECCN | 5A992C SC | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFCPNX-100-7BBG484C – CertusPro™-NX FPGA (484‑LFBGA)
The LFCPNX-100-7BBG484C is a CertusPro™-NX field programmable gate array (FPGA) from Lattice Semiconductor Corporation, supplied in a 484-LFBGA surface-mount package. The device provides a high-count logic fabric with a substantial on-chip memory footprint and a large I/O complement, targeting commercial-grade, reconfigurable digital designs.
Key device attributes include 96,000 logic elements, approximately 3.83 Mbits of embedded memory, and 313 I/O pins, with a single-core supply range of 0.95 V to 1.05 V and an operating temperature range of 0 °C to 85 °C.
Key Features
- Core Logic 96,000 logic elements and 24,000 CLBs provide ample capacity for complex, user-defined digital logic and custom accelerators.
- Embedded Memory Approximately 3.83 Mbits of on-chip RAM to support buffering, state machines, and data-path storage without external memory in many designs.
- I/O Density 313 I/O pins enable wide bus interfaces and connectivity to multiple peripherals or high-channel-count systems.
- Power Core voltage supply range from 0.95 V to 1.05 V to match system power rails and support predictable power budgeting.
- Package & Mounting 484-LFBGA package (supplier device package: 484-CABGA, 19×19) in a surface-mount form factor for compact board integration.
- Operating Range Commercial-grade operating temperature from 0 °C to 85 °C, suitable for standard commercial electronic environments.
- Compliance RoHS compliant for regulatory and manufacturing process alignment.
Typical Applications
- Commercial Embedded Systems — Implement custom digital functions and control logic where a commercial-grade FPGA with significant logic and memory resources is required.
- High‑Density I/O Interfaces — Support designs that need many external connections or wide parallel buses using the device’s 313 I/O pins.
- On‑Chip Data Processing — Use the approximately 3.83 Mbits of embedded memory for buffering, packet processing, or intermediate storage in data-path applications.
Unique Advantages
- High Logic Capacity: 96,000 logic elements and 24,000 CLBs enable implementation of sizable custom logic blocks and parallel processing engines.
- Substantial Embedded Memory: Approximately 3.83 Mbits of on-chip RAM reduces dependence on external memory components and simplifies board-level design.
- Large I/O Count: 313 I/Os provide flexibility for interfacing to multiple peripherals, sensors, or parallel interfaces without external multiplexing.
- Compact BGA Packaging: 484-LFBGA (484-CABGA, 19×19) delivers a space-efficient footprint for dense board layouts.
- Commercial Temperature Suitability: Rated for 0 °C to 85 °C, appropriate for standard commercial electronic products and deployments.
- Regulatory Compliance: RoHS compliance supports modern manufacturing and environmental requirements.
Why Choose LFCPNX-100-7BBG484C?
The LFCPNX-100-7BBG484C positions itself as a commercially graded, high-capacity FPGA option for designs that require significant logic, on-chip memory, and a large number of I/Os in a compact BGA package. Its combination of 96,000 logic elements, approximately 3.83 Mbits of embedded RAM, and 313 I/Os offers designers the integration needed to consolidate functions and streamline board-level architectures.
This device is suited to engineers and teams building commercial embedded systems and I/O-dense applications that benefit from reprogrammable logic, on-chip memory resources, and compact surface-mount packaging, while maintaining RoHS compliance and operating across standard commercial temperature ranges.
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