LFCPNX-100-7BFG484I
| Part Description |
CertusPro™-NX Field Programmable Gate Array (FPGA) IC 309 3833856 96000 484-BBGA |
|---|---|
| Quantity | 1,006 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 309 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24000 | Number of Logic Elements/Cells | 96000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFCPNX-100-7BFG484I – CertusPro™-NX FPGA, 96,000 Logic Elements, 309 I/O
The LFCPNX-100-7BFG484I is a CertusPro™-NX field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a high logic capacity and significant embedded memory in a compact 484-BBGA package for designs that require substantial on-chip logic, I/O density and industrial temperature operation.
Key device attributes include 96,000 logic elements, approximately 3.83 Mbits of embedded RAM, 309 general-purpose I/O pins, a low-voltage core supply range (950 mV to 1.05 V), and an industrial operating temperature range of -40 °C to 100 °C.
Key Features
- Core Logic Up to 96,000 logic elements for implementing complex combinational and sequential logic functions.
- Embedded Memory Approximately 3.83 Mbits of on-chip RAM for buffering, state storage, and local data handling without external memory.
- I/O Capacity 309 available I/O pins to support high-density interfacing and multiple peripheral connections.
- Power Core voltage supply range of 950 mV to 1.05 V to match low-voltage system requirements.
- Package & Mounting 484-FPBGA (23 × 23) / 484-BBGA package in a surface-mount form factor for compact board integration.
- Industrial Grade & Temperature Range Rated for industrial operation from -40 °C to 100 °C for reliable performance in demanding environments.
- Regulatory Compliance RoHS compliant to support lead-free assembly and regulatory requirements.
Typical Applications
- Industrial Control Systems Leverages industrial temperature rating and high logic density for control, sequencing, and sensor interfacing in factory automation and process control.
- High-Density I/O Systems 309 I/O pins accommodate designs that require multiple parallel interfaces, protocol bridging, or large sensor arrays.
- On-Chip Buffering and State Machines Approximately 3.83 Mbits of embedded RAM supports local buffering and state storage for deterministic embedded logic.
- Compact Board Designs The 484-BBGA surface-mount package enables dense, space-efficient PCB layouts for constrained form factors.
Unique Advantages
- High Logic Capacity: 96,000 logic elements provide room for complex custom logic and multiple consolidated functions on a single device, reducing external component count.
- Substantial On-Chip Memory: Approximately 3.83 Mbits of embedded RAM minimizes dependency on external memory for buffering and state retention, simplifying system design.
- Extensive I/O Count: 309 I/O pins support broad connectivity needs, enabling multiple interfaces and parallel data paths without additional IO expanders.
- Industrial Temperature Operation: Rated from -40 °C to 100 °C for dependable operation in harsher environments and extended temperature ranges.
- Compact, Surface-Mount Package: 484-FPBGA (23 × 23) offers a high-density package option suitable for compact PCB layouts.
- RoHS Compliant: Supports lead-free manufacturing and regulatory requirements for modern electronics production.
Why Choose LFCPNX-100-7BFG484I?
The LFCPNX-100-7BFG484I positions itself as a high-capacity, industrial-grade FPGA option for engineers needing substantial on-chip logic, embedded RAM, and a large number of I/O in a compact package. Its combination of 96,000 logic elements, approximately 3.83 Mbits of embedded memory, and 309 I/O pins makes it suitable for designs that consolidate multiple functions onto a single programmable device while meeting industrial temperature requirements.
Designed and manufactured by Lattice Semiconductor Corporation, this FPGA offers a balance of integration, I/O density, and ruggedized operating range for long-term deployment in industrial and high-density application scenarios.
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