LFCPNX-100-7LFG672C

IC FPGA CERTUSPRO-NX 672BGA
Part Description

CertusPro™-NX Field Programmable Gate Array (FPGA) IC 313 3833856 96000 672-BBGA

Quantity 1,186 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package672-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O313Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24000Number of Logic Elements/Cells96000
Number of GatesN/AECCNN/AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3833856

Overview of LFCPNX-100-7LFG672C – CertusPro™-NX FPGA, 672-BBGA, 96,000 logic elements

The LFCPNX-100-7LFG672C is a CertusPro™-NX Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a high logic capacity FPGA organized for designs that require substantial programmable logic combined with a large number of I/O connections.

Key on-chip resources include 96,000 logic elements and approximately 3.83 Mbits of embedded memory, paired with 313 user I/Os and a low-voltage core supply range, providing a balance of integration and power efficiency for commercial-grade electronic designs.

Key Features

  • Core Logic 96,000 logic elements provide extensive programmable logic capacity to implement complex digital functions and custom accelerators.
  • Embedded Memory Approximately 3.83 Mbits of on-chip RAM suitable for buffering, state storage, and local data structures.
  • I/O Density 313 user I/Os allow high connectivity for peripheral interfaces, sensor networks, and multi-channel data paths.
  • Power Core supply range from 950 mV to 1.05 V supports low-voltage operation and power-sensitive designs.
  • Package & Mounting 672-ball BGA package (listed as 672-BBGA) and supplier device package 672-FCBGA (27×27) in a surface-mount format for compact board-level integration.
  • Operating Conditions Commercial grade device rated for 0 °C to 85 °C operating temperature.
  • Compliance RoHS compliant for regulatory and environmental considerations.

Typical Applications

  • High-density I/O systems Leverage 313 I/Os for interfacing multiple sensors, transceivers, or parallel data channels on a single FPGA.
  • Embedded logic and control Use the 96,000 logic elements to implement state machines, signal processing blocks, and control logic within compact commercial products.
  • On-chip buffering and data handling Approximately 3.83 Mbits of embedded RAM enable local buffering, FIFOs, and small data stores to reduce external memory dependence.
  • Compact board-level implementations The 672-ball BGA (27×27 FCBGA) surface-mount package supports dense PCB layouts where board space is constrained.

Unique Advantages

  • High logic capacity: 96,000 logic elements provide ample resources to consolidate multiple functions into a single FPGA, reducing part count.
  • Significant embedded memory: Approximately 3.83 Mbits of on-chip RAM supports data buffering and state retention without immediate need for external RAM.
  • Large I/O complement: 313 I/Os enable flexible interfacing to a wide range of peripherals and high-channel-count applications.
  • Low-voltage core operation: 950 mV to 1.05 V supply range helps optimize power consumption for energy-conscious designs.
  • Space-efficient packaging: 672-ball BGA / 672-FCBGA (27×27) in a surface-mount form factor allows dense PCB integration in commercial products.
  • RoHS compliant: Meets lead-free and environmental requirements for commercial manufacturing.

Why Choose LFCPNX-100-7LFG672C?

The LFCPNX-100-7LFG672C positions itself as a high-capacity, I/O-rich FPGA option for commercial designs that need substantial programmable logic, embedded memory, and dense connectivity in a compact package. Its combination of 96,000 logic elements, approximately 3.83 Mbits of on-chip RAM, and 313 I/Os makes it suitable for consolidating complex digital functions while preserving board area.

Designed and manufactured by Lattice Semiconductor Corporation, this CertusPro™-NX device offers a balanced set of resources and a low-voltage core that can help simplify system architecture and enable scalable designs within the commercial temperature range.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the LFCPNX-100-7LFG672C.

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