LFCPNX-100-8ASG256I

The LFCPNX-100-8ASG256I is a CertusPro™-NX field programmable gate array (FPGA) IC. It integrates a mid-to-high logic capacity fabric with embedded memory and a high I/O count in a compact surface-mount package, and is offered in an industrial grade variant.

Key on-chip resources include 96,000 logic elements, approximately 3.83 Mbits of embedded RAM, and 169 user I/O, making this device suitable for industrial designs that require programmable logic, significant memory resources, and broad interfacing capability.

Key Features

• Core / Logic Delivers 96,000 logic elements to implement custom combinational and sequential logic functions.
• Embedded Memory Contains approximately 3.83 Mbits of on-chip RAM for buffering, state storage, and small-data working sets.
• I/O Density Provides 169 user I/O pins to support multiple parallel interfaces and signal connections in compact designs.
• Power Operates from a core supply in the range of 0.950 V to 1.05 V, enabling tightly controlled power delivery for the device core.
• Package & Mounting Supplied in a 256-LBGA package; supplier device package is listed as 256-SBGA (27×27). Surface-mount mounting type supports standard PCB assembly processes.
• Temperature & Grade Industrial-grade device with an operating temperature range of −40°C to 100°C for extended environmental coverage.
• Environmental Compliance RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

• Industrial Control and Automation Industrial-grade temperature range and a high I/O count support control logic, sensor interfacing, and machine automation tasks.
• Embedded Logic and Acceleration The combination of 96,000 logic elements and embedded RAM enables implementation of custom processing blocks and hardware acceleration functions.
• High-Density I/O Interfaces With 169 user I/O, the device is suitable for designs requiring multiple parallel interfaces or expanded peripheral connectivity in a compact form factor.

Unique Advantages

• Substantial Logic Capacity: 96,000 logic elements provide headroom for complex logic implementations and multi-function designs.
• Significant On-Chip Memory: Approximately 3.83 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage tasks.
• High I/O Count: 169 user I/O simplifies integration with sensors, peripherals, and external interfaces without extensive external glue logic.
• Industrial Reliability: Rated for −40°C to 100°C operation and specified as industrial grade for deployments requiring extended temperature range.
• Compact Surface-Mount Package: 256-LBGA (supplier listing 256-SBGA, 27×27) enables dense PCB layouts while maintaining robust connectivity.
• Regulatory Compliance: RoHS compliant to support lead-free product builds and regulatory requirements.

Why Choose LFCPNX-100-8ASG256I?

The LFCPNX-100-8ASG256I positions a high logic element count, meaningful embedded memory, and a broad I/O complement into a compact industrial-grade package. This combination supports mid-to-high complexity programmable designs that require both on-chip resources and environmental robustness.

Design teams targeting industrial applications or other environments needing extended temperature operation can leverage this device to consolidate functionality, reduce external components, and maintain a compact board footprint while meeting regulatory and manufacturing requirements.

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