LFCPNX-100-7LFG672I

IC FPGA CERTUSPRO-NX 672BGA
Part Description

CertusPro™-NX Field Programmable Gate Array (FPGA) IC 313 3833856 96000 672-BBGA

Quantity 184 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package672-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGANumber of I/O313Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs24000Number of Logic Elements/Cells96000
Number of GatesN/AECCNN/AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3833856

Overview of LFCPNX-100-7LFG672I – CertusPro™-NX Field Programmable Gate Array (FPGA) IC 313 3833856 96000 672-BBGA

The LFCPNX-100-7LFG672I is a CertusPro™-NX Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It delivers a high-capacity, reconfigurable logic fabric with substantial embedded memory and a large I/O complement for industrial embedded designs.

Designed for industrial-grade applications, the device combines 96,000 logic elements, approximately 3.83 Mbits of on-chip RAM, and up to 313 I/O pins in a 672-ball BGA package, enabling compact, high-density system designs that require configurable logic and extensive interfacing.

Key Features

  • Core Logic 96,000 logic elements provide a large programmable fabric for complex custom logic, datapath acceleration, and glue-logic consolidation.
  • Embedded Memory Approximately 3.83 Mbits of on-chip RAM to support packet buffering, lookup tables, and intermediate data storage without external memory for many designs.
  • I/O Capacity Up to 313 I/O pins to accommodate broad sensor, peripheral, and high-density board interfaces.
  • Power Core voltage supply range of 0.95 V to 1.05 V allowing integration into systems with defined low-voltage power rails.
  • Package and Mounting 672-ball BGA package (Supplier device package: 672-FCBGA 27×27) in a surface-mount format for compact, high-pin-count board designs.
  • Industrial Reliability Rated for industrial operation with an operating temperature range of −40 °C to 100 °C, suitable for many harsh-environment embedded applications.
  • RoHS Compliance RoHS-compliant manufacturing to meet environmental and regulatory requirements for electronic assemblies.

Typical Applications

  • Industrial Control Systems — Reconfigurable logic and extensive I/O enable motor control, PLC interfacing, and deterministic I/O handling in industrial automation.
  • Embedded Networking and Communications — On-chip memory and high I/O count support packet buffering and protocol interfacing for embedded networking endpoints.
  • Sensor Aggregation and Preprocessing — Combine multiple sensor inputs and perform real-time preprocessing or data reduction using the device's logic and memory resources.

Unique Advantages

  • High Logic Density: 96,000 logic elements provide capacity to implement complex logic functions and reduce reliance on external ASICs or discrete logic.
  • Integrated Memory: Approximately 3.83 Mbits of embedded RAM lowers external memory needs for many buffering and stateful functions.
  • Extensive I/O: Up to 313 I/Os simplify board-level routing and enable direct connections to a wide range of peripherals and sensors.
  • Industrial Temperature Range: Rated operation from −40 °C to 100 °C supports deployment in demanding environments.
  • Compact, High-Pin-Count Package: 672-ball BGA (672-FCBGA, 27×27) enables a small PCB footprint while preserving high connectivity.
  • Standards-Aligned Manufacturing: RoHS compliance supports environmentally conscious product builds and regulatory alignment.

Why Choose LFCPNX-100-7LFG672I?

The LFCPNX-100-7LFG672I positions itself as a scalable, industrial-grade FPGA option for engineers needing substantial logic capacity, embedded RAM, and a large number of I/Os in a compact BGA package. Its specifications support demanding embedded designs where configurability, integration, and reliable operation across −40 °C to 100 °C are required.

Backed by Lattice Semiconductor Corporation, this CertusPro™-NX device is suitable for teams building industrial control, embedded networking, and sensor-preprocessing systems that benefit from on-chip resources and a high-density pinout for streamlined board design and BOM reduction.

Request a quote for LFCPNX-100-7LFG672I to discuss availability and pricing for your design and procurement needs.

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