LFCPNX-100-7LFG672I
| Part Description |
CertusPro™-NX Field Programmable Gate Array (FPGA) IC 313 3833856 96000 672-BBGA |
|---|---|
| Quantity | 184 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 313 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 24000 | Number of Logic Elements/Cells | 96000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFCPNX-100-7LFG672I – CertusPro™-NX Field Programmable Gate Array (FPGA) IC 313 3833856 96000 672-BBGA
The LFCPNX-100-7LFG672I is a CertusPro™-NX Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It delivers a high-capacity, reconfigurable logic fabric with substantial embedded memory and a large I/O complement for industrial embedded designs.
Designed for industrial-grade applications, the device combines 96,000 logic elements, approximately 3.83 Mbits of on-chip RAM, and up to 313 I/O pins in a 672-ball BGA package, enabling compact, high-density system designs that require configurable logic and extensive interfacing.
Key Features
- Core Logic 96,000 logic elements provide a large programmable fabric for complex custom logic, datapath acceleration, and glue-logic consolidation.
- Embedded Memory Approximately 3.83 Mbits of on-chip RAM to support packet buffering, lookup tables, and intermediate data storage without external memory for many designs.
- I/O Capacity Up to 313 I/O pins to accommodate broad sensor, peripheral, and high-density board interfaces.
- Power Core voltage supply range of 0.95 V to 1.05 V allowing integration into systems with defined low-voltage power rails.
- Package and Mounting 672-ball BGA package (Supplier device package: 672-FCBGA 27×27) in a surface-mount format for compact, high-pin-count board designs.
- Industrial Reliability Rated for industrial operation with an operating temperature range of −40 °C to 100 °C, suitable for many harsh-environment embedded applications.
- RoHS Compliance RoHS-compliant manufacturing to meet environmental and regulatory requirements for electronic assemblies.
Typical Applications
- Industrial Control Systems — Reconfigurable logic and extensive I/O enable motor control, PLC interfacing, and deterministic I/O handling in industrial automation.
- Embedded Networking and Communications — On-chip memory and high I/O count support packet buffering and protocol interfacing for embedded networking endpoints.
- Sensor Aggregation and Preprocessing — Combine multiple sensor inputs and perform real-time preprocessing or data reduction using the device's logic and memory resources.
Unique Advantages
- High Logic Density: 96,000 logic elements provide capacity to implement complex logic functions and reduce reliance on external ASICs or discrete logic.
- Integrated Memory: Approximately 3.83 Mbits of embedded RAM lowers external memory needs for many buffering and stateful functions.
- Extensive I/O: Up to 313 I/Os simplify board-level routing and enable direct connections to a wide range of peripherals and sensors.
- Industrial Temperature Range: Rated operation from −40 °C to 100 °C supports deployment in demanding environments.
- Compact, High-Pin-Count Package: 672-ball BGA (672-FCBGA, 27×27) enables a small PCB footprint while preserving high connectivity.
- Standards-Aligned Manufacturing: RoHS compliance supports environmentally conscious product builds and regulatory alignment.
Why Choose LFCPNX-100-7LFG672I?
The LFCPNX-100-7LFG672I positions itself as a scalable, industrial-grade FPGA option for engineers needing substantial logic capacity, embedded RAM, and a large number of I/Os in a compact BGA package. Its specifications support demanding embedded designs where configurability, integration, and reliable operation across −40 °C to 100 °C are required.
Backed by Lattice Semiconductor Corporation, this CertusPro™-NX device is suitable for teams building industrial control, embedded networking, and sensor-preprocessing systems that benefit from on-chip resources and a high-density pinout for streamlined board design and BOM reduction.
Request a quote for LFCPNX-100-7LFG672I to discuss availability and pricing for your design and procurement needs.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016