LFCPNX-100-8ASG256C

IC FPGA CERTUSPRO-NX 256WLP
Part Description

CertusPro™-NX Field Programmable Gate Array (FPGA) IC 169 3833856 96000 256-LBGA

Quantity 1,561 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-SBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O169Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24000Number of Logic Elements/Cells96000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits3833856

Overview of LFCPNX-100-8ASG256C – CertusPro™-NX FPGA, 96,000 Logic Elements, 169 I/O, 256-LBGA

The LFCPNX-100-8ASG256C is a CertusPro™-NX field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation designed for commercial electronic products requiring substantial programmable logic capacity. It combines a high logic element count, embedded RAM, and a 169-pin I/O complement in a compact 256-LBGA package, with a core supply range optimized for low-voltage systems.

Key Features

  • Logic Capacity — 96,000 logic elements provide extensive programmable fabric for complex logic, glue logic, and custom accelerators.
  • Embedded Memory — Approximately 3.83 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate storage without external memory.
  • I/O Resources — 169 available I/O pins to support multi-channel connectivity and interfacing with peripherals and subsystems.
  • Power and Core Voltage — Operates from a core voltage range of 0.95 V to 1.05 V, suitable for low-voltage digital designs.
  • Package and Mounting — Available in a 256-LBGA (supplier package: 256-SBGA, 27×27) surface-mount package for compact board layouts.
  • Operating Range and Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C to match commercial electronics environments.
  • Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

  • Commercial Embedded Systems — Custom control, protocol bridging, and glue-logic functions where on-chip logic density and moderate I/O are required.
  • Communications and Networking Equipment — Implement protocol handling, packet processing building blocks, and interface adaptation using available logic and memory.
  • Video and Imaging Processing — On-chip RAM and high logic capacity support buffering and custom processing pipelines in commercial video products.
  • Prototyping and Product Development — Use as a programmable platform for validating custom algorithms and integrating multiple I/O subsystems in a compact package.

Unique Advantages

  • Substantial Logic Density: 96,000 logic elements enable complex, multi-function designs without immediately requiring higher-tier devices.
  • On-Chip Memory: Approximately 3.83 Mbits of embedded RAM reduces dependence on external memory for common buffering and LUT needs.
  • Flexible I/O Count: 169 I/O pins allow broad interfacing options for sensors, peripherals, and system buses.
  • Compact, Surface-Mount Package: 256-LBGA (256-SBGA, 27×27) supports dense PCB integration and space-constrained commercial designs.
  • Low-Voltage Core Support: Core supply between 0.95 V and 1.05 V aligns with modern low-voltage digital platforms, aiding power-sensitive designs.
  • Commercial Temperature and RoHS Compliance: 0 °C to 85 °C operating range and RoHS compliance simplify qualification for commercial products.

Why Choose LFCPNX-100-8ASG256C?

The LFCPNX-100-8ASG256C balances high programmable logic capacity with significant on-chip memory and a versatile I/O complement in a compact 256-LBGA package. Its commercial-grade operating range and RoHS compliance make it suitable for a wide range of commercial electronic designs that need scalable, reconfigurable logic without excessive board area.

This device is appropriate for engineering teams building commercial embedded systems, communication equipment, imaging products, or development platforms that require a combination of logic density, memory, and I/O in a surface-mount solution. Its voltage and temperature specifications support integration into contemporary low-voltage commercial systems while preserving design flexibility.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for LFCPNX-100-8ASG256C.

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