LFCPNX-100-8BBG484I
| Part Description |
CertusPro™-NX Field Programmable Gate Array (FPGA) IC 313 3833856 96000 484-LFBGA |
|---|---|
| Quantity | 580 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-CABGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-LFBGA | Number of I/O | 313 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24000 | Number of Logic Elements/Cells | 96000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFCPNX-100-8BBG484I – CertusPro™-NX Field Programmable Gate Array, 313 I/O, 484-LFBGA
The LFCPNX-100-8BBG484I is a CertusPro™-NX Field Programmable Gate Array (FPGA) designed for industrial-grade embedded designs requiring substantial logic capacity and I/O integration. This device provides 96,000 logic elements and approximately 3.83 Mbits of on-chip RAM, making it suitable for complex control, interfacing, and processing tasks.
With a 313-pin I/O count, a compact 484-LFBGA package (484-CABGA, 19×19), and an industrial operating range from −40 °C to 100 °C, the part targets systems that need high integration, predictable power rails (0.95–1.05 V core supply), and RoHS-compliant assembly.
Key Features
- Core Capacity 96,000 logic elements provide substantial programmable logic resources for implementing custom digital functions, state machines, and moderate-scale datapaths.
- Embedded Memory Approximately 3.83 Mbits of on-chip RAM supports buffering, FIFOs, and on-chip data storage for latency-sensitive tasks.
- I/O Density 313 user I/Os allow flexible interfacing to peripherals, sensors, and external devices without requiring large external glue logic.
- Power Core supply range of 0.95 V to 1.05 V enables integration into systems with precise power sequencing and low-voltage domains.
- Package & Mounting 484-LFBGA (484-CABGA, 19×19) in a surface-mount format provides a compact footprint for board-level integration.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet the thermal requirements of industrial applications.
- Regulatory RoHS compliant for environmentally conscious manufacturing and global supply-chain requirements.
Typical Applications
- Industrial Control and Automation Leverages high logic capacity, abundant I/Os, and industrial temperature rating for motor control, PLC functions, and factory automation interfaces.
- Communications and Networking Provides programmable logic and on-chip RAM for protocol processing, packet handling, and custom interface bridging where many I/Os are required.
- Test & Measurement Supports data aggregation, timing logic, and front-end interfacing in instrumentation equipment that benefits from embedded memory and flexible I/O.
- Prototyping and Custom Embedded Systems Offers a high logic element count and substantial I/O for developing and validating custom digital accelerators and system prototypes.
Unique Advantages
- High Logic Density: 96,000 logic elements enable implementation of complex logic functions without splitting designs across multiple devices, reducing system complexity.
- Significant On-Chip Memory: Approximately 3.83 Mbits of embedded RAM minimizes external memory requirements for buffering and temporary storage, simplifying BOM and layout.
- Generous I/O Count: 313 I/Os support direct connection to a wide range of peripherals and interfaces, reducing the need for additional interface chips.
- Industrial Reliability: Rated for −40 °C to 100 °C operation to meet environmental demands of industrial deployments.
- Compact Ball Grid Package: The 484-LFBGA (19×19) package delivers a compact, surface-mount footprint that eases board-level integration in space-constrained designs.
- RoHS Compliant: Facilitates adherence to environmental regulations and responsible manufacturing practices.
Why Choose LFCPNX-100-8BBG484I?
The LFCPNX-100-8BBG484I positions itself as a robust, industrial-grade FPGA option when substantial logic resources, embedded memory, and a high I/O count are required in a compact package. Its core supply range and surface-mount 484-LFBGA footprint support modern low-voltage system architectures and dense PCB layouts.
This device is well suited for engineers and procurement teams building industrial control, communications, test equipment, or custom embedded systems that value integration, thermal resilience, and reduced external component count. The combination of logic capacity, on-chip RAM, and I/O density delivers long-term design flexibility and scalability within the CertusPro™-NX FPGA family approach.
Request a quote or submit your requirements today to discuss availability and pricing for the LFCPNX-100-8BBG484I.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016